SG10201803285XA - Plasma processing apparatus - Google Patents

Plasma processing apparatus

Info

Publication number
SG10201803285XA
SG10201803285XA SG10201803285XA SG10201803285XA SG10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA
Authority
SG
Singapore
Prior art keywords
processing apparatus
plasma processing
mounting table
mounting
elevation mechanism
Prior art date
Application number
SG10201803285XA
Other languages
English (en)
Inventor
Ueda Takehiro
Electron Limited Tokyo
Nagai Kenji
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201803285XA publication Critical patent/SG10201803285XA/en

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG10201803285XA 2017-04-26 2018-04-19 Plasma processing apparatus SG10201803285XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017087052 2017-04-26
JP2018000367A JP7033926B2 (ja) 2017-04-26 2018-01-05 プラズマ処理装置

Publications (1)

Publication Number Publication Date
SG10201803285XA true SG10201803285XA (en) 2018-11-29

Family

ID=64355140

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201803285XA SG10201803285XA (en) 2017-04-26 2018-04-19 Plasma processing apparatus

Country Status (3)

Country Link
JP (1) JP7033926B2 (ja)
SG (1) SG10201803285XA (ja)
TW (1) TWI797119B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10784089B2 (en) * 2019-02-01 2020-09-22 Applied Materials, Inc. Temperature and bias control of edge ring
JP7186646B2 (ja) * 2019-03-22 2022-12-09 東京エレクトロン株式会社 基板処理装置および載置台上のフォーカスリングの有無の検知方法
KR102228545B1 (ko) * 2019-04-03 2021-03-16 주식회사 테스 기판처리장치
KR102477910B1 (ko) * 2019-07-02 2022-12-16 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7321026B2 (ja) * 2019-08-02 2023-08-04 東京エレクトロン株式会社 エッジリング、載置台、基板処理装置及び基板処理方法
US11551916B2 (en) 2020-03-20 2023-01-10 Applied Materials, Inc. Sheath and temperature control of a process kit in a substrate processing chamber
CN113838732B (zh) * 2020-06-08 2023-10-31 中微半导体设备(上海)股份有限公司 一种聚焦环升降机构、安装方法及等离子体处理装置
US11721569B2 (en) * 2021-06-18 2023-08-08 Applied Materials, Inc. Method and apparatus for determining a position of a ring within a process kit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230239A (ja) * 2000-02-15 2001-08-24 Tokyo Electron Ltd 処理装置及び処理方法
JP3388228B2 (ja) * 2000-12-07 2003-03-17 株式会社半導体先端テクノロジーズ プラズマエッチング装置、及びプラズマエッチング方法
JP4596883B2 (ja) * 2004-10-28 2010-12-15 京セラ株式会社 環状ヒータ
JP2006173223A (ja) * 2004-12-14 2006-06-29 Toshiba Corp プラズマエッチング装置およびそれを用いたプラズマエッチング方法
US7544270B2 (en) * 2005-11-14 2009-06-09 Infineon Technologies Ag Apparatus for processing a substrate
JP2011210853A (ja) * 2010-03-29 2011-10-20 Tokyo Electron Ltd 消耗量測定方法
JP5584517B2 (ja) * 2010-05-12 2014-09-03 東京エレクトロン株式会社 プラズマ処理装置及び半導体装置の製造方法
SG11201402447TA (en) * 2011-11-24 2014-06-27 Lam Res Corp Plasma processing chamber with flexible symmetric rf return strap
JP6080571B2 (ja) * 2013-01-31 2017-02-15 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP6689020B2 (ja) * 2013-08-21 2020-04-28 東京エレクトロン株式会社 プラズマ処理装置
CN105575863B (zh) * 2014-11-10 2019-02-22 中微半导体设备(上海)有限公司 等离子体处理装置、基片卸载装置及方法
KR20170014384A (ko) * 2015-07-30 2017-02-08 삼성전자주식회사 건식 식각장치
JP6541565B2 (ja) * 2015-09-25 2019-07-10 東京エレクトロン株式会社 載置台及びプラズマ処理装置

Also Published As

Publication number Publication date
TW201842578A (zh) 2018-12-01
JP2018186263A (ja) 2018-11-22
TWI797119B (zh) 2023-04-01
JP7033926B2 (ja) 2022-03-11

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