SG10201803285XA - Plasma processing apparatus - Google Patents
Plasma processing apparatusInfo
- Publication number
- SG10201803285XA SG10201803285XA SG10201803285XA SG10201803285XA SG10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- plasma processing
- mounting table
- mounting
- elevation mechanism
- Prior art date
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017087052 | 2017-04-26 | ||
JP2018000367A JP7033926B2 (ja) | 2017-04-26 | 2018-01-05 | プラズマ処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201803285XA true SG10201803285XA (en) | 2018-11-29 |
Family
ID=64355140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803285XA SG10201803285XA (en) | 2017-04-26 | 2018-04-19 | Plasma processing apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7033926B2 (ja) |
SG (1) | SG10201803285XA (ja) |
TW (1) | TWI797119B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10784089B2 (en) * | 2019-02-01 | 2020-09-22 | Applied Materials, Inc. | Temperature and bias control of edge ring |
JP7186646B2 (ja) * | 2019-03-22 | 2022-12-09 | 東京エレクトロン株式会社 | 基板処理装置および載置台上のフォーカスリングの有無の検知方法 |
KR102228545B1 (ko) * | 2019-04-03 | 2021-03-16 | 주식회사 테스 | 기판처리장치 |
KR102477910B1 (ko) * | 2019-07-02 | 2022-12-16 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP7321026B2 (ja) * | 2019-08-02 | 2023-08-04 | 東京エレクトロン株式会社 | エッジリング、載置台、基板処理装置及び基板処理方法 |
US11551916B2 (en) | 2020-03-20 | 2023-01-10 | Applied Materials, Inc. | Sheath and temperature control of a process kit in a substrate processing chamber |
CN113838732B (zh) * | 2020-06-08 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | 一种聚焦环升降机构、安装方法及等离子体处理装置 |
US11721569B2 (en) * | 2021-06-18 | 2023-08-08 | Applied Materials, Inc. | Method and apparatus for determining a position of a ring within a process kit |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230239A (ja) * | 2000-02-15 | 2001-08-24 | Tokyo Electron Ltd | 処理装置及び処理方法 |
JP3388228B2 (ja) * | 2000-12-07 | 2003-03-17 | 株式会社半導体先端テクノロジーズ | プラズマエッチング装置、及びプラズマエッチング方法 |
JP4596883B2 (ja) * | 2004-10-28 | 2010-12-15 | 京セラ株式会社 | 環状ヒータ |
JP2006173223A (ja) * | 2004-12-14 | 2006-06-29 | Toshiba Corp | プラズマエッチング装置およびそれを用いたプラズマエッチング方法 |
US7544270B2 (en) * | 2005-11-14 | 2009-06-09 | Infineon Technologies Ag | Apparatus for processing a substrate |
JP2011210853A (ja) * | 2010-03-29 | 2011-10-20 | Tokyo Electron Ltd | 消耗量測定方法 |
JP5584517B2 (ja) * | 2010-05-12 | 2014-09-03 | 東京エレクトロン株式会社 | プラズマ処理装置及び半導体装置の製造方法 |
SG11201402447TA (en) * | 2011-11-24 | 2014-06-27 | Lam Res Corp | Plasma processing chamber with flexible symmetric rf return strap |
JP6080571B2 (ja) * | 2013-01-31 | 2017-02-15 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
JP6689020B2 (ja) * | 2013-08-21 | 2020-04-28 | 東京エレクトロン株式会社 | プラズマ処理装置 |
CN105575863B (zh) * | 2014-11-10 | 2019-02-22 | 中微半导体设备(上海)有限公司 | 等离子体处理装置、基片卸载装置及方法 |
KR20170014384A (ko) * | 2015-07-30 | 2017-02-08 | 삼성전자주식회사 | 건식 식각장치 |
JP6541565B2 (ja) * | 2015-09-25 | 2019-07-10 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
-
2018
- 2018-01-05 JP JP2018000367A patent/JP7033926B2/ja active Active
- 2018-04-19 SG SG10201803285XA patent/SG10201803285XA/en unknown
- 2018-04-20 TW TW107113489A patent/TWI797119B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201842578A (zh) | 2018-12-01 |
JP2018186263A (ja) | 2018-11-22 |
TWI797119B (zh) | 2023-04-01 |
JP7033926B2 (ja) | 2022-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201803285XA (en) | Plasma processing apparatus | |
WO2017030622A3 (en) | Lightweight cryptographic engine | |
MX2020004287A (es) | Procesamiento de biomasa. | |
MX364256B (es) | Plataforma de traslación de soldadura automática.. | |
MX2020010379A (es) | Sistemas y metodos de procesamiento. | |
MX2020006194A (es) | Sistemas y metodos para un electrodo de un arma de conduccion electrica. | |
TW201613029A (en) | Bearing apparatus and semiconductor processing device | |
EP2996087A3 (en) | Image processing method and electronic apparatus | |
MY190612A (en) | Plant monitoring apparatus | |
EP3774166A4 (en) | LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME | |
MX2022015754A (es) | Disposiciones, componentes y metodos de cajas. | |
SG11201912566WA (en) | Plasma processing apparatus | |
EP3746283A4 (en) | PROCESSING AN OBJECT REPRESENTATION | |
EP3472749A4 (en) | MAIN DEVICE, ACCESSORIES DEVICE AND METHOD FOR PROCESSING OPERATIONS ON THE MAIN DEVICE AND ACCESSORY DEVICE | |
SG11201912564VA (en) | Plasma processing apparatus | |
GB2580299B (en) | An alkali metal vapor enclosure | |
MY187768A (en) | Electronic simulation device for weapon | |
SG10201701124TA (en) | Substrate treating apparatus and substrate treating method | |
EP3695934A4 (en) | COOLANT TREATMENT DEVICE | |
SG11202104119PA (en) | Liner assembly, reaction chamber and semiconductor processing apparatus | |
SG11201909360PA (en) | Device for processing a liquid sample | |
GB2556675B (en) | Vapour chamber with ring geometry for cooling an electronic device | |
WO2015143397A3 (en) | Method for forming a metal strip and electrical wires | |
MY193608A (en) | Grill providing recycled condensate for heated apparatus | |
EP3875121A4 (en) | Gas processing device |