SG10201802538VA - Plate-shaped workpiece processing method - Google Patents
Plate-shaped workpiece processing methodInfo
- Publication number
- SG10201802538VA SG10201802538VA SG10201802538VA SG10201802538VA SG10201802538VA SG 10201802538V A SG10201802538V A SG 10201802538VA SG 10201802538V A SG10201802538V A SG 10201802538VA SG 10201802538V A SG10201802538V A SG 10201802538VA SG 10201802538V A SG10201802538V A SG 10201802538VA
- Authority
- SG
- Singapore
- Prior art keywords
- plate
- shaped workpiece
- cutting
- processing method
- division line
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
PLATE-SHAPED WORKPIECE PROCESSING METHOD Disclosed herein is a plate-shaped workpiece processing method for processing a plate-shaped workpiece having a division line and a metal member formed on the division line or in an area corresponding to the division line. The plate-shaped workpiece processing method includes a holding step of holding the plate-shaped workpiece on a chuck table in the condition where the metal member is oriented downward, a first cutting step of cutting the plate-shaped workpiece along the division line by using a first cutting blade after performing the holding step, thereby forming a first cut groove having a bottom not reaching the metal member, and a second cutting step of cutting the plate-shaped workpiece along the first cut groove by using a second cutting blade after performing the first cutting step, thereby forming a second cut groove fully cutting the plate-shaped workpiece along the division line so as to divide the metal member. The second cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the plate-shaped workpiece. (Figure 4B)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017074247A JP2018181900A (en) | 2017-04-04 | 2017-04-04 | Plate-like workpiece processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201802538VA true SG10201802538VA (en) | 2018-11-29 |
Family
ID=63525722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201802538VA SG10201802538VA (en) | 2017-04-04 | 2018-03-27 | Plate-shaped workpiece processing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US10665482B2 (en) |
JP (1) | JP2018181900A (en) |
KR (1) | KR20180112696A (en) |
CN (1) | CN108695247A (en) |
DE (1) | DE102018205031A1 (en) |
SG (1) | SG10201802538VA (en) |
TW (1) | TW201838013A (en) |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0574932A (en) * | 1991-09-17 | 1993-03-26 | Fujitsu Ltd | Dicing method for semiconductor wafer |
JPH06349926A (en) | 1993-06-12 | 1994-12-22 | Hitachi Ltd | Semiconductor device |
JPH0955573A (en) | 1995-08-10 | 1997-02-25 | Disco Abrasive Syst Ltd | Cutting method for resin board |
US6310017B1 (en) | 1999-02-01 | 2001-10-30 | Ct Associates, Inc. | Cleaner composition, method for making and using same |
JP3440888B2 (en) | 1999-06-21 | 2003-08-25 | 株式会社村田製作所 | Dicing blade and method for manufacturing electronic component |
US6280298B1 (en) | 1999-11-24 | 2001-08-28 | Intel Corporation | Test probe cleaning |
TWI228780B (en) * | 2000-05-11 | 2005-03-01 | Disco Corp | Semiconductor wafer dividing method |
JP2002231658A (en) * | 2001-01-30 | 2002-08-16 | Takemoto Denki Seisakusho:Kk | Method for cutting semiconductor wafer |
US6596562B1 (en) | 2002-01-03 | 2003-07-22 | Intel Corporation | Semiconductor wafer singulation method |
US6791197B1 (en) | 2002-08-26 | 2004-09-14 | Integrated Device Technology, Inc. | Reducing layer separation and cracking in semiconductor devices |
US7855130B2 (en) * | 2003-04-21 | 2010-12-21 | International Business Machines Corporation | Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations |
US7087452B2 (en) | 2003-04-22 | 2006-08-08 | Intel Corporation | Edge arrangements for integrated circuit chips |
JP4231349B2 (en) | 2003-07-02 | 2009-02-25 | 株式会社ディスコ | Laser processing method and laser processing apparatus |
JP2006140341A (en) | 2004-11-12 | 2006-06-01 | Disco Abrasive Syst Ltd | Dividing method of wafer |
JP4751634B2 (en) | 2005-03-31 | 2011-08-17 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
US20080191318A1 (en) | 2007-02-09 | 2008-08-14 | Advanced Micro Devices, Inc. | Semiconductor device and method of sawing semiconductor device |
US8629532B2 (en) | 2007-05-08 | 2014-01-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer with assisting dicing structure and dicing method thereof |
JP5419596B2 (en) | 2009-09-02 | 2014-02-19 | 兼房株式会社 | Fluid supply mechanism for rotating tools |
JP5480923B2 (en) | 2011-05-13 | 2014-04-23 | シャープ株式会社 | Semiconductor module manufacturing method and semiconductor module |
JP2013161998A (en) | 2012-02-07 | 2013-08-19 | Disco Abrasive Syst Ltd | Cutting method |
US8952413B2 (en) | 2012-03-08 | 2015-02-10 | Micron Technology, Inc. | Etched trenches in bond materials for die singulation, and associated systems and methods |
US8859397B2 (en) | 2012-07-13 | 2014-10-14 | Applied Materials, Inc. | Method of coating water soluble mask for laser scribing and plasma etch |
US9085049B2 (en) | 2012-11-30 | 2015-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for manufacturing semiconductor device |
US9054192B1 (en) * | 2013-12-20 | 2015-06-09 | International Business Machines Corporation | Integration of Ge-containing fins and compound semiconductor fins |
JP6274926B2 (en) * | 2014-03-17 | 2018-02-07 | 株式会社ディスコ | Cutting method |
US9275902B2 (en) | 2014-03-26 | 2016-03-01 | Applied Materials, Inc. | Dicing processes for thin wafers with bumps on wafer backside |
US9460963B2 (en) | 2014-03-26 | 2016-10-04 | Globalfoundries Inc. | Self-aligned contacts and methods of fabrication |
US9130057B1 (en) | 2014-06-30 | 2015-09-08 | Applied Materials, Inc. | Hybrid dicing process using a blade and laser |
JP6426407B2 (en) * | 2014-09-03 | 2018-11-21 | 株式会社ディスコ | Wafer processing method |
WO2016052444A1 (en) | 2014-09-29 | 2016-04-07 | リンテック株式会社 | Base for sheets for semiconductor wafer processing, sheet for semiconductor wafer processing, and method for manufacturing semiconductor device |
US10535554B2 (en) | 2016-12-14 | 2020-01-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor die having edge with multiple gradients and method for forming the same |
-
2017
- 2017-04-04 JP JP2017074247A patent/JP2018181900A/en active Pending
-
2018
- 2018-03-05 TW TW107107222A patent/TW201838013A/en unknown
- 2018-03-27 SG SG10201802538VA patent/SG10201802538VA/en unknown
- 2018-03-28 CN CN201810261934.9A patent/CN108695247A/en active Pending
- 2018-03-29 US US15/940,468 patent/US10665482B2/en active Active
- 2018-03-30 KR KR1020180037219A patent/KR20180112696A/en not_active Application Discontinuation
- 2018-04-04 DE DE102018205031.7A patent/DE102018205031A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN108695247A (en) | 2018-10-23 |
US10665482B2 (en) | 2020-05-26 |
DE102018205031A1 (en) | 2018-10-04 |
US20180286709A1 (en) | 2018-10-04 |
TW201838013A (en) | 2018-10-16 |
KR20180112696A (en) | 2018-10-12 |
JP2018181900A (en) | 2018-11-15 |
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