SG10201800716YA - Suction apparatus for an end effector, end effector for holding substratesand method of producing an end effector - Google Patents
Suction apparatus for an end effector, end effector for holding substratesand method of producing an end effectorInfo
- Publication number
- SG10201800716YA SG10201800716YA SG10201800716YA SG10201800716YA SG10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA SG 10201800716Y A SG10201800716Y A SG 10201800716YA
- Authority
- SG
- Singapore
- Prior art keywords
- end effector
- producing
- suction apparatus
- holding
- substratesand
- Prior art date
Links
- 239000012636 effector Substances 0.000 title abstract 9
- 238000000034 method Methods 0.000 title abstract 3
- 239000012530 fluid Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/007—Means or methods for designing or fabricating manipulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S901/00—Robots
- Y10S901/30—End effector
- Y10S901/40—Vacuum or mangetic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2018243A NL2018243B1 (en) | 2017-01-27 | 2017-01-27 | Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201800716YA true SG10201800716YA (en) | 2018-08-30 |
Family
ID=62843388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201800716YA SG10201800716YA (en) | 2017-01-27 | 2018-01-26 | Suction apparatus for an end effector, end effector for holding substratesand method of producing an end effector |
Country Status (9)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3657537A1 (en) * | 2018-11-23 | 2020-05-27 | ATOTECH Deutschland GmbH | End effector for slab formed substrates |
| US11276593B2 (en) | 2019-07-22 | 2022-03-15 | Rorze Automation, Inc. | Systems and methods for horizontal wafer packaging |
| PL3772089T3 (pl) | 2019-07-30 | 2021-10-25 | Semsysco Gmbh | Urządzenie do manipulowania podłożem do płytek półprzewodnikowych |
| US20230321758A1 (en) | 2022-03-25 | 2023-10-12 | Ii-Vi Delaware, Inc. | Laser-roughened reaction-bonded silicon carbide for wafer contact surface |
| EP4273911A1 (de) * | 2022-05-03 | 2023-11-08 | Werner Lieb GmbH | Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen |
| US12348002B2 (en) | 2022-05-31 | 2025-07-01 | Ii-Vi Delaware, Inc. | Current load-controlled laser driver |
| US12337467B2 (en) * | 2022-12-09 | 2025-06-24 | Formfactor, Inc. | Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4131267A (en) * | 1978-06-02 | 1978-12-26 | Disco Kabushiki Kaisha | Apparatus for holding workpiece by suction |
| JPH05267433A (ja) * | 1992-03-19 | 1993-10-15 | Nec Kyushu Ltd | 吸着パッド |
| US5226636A (en) * | 1992-06-10 | 1993-07-13 | International Business Machines Corporation | Holding fixture for substrates |
| JPH07273499A (ja) * | 1994-03-30 | 1995-10-20 | Matsushita Electric Ind Co Ltd | パネル保持装置 |
| JP3200285B2 (ja) * | 1994-06-29 | 2001-08-20 | キヤノン株式会社 | 基板搬送装置 |
| JP2002184835A (ja) | 2000-12-13 | 2002-06-28 | Ando Electric Co Ltd | 吸着パッド |
| US6942265B1 (en) * | 2002-10-23 | 2005-09-13 | Kla-Tencor Technologies Corporation | Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto |
| US20050110292A1 (en) * | 2002-11-26 | 2005-05-26 | Axcelis Technologies, Inc. | Ceramic end effector for micro circuit manufacturing |
| US7641247B2 (en) * | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
| EP1593465B1 (en) | 2003-01-29 | 2010-01-13 | Mitsuboshi Diamond Industrial Co., Ltd. | Vacuum suction head |
| US7055875B2 (en) * | 2003-07-11 | 2006-06-06 | Asyst Technologies, Inc. | Ultra low contact area end effector |
| MY157019A (en) * | 2009-03-31 | 2016-04-15 | Automation Tooling Syst | Vacuum gripper assembly |
| US8801069B2 (en) * | 2010-02-26 | 2014-08-12 | Brooks Automation, Inc. | Robot edge contact gripper |
| JP5345167B2 (ja) * | 2011-03-18 | 2013-11-20 | 東京エレクトロン株式会社 | 基板保持装置 |
| JP2014176914A (ja) | 2013-03-14 | 2014-09-25 | Nippon Electric Glass Co Ltd | 吸着パッド及び吸着装置 |
| JP5861677B2 (ja) * | 2013-07-08 | 2016-02-16 | 株式会社安川電機 | 吸着構造、ロボットハンドおよびロボット |
| US9991152B2 (en) * | 2014-03-06 | 2018-06-05 | Cascade Microtech, Inc. | Wafer-handling end effectors with wafer-contacting surfaces and sealing structures |
| NL2014625B1 (en) * | 2015-04-13 | 2017-01-06 | Suss Microtec Lithography Gmbh | Wafer treating device and sealing ring for a wafer treating device. |
-
2017
- 2017-01-27 NL NL2018243A patent/NL2018243B1/en active
-
2018
- 2018-01-16 DE DE102018100856.2A patent/DE102018100856A1/de active Pending
- 2018-01-19 US US15/875,713 patent/US10259124B2/en active Active
- 2018-01-22 TW TW107102181A patent/TWI710438B/zh active
- 2018-01-24 AT ATA50059/2018A patent/AT519587B1/de active
- 2018-01-26 JP JP2018011618A patent/JP2018157194A/ja active Pending
- 2018-01-26 SG SG10201800716YA patent/SG10201800716YA/en unknown
- 2018-01-26 KR KR1020180009854A patent/KR102344555B1/ko active Active
- 2018-01-29 CN CN201810084258.2A patent/CN108364903A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AT519587A3 (de) | 2020-02-15 |
| KR20180088598A (ko) | 2018-08-06 |
| DE102018100856A1 (de) | 2018-08-02 |
| US10259124B2 (en) | 2019-04-16 |
| US20180215049A1 (en) | 2018-08-02 |
| TW201831290A (zh) | 2018-09-01 |
| TWI710438B (zh) | 2020-11-21 |
| KR102344555B1 (ko) | 2021-12-28 |
| AT519587B1 (de) | 2021-10-15 |
| JP2018157194A (ja) | 2018-10-04 |
| AT519587A2 (de) | 2018-08-15 |
| NL2018243B1 (en) | 2018-08-07 |
| CN108364903A (zh) | 2018-08-03 |
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