SG10201710240SA - Process for cleaning wafers - Google Patents
Process for cleaning wafersInfo
- Publication number
- SG10201710240SA SG10201710240SA SG10201710240SA SG10201710240SA SG10201710240SA SG 10201710240S A SG10201710240S A SG 10201710240SA SG 10201710240S A SG10201710240S A SG 10201710240SA SG 10201710240S A SG10201710240S A SG 10201710240SA SG 10201710240S A SG10201710240S A SG 10201710240SA
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning wafers
- wafers
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/162—Organic compounds containing Si
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010293853 | 2010-12-28 | ||
| JP2011238623 | 2011-10-31 | ||
| JP2011274084A JP2013118347A (en) | 2010-12-28 | 2011-12-15 | Cleaning method of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201710240SA true SG10201710240SA (en) | 2018-01-30 |
Family
ID=46382890
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605687VA SG10201605687VA (en) | 2010-12-28 | 2011-12-20 | Process for cleaning wafers |
| SG2013033071A SG190068A1 (en) | 2010-12-28 | 2011-12-20 | Process for cleaning wafers |
| SG10201710240SA SG10201710240SA (en) | 2010-12-28 | 2011-12-20 | Process for cleaning wafers |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605687VA SG10201605687VA (en) | 2010-12-28 | 2011-12-20 | Process for cleaning wafers |
| SG2013033071A SG190068A1 (en) | 2010-12-28 | 2011-12-20 | Process for cleaning wafers |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP2013118347A (en) |
| KR (1) | KR101593517B1 (en) |
| CN (2) | CN103283004B (en) |
| SG (3) | SG10201605687VA (en) |
| TW (1) | TWI440993B (en) |
| WO (1) | WO2012090779A1 (en) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101367252B1 (en) * | 2011-11-10 | 2014-02-25 | 제일모직 주식회사 | Rinse solution for polyhydrosiloxazane thin film and method of patterning polyhydrosiloxazane thin film using the same |
| JP2014067801A (en) * | 2012-09-25 | 2014-04-17 | Central Glass Co Ltd | Liquid chemical for protective film formation |
| KR101525152B1 (en) * | 2012-12-12 | 2015-06-04 | 영창케미칼 주식회사 | Coating Composition For CAPACITOR Anti-leaning |
| JP6013289B2 (en) * | 2013-08-05 | 2016-10-25 | 株式会社東芝 | Semiconductor substrate cleaning method and semiconductor substrate cleaning apparatus |
| JP6191372B2 (en) * | 2013-10-04 | 2017-09-06 | セントラル硝子株式会社 | Wafer cleaning method |
| TWI570806B (en) * | 2013-11-11 | 2017-02-11 | 東京威力科創股份有限公司 | System and method for enhanced removal of metal hardmask using ultra violet treatment |
| JP6405618B2 (en) * | 2013-11-12 | 2018-10-17 | 株式会社Sumco | Silicon wafer manufacturing method |
| JP6304592B2 (en) * | 2014-03-25 | 2018-04-04 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method and substrate processing apparatus |
| KR102180284B1 (en) * | 2015-01-13 | 2020-11-18 | 동우 화인켐 주식회사 | Composition for removing silicone polymer and manufacturing method of thin film substrate using the same |
| CN107530739B (en) * | 2015-03-26 | 2021-04-27 | 生命技术公司 | Method for processing semiconductor sensor array device |
| US9976037B2 (en) * | 2015-04-01 | 2018-05-22 | Versum Materials Us, Llc | Composition for treating surface of substrate, method and device |
| JP6420707B2 (en) | 2015-04-07 | 2018-11-07 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing apparatus |
| JP6875630B2 (en) * | 2015-08-20 | 2021-05-26 | セントラル硝子株式会社 | Wafer cleaning method and chemical solution used for the cleaning method |
| WO2017030073A1 (en) * | 2015-08-20 | 2017-02-23 | セントラル硝子株式会社 | Wafer washing method, and liquid chemical used in same |
| JP6703256B2 (en) * | 2016-03-15 | 2020-06-03 | セントラル硝子株式会社 | Water repellent protective film forming agent, water repellent protective film forming chemical, and wafer cleaning method |
| WO2017159446A1 (en) * | 2016-03-15 | 2017-09-21 | セントラル硝子株式会社 | Liquid chemical for forming water-repellent protective film, and wafer washing method using said liquid chemical |
| JP2017168710A (en) * | 2016-03-17 | 2017-09-21 | セントラル硝子株式会社 | Wafer cleaning method |
| JP2017174859A (en) * | 2016-03-18 | 2017-09-28 | セントラル硝子株式会社 | Wafer cleaning method |
| JP2017187609A (en) * | 2016-04-05 | 2017-10-12 | アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ | Gap filling composition and pattern forming method using low molecular weight compound |
| JP2017157863A (en) * | 2017-06-06 | 2017-09-07 | セントラル硝子株式会社 | Cleaning method of wafer |
| US10954480B2 (en) * | 2017-09-29 | 2021-03-23 | Versum Materials Us, Llc | Compositions and methods for preventing collapse of high aspect ratio structures during drying |
| JP7189427B2 (en) * | 2017-12-22 | 2022-12-14 | セントラル硝子株式会社 | Surface treatment agent and method for producing surface treated body |
| JP6916731B2 (en) * | 2017-12-28 | 2021-08-11 | 東京応化工業株式会社 | A method for making a substrate water repellent, a surface treatment agent, and a method for suppressing the collapse of an organic pattern or an inorganic pattern when cleaning the substrate surface with a cleaning liquid. |
| JP7277700B2 (en) * | 2018-01-15 | 2023-05-19 | セントラル硝子株式会社 | Chemical solution for forming water-repellent protective film and method for surface treatment of wafer |
| WO2019138870A1 (en) * | 2018-01-15 | 2019-07-18 | セントラル硝子株式会社 | Chemical agent for forming water repellent protective film and surface treatment method for wafers |
| SG11202009171XA (en) * | 2018-04-05 | 2020-10-29 | Central Glass Co Ltd | Surface treatment method of wafer and composition used for said method |
| JP7077184B2 (en) * | 2018-08-30 | 2022-05-30 | キオクシア株式会社 | Substrate processing method and semiconductor device manufacturing method |
| JP7328564B2 (en) * | 2018-11-22 | 2023-08-17 | セントラル硝子株式会社 | Bevel treatment agent composition and wafer manufacturing method |
| JP6631687B1 (en) * | 2018-12-25 | 2020-01-15 | 株式会社Sumco | Cleaning tank and cleaning method for semiconductor wafer |
| JP7446097B2 (en) | 2019-12-06 | 2024-03-08 | 東京応化工業株式会社 | Surface treatment agent and surface treatment method |
| CN114068345A (en) * | 2020-08-05 | 2022-02-18 | 长鑫存储技术有限公司 | Processing method and forming method of semiconductor structure |
| JPWO2022181530A1 (en) * | 2021-02-26 | 2022-09-01 | ||
| WO2023157619A1 (en) * | 2022-02-18 | 2023-08-24 | 富士フイルム株式会社 | Liquid chemical, modified substrate manufacturing method, and laminate manufacturing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001300454A (en) * | 2000-04-28 | 2001-10-30 | Matsushita Electric Ind Co Ltd | Method for treating surface of substrate |
| JP4005092B2 (en) * | 2004-08-20 | 2007-11-07 | 東京応化工業株式会社 | Cleaning solvent |
| JP2008277748A (en) * | 2007-03-30 | 2008-11-13 | Renesas Technology Corp | Method for forming resist pattern, and semiconductor device manufactured by the method |
| US7838425B2 (en) * | 2008-06-16 | 2010-11-23 | Kabushiki Kaisha Toshiba | Method of treating surface of semiconductor substrate |
| JP5533178B2 (en) * | 2009-04-24 | 2014-06-25 | セントラル硝子株式会社 | Silicon wafer cleaning agent |
| JP5446848B2 (en) * | 2009-01-21 | 2014-03-19 | セントラル硝子株式会社 | Silicon wafer cleaning agent |
-
2011
- 2011-12-15 JP JP2011274084A patent/JP2013118347A/en active Pending
- 2011-12-20 KR KR1020137018746A patent/KR101593517B1/en active IP Right Grant
- 2011-12-20 CN CN201180063349.4A patent/CN103283004B/en active Active
- 2011-12-20 CN CN201611162059.6A patent/CN107068540A/en active Pending
- 2011-12-20 SG SG10201605687VA patent/SG10201605687VA/en unknown
- 2011-12-20 WO PCT/JP2011/079458 patent/WO2012090779A1/en active Application Filing
- 2011-12-20 SG SG2013033071A patent/SG190068A1/en unknown
- 2011-12-20 SG SG10201710240SA patent/SG10201710240SA/en unknown
- 2011-12-26 TW TW100148710A patent/TWI440993B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101593517B1 (en) | 2016-02-15 |
| TW201232196A (en) | 2012-08-01 |
| WO2012090779A1 (en) | 2012-07-05 |
| CN107068540A (en) | 2017-08-18 |
| TWI440993B (en) | 2014-06-11 |
| JP2013118347A (en) | 2013-06-13 |
| CN103283004B (en) | 2017-04-12 |
| SG10201605687VA (en) | 2016-09-29 |
| KR20130088896A (en) | 2013-08-08 |
| SG190068A1 (en) | 2013-06-28 |
| CN103283004A (en) | 2013-09-04 |
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