SG11201406412VA - Method for cleaning semiconductor wafer - Google Patents
Method for cleaning semiconductor waferInfo
- Publication number
- SG11201406412VA SG11201406412VA SG11201406412VA SG11201406412VA SG11201406412VA SG 11201406412V A SG11201406412V A SG 11201406412VA SG 11201406412V A SG11201406412V A SG 11201406412VA SG 11201406412V A SG11201406412V A SG 11201406412VA SG 11201406412V A SG11201406412V A SG 11201406412VA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafer
- cleaning semiconductor
- cleaning
- wafer
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012114944A JP5729351B2 (en) | 2012-05-18 | 2012-05-18 | Semiconductor wafer cleaning method |
| PCT/JP2013/002610 WO2013171973A1 (en) | 2012-05-18 | 2013-04-18 | Method for cleaning semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201406412VA true SG11201406412VA (en) | 2014-11-27 |
Family
ID=49583406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201406412VA SG11201406412VA (en) | 2012-05-18 | 2013-04-18 | Method for cleaning semiconductor wafer |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150053234A1 (en) |
| JP (1) | JP5729351B2 (en) |
| KR (1) | KR101989341B1 (en) |
| CN (1) | CN104335330B (en) |
| DE (1) | DE112013002027T5 (en) |
| SG (1) | SG11201406412VA (en) |
| TW (1) | TWI534882B (en) |
| WO (1) | WO2013171973A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7186095B2 (en) * | 2019-01-08 | 2022-12-08 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH084081B2 (en) * | 1986-04-28 | 1996-01-17 | ソニー株式会社 | Silicon wafer cleaning method |
| JP3072121B2 (en) * | 1990-10-01 | 2000-07-31 | 松下電器産業株式会社 | Cleaning tank, cleaning system and cleaning method |
| US6286231B1 (en) * | 2000-01-12 | 2001-09-11 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
| JP4204374B2 (en) * | 2003-04-21 | 2009-01-07 | 信越石英株式会社 | Manufacturing method of quartz glass jig |
| JP2005322714A (en) * | 2004-05-07 | 2005-11-17 | Matsushita Electric Ind Co Ltd | Method for forming cleaning bath using synthetic quartz |
| JP4823628B2 (en) * | 2005-09-26 | 2011-11-24 | 東京エレクトロン株式会社 | Substrate processing method and recording medium |
| CN101029288A (en) * | 2006-02-28 | 2007-09-05 | 李起元 | Method and cleansing composition for removing impurity |
| JP2009289960A (en) * | 2008-05-29 | 2009-12-10 | Tokyo Electron Ltd | Method and system for cleaning quartz member |
| JP2011151282A (en) * | 2010-01-25 | 2011-08-04 | Shin Etsu Handotai Co Ltd | Ultrasonic cleaning method |
-
2012
- 2012-05-18 JP JP2012114944A patent/JP5729351B2/en active Active
-
2013
- 2013-04-18 DE DE201311002027 patent/DE112013002027T5/en not_active Withdrawn
- 2013-04-18 WO PCT/JP2013/002610 patent/WO2013171973A1/en active Application Filing
- 2013-04-18 CN CN201380025705.2A patent/CN104335330B/en active Active
- 2013-04-18 KR KR1020147031297A patent/KR101989341B1/en active IP Right Grant
- 2013-04-18 US US14/390,655 patent/US20150053234A1/en not_active Abandoned
- 2013-04-18 SG SG11201406412VA patent/SG11201406412VA/en unknown
- 2013-05-02 TW TW102115713A patent/TWI534882B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150013505A (en) | 2015-02-05 |
| DE112013002027T5 (en) | 2015-04-16 |
| JP2013243219A (en) | 2013-12-05 |
| TWI534882B (en) | 2016-05-21 |
| KR101989341B1 (en) | 2019-06-17 |
| US20150053234A1 (en) | 2015-02-26 |
| TW201401363A (en) | 2014-01-01 |
| CN104335330B (en) | 2017-03-01 |
| WO2013171973A1 (en) | 2013-11-21 |
| CN104335330A (en) | 2015-02-04 |
| JP5729351B2 (en) | 2015-06-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201503659QA (en) | Method and apparatus for cleaning semiconductor wafer | |
| SG2013087671A (en) | Method for polishing a semiconductor wafer | |
| EP2793268A4 (en) | Method for manufacturing semiconductor device | |
| EP2790209A4 (en) | Manufacturing method for semiconductor device | |
| EP2704217A4 (en) | MANUFACTURING METHOD FOR GaN SEMICONDUCTOR DEVICE | |
| EP2732272A4 (en) | Wafer inspection | |
| SG10201710240SA (en) | Process for cleaning wafers | |
| EP2741341A4 (en) | Semiconductor device and fabrication method for same | |
| SG10201406877WA (en) | Method for chemical mechanical polishing silicon wafers | |
| EP2793251A4 (en) | Production method for semiconductor device | |
| EP2790208A4 (en) | Production method for semiconductor device | |
| EP2629319A4 (en) | Process for cleaning compound semiconductor wafer | |
| TWI562366B (en) | Manufacturing method of semiconductor device | |
| TWI563540B (en) | Semiconductor device manufacturing method | |
| EP2804215A4 (en) | Method for manufacturing silicon carbide semiconductor device | |
| EP2913843A4 (en) | Semiconductor device manufacturing method | |
| EP2672516A4 (en) | Semiconductor device | |
| EP2736067A4 (en) | Method for manufacturing semiconductor device | |
| EP2790225A4 (en) | Method for manufacturing semiconductor device | |
| EP2897166A4 (en) | Method for manufacturing semiconductor device | |
| EP2889899A4 (en) | Method for manufacturing silicon carbide semiconductor device | |
| EP2787526A4 (en) | Semiconductor device fabrication method | |
| SG11201406661YA (en) | Method for manufacturing bonded wafer | |
| SG11201502119TA (en) | Method for manufacturing soi wafer | |
| SG11201501256YA (en) | Cleaning method and cleaning system for semiconductor substrates |