SG10201708893XA - Sheet, tape, and semiconductor device manufacturing method - Google Patents

Sheet, tape, and semiconductor device manufacturing method

Info

Publication number
SG10201708893XA
SG10201708893XA SG10201708893XA SG10201708893XA SG10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA SG 10201708893X A SG10201708893X A SG 10201708893XA
Authority
SG
Singapore
Prior art keywords
sheet
tape
semiconductor device
device manufacturing
accordance
Prior art date
Application number
SG10201708893XA
Other languages
English (en)
Inventor
Shiga Goji
Kimura Ryuichi
Takamoto Naohide
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG10201708893XA publication Critical patent/SG10201708893XA/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG10201708893XA 2016-11-14 2017-10-30 Sheet, tape, and semiconductor device manufacturing method SG10201708893XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016221443A JP6812213B2 (ja) 2016-11-14 2016-11-14 シート、テープおよび半導体装置の製造方法

Publications (1)

Publication Number Publication Date
SG10201708893XA true SG10201708893XA (en) 2018-06-28

Family

ID=62172120

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201708893XA SG10201708893XA (en) 2016-11-14 2017-10-30 Sheet, tape, and semiconductor device manufacturing method

Country Status (5)

Country Link
JP (1) JP6812213B2 (ja)
KR (1) KR20180054461A (ja)
CN (1) CN108084912A (ja)
SG (1) SG10201708893XA (ja)
TW (1) TWI733931B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7523881B2 (ja) * 2018-12-05 2024-07-29 日東電工株式会社 ダイシングダイボンドフィルム
CN111524848A (zh) * 2019-02-01 2020-08-11 相丰科技股份有限公司 拉伸膜扩张方法及膜扩张机
JP7539223B2 (ja) * 2019-03-08 2024-08-23 日東電工株式会社 ダイシングテープ、及び接着フィルム付きダイシングテープ
WO2020194613A1 (ja) * 2019-03-27 2020-10-01 日立化成株式会社 半導体装置の製造方法、ダイボンディングフィルム、及びダイシング・ダイボンディング一体型接着シート
JP7411381B2 (ja) * 2019-10-28 2024-01-11 藤森工業株式会社 ダイシングテープ、及び半導体部品の製造方法
CN111349403A (zh) * 2020-03-27 2020-06-30 深圳市伟业鑫精密科技有限公司 用于电子设备的复合片材以及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010074136A (ja) * 2008-08-20 2010-04-02 Hitachi Chem Co Ltd 半導体装置の製造方法
KR101555741B1 (ko) * 2010-04-19 2015-09-25 닛토덴코 가부시키가이샤 플립칩형 반도체 이면용 필름
CN104508069B (zh) * 2012-08-02 2017-03-29 琳得科株式会社 膜状粘接剂、半导体接合用粘接片、和半导体装置的制造方法
JP6211771B2 (ja) * 2013-02-08 2017-10-11 日東電工株式会社 粘着テープ
JP6091954B2 (ja) * 2013-03-26 2017-03-08 リンテック株式会社 粘着シート、保護膜形成用フィルム、保護膜形成用複合シート、およびマーキング方法
US10510578B2 (en) * 2014-03-24 2019-12-17 Lintec Corporation Protective film forming film, protective film forming sheet and work product manufacturing method
JP6334223B2 (ja) * 2014-03-26 2018-05-30 リンテック株式会社 粘着シート
JP6295135B2 (ja) * 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム

Also Published As

Publication number Publication date
JP6812213B2 (ja) 2021-01-13
TWI733931B (zh) 2021-07-21
CN108084912A (zh) 2018-05-29
TW201833271A (zh) 2018-09-16
KR20180054461A (ko) 2018-05-24
JP2018081954A (ja) 2018-05-24

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