SG10201605834YA - Method for manufacturing passive optical components, and devices comprising the same - Google Patents

Method for manufacturing passive optical components, and devices comprising the same

Info

Publication number
SG10201605834YA
SG10201605834YA SG10201605834YA SG10201605834YA SG10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA
Authority
SG
Singapore
Prior art keywords
devices
same
optical components
passive optical
manufacturing passive
Prior art date
Application number
SG10201605834YA
Other languages
English (en)
Inventor
Hartmut Rudmann
Susanne Westenhoefer
Bojan Tesanovic
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG10201605834YA publication Critical patent/SG10201605834YA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00932—Combined cutting and grinding thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Integrated Circuits (AREA)
  • Led Device Packages (AREA)
SG10201605834YA 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same SG10201605834YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19

Publications (1)

Publication Number Publication Date
SG10201605834YA true SG10201605834YA (en) 2016-09-29

Family

ID=46639253

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201605834YA SG10201605834YA (en) 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same

Country Status (8)

Country Link
US (4) US8767303B2 (zh)
EP (1) EP2735029B1 (zh)
JP (2) JP2014521992A (zh)
KR (1) KR101966478B1 (zh)
CN (1) CN103975436B (zh)
SG (1) SG10201605834YA (zh)
TW (3) TWI635601B (zh)
WO (1) WO2013010285A1 (zh)

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WO2013020238A1 (en) * 2011-08-10 2013-02-14 Heptagon Micro Optics Pte. Ltd. Opto-electronic module and method for manufacturing the same
EP3396716B1 (en) 2012-08-20 2020-10-14 Heptagon Micro Optics Pte. Ltd. Fabrication of optics wafer
EP2827368B1 (en) * 2013-07-19 2019-06-05 ams AG Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
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US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016208403A1 (ja) * 2015-06-23 2016-12-29 ソニー株式会社 イメージセンサ、および電子機器
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KR101738883B1 (ko) * 2016-01-06 2017-05-23 한국과학기술원 초박형 디지털 카메라 및 그 제조 방법
JP6740628B2 (ja) * 2016-02-12 2020-08-19 凸版印刷株式会社 固体撮像素子及びその製造方法
WO2017155460A1 (en) * 2016-03-08 2017-09-14 Tnc Optics & Technologies Pte. Ltd. A fabrication method of optical sensor cover having a lens
US20220088895A1 (en) * 2019-02-25 2022-03-24 Ams Sensors Singapore Pte. Ltd. Manufacture of optical diffusers composed of reflowable materials
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

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Also Published As

Publication number Publication date
TWI635601B (zh) 2018-09-11
JP6763807B2 (ja) 2020-09-30
EP2735029B1 (en) 2022-12-21
US8767303B2 (en) 2014-07-01
US20170235026A1 (en) 2017-08-17
US20160031169A1 (en) 2016-02-04
CN103975436A (zh) 2014-08-06
CN103975436B (zh) 2019-05-10
TW201742238A (zh) 2017-12-01
KR20140054081A (ko) 2014-05-08
TW201820597A (zh) 2018-06-01
JP2017167533A (ja) 2017-09-21
JP2014521992A (ja) 2014-08-28
US9610743B2 (en) 2017-04-04
TWI647825B (zh) 2019-01-11
US9193120B2 (en) 2015-11-24
US20130033767A1 (en) 2013-02-07
TW201310626A (zh) 2013-03-01
TWI647824B (zh) 2019-01-11
US10527762B2 (en) 2020-01-07
KR101966478B1 (ko) 2019-04-05
US20140347747A1 (en) 2014-11-27
WO2013010285A1 (en) 2013-01-24
EP2735029A1 (en) 2014-05-28

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