SG10201602156SA - Non-linear vertical leaf spring - Google Patents

Non-linear vertical leaf spring

Info

Publication number
SG10201602156SA
SG10201602156SA SG10201602156SA SG10201602156SA SG10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA SG 10201602156S A SG10201602156S A SG 10201602156SA
Authority
SG
Singapore
Prior art keywords
leaf spring
linear vertical
vertical leaf
linear
spring
Prior art date
Application number
SG10201602156SA
Other languages
English (en)
Inventor
Keith J Breinlinger
Michael J Armstrong
Benjamin N Eldridge
John K Gritters
Eric D Hobbs
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of SG10201602156SA publication Critical patent/SG10201602156SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG10201602156SA 2011-03-21 2012-03-01 Non-linear vertical leaf spring SG10201602156SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161454910P 2011-03-21 2011-03-21
US13/288,925 US9702904B2 (en) 2011-03-21 2011-11-03 Non-linear vertical leaf spring

Publications (1)

Publication Number Publication Date
SG10201602156SA true SG10201602156SA (en) 2016-04-28

Family

ID=46876820

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2013070057A SG193914A1 (en) 2011-03-21 2012-03-01 Non-linear vertical leaf spring
SG10201602156SA SG10201602156SA (en) 2011-03-21 2012-03-01 Non-linear vertical leaf spring

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2013070057A SG193914A1 (en) 2011-03-21 2012-03-01 Non-linear vertical leaf spring

Country Status (6)

Country Link
US (1) US9702904B2 (ko)
JP (1) JP5995953B2 (ko)
KR (1) KR101906626B1 (ko)
SG (2) SG193914A1 (ko)
TW (1) TWI592587B (ko)
WO (1) WO2012128907A2 (ko)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US10006938B2 (en) * 2012-01-04 2018-06-26 Formfactor, Inc. Probes with programmable motion
SG11201405000UA (en) * 2012-06-29 2014-09-26 Hydrovision Asia Pte Ltd An improved suspended sediment meter
US20140043054A1 (en) * 2012-08-09 2014-02-13 Formfactor, Inc. Vertical probes for multi-pitch full grid contact array
JP5936510B2 (ja) * 2012-10-05 2016-06-22 三菱電機株式会社 積層プローブ
CN104823330B (zh) * 2012-10-10 2018-03-30 安费诺有限公司 直连正交连接系统
CN108333394B (zh) * 2012-12-04 2020-06-09 日本电子材料株式会社 接触探针
JP2014182041A (ja) * 2013-03-21 2014-09-29 Totoku Electric Co Ltd プローブピンおよびコンタクトプローブ
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6513639B2 (ja) 2013-05-06 2019-05-15 フォームファクター， インコーポレイテッド 電子デバイスを試験するためのプローブカードアセンブリ
JP6475238B2 (ja) * 2013-07-09 2019-02-27 フォームファクター， インコーポレイテッド 導電性ガイド板を通る信号経路及び導電性ガイド板の間の２次経路を備えるマルチパス電気プローブ並びにプローブ・アセンブリ
EP3019879A4 (en) * 2013-07-11 2017-08-16 JohnsTech International Corporation Testing apparatus and method for microcircuit and wafer level ic testing
US9905975B2 (en) 2014-01-22 2018-02-27 Amphenol Corporation Very high speed, high density electrical interconnection system with edge to broadside transition
WO2015171227A1 (en) * 2014-05-06 2015-11-12 Mems Drive, Inc. Low stiffness flexure
US9621775B2 (en) 2014-05-06 2017-04-11 Mems Drive, Inc. Electrical bar latching for low stiffness flexure MEMS actuator
JP6320285B2 (ja) * 2014-12-16 2018-05-09 三菱電機株式会社 一体型複数接触子、それを備えた検査治具及び検査装置、並びに検査方法
CN107430150B (zh) * 2015-03-13 2020-08-21 泰克诺探头公司 特别用于高频应用的具有竖向探针的测试头
WO2016156002A1 (en) * 2015-03-31 2016-10-06 Technoprobe S.P.A. Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications
CN107430151B (zh) 2015-03-31 2021-06-15 泰克诺探头公司 特别适用于高频应用的竖向接触探针和包含其的测试头
CN107580681B (zh) * 2015-05-07 2020-06-19 泰克诺探头公司 尤其用于减小节距的应用的、具有竖直探针的测试头
CN108028481B (zh) 2015-07-23 2021-08-20 安费诺有限公司 用于模块化连接器的延伸器模块
JP6855185B2 (ja) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス 電気的接続装置
DE102017206146A1 (de) * 2016-12-15 2018-06-21 Continental Automotive Gmbh Hochstrom-Kontaktpin, Hochstrom-Steckbuchse und Hochstrom-Steckeranordnung mit einem Hochstrom-Kontaktpin
CN108459255B (zh) * 2017-02-16 2021-10-22 豪威科技股份有限公司 用于细间距封装测试的测试座
DE102017002150A1 (de) * 2017-03-06 2018-09-06 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Kontaktelement
JP2018179721A (ja) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス 電気的接続装置
JP6872960B2 (ja) * 2017-04-21 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
KR101860519B1 (ko) * 2017-05-02 2018-05-24 주식회사 마이크로이즈 전기 전도성 프로브 소자 및 그 제조 방법
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
KR20190021101A (ko) 2017-08-22 2019-03-05 삼성전자주식회사 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법
EP3499653B1 (en) * 2017-12-12 2021-08-18 Rasco GmbH Contactor spring and contactor socket
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
WO2020236794A1 (en) 2019-05-20 2020-11-26 Amphenol Corporation High density, high speed electrical connector
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11802891B1 (en) 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
TWI736361B (zh) * 2020-07-15 2021-08-11 中華精測科技股份有限公司 探針卡裝置及其柵欄狀探針
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
TWI745182B (zh) * 2020-11-30 2021-11-01 中華精測科技股份有限公司 探針卡裝置及雙臂式探針
KR102509528B1 (ko) 2021-02-05 2023-03-14 (주)포인트엔지니어링 전기 전도성 접촉핀
KR20230157455A (ko) * 2021-05-28 2023-11-16 가부시키가이샤 니혼 마이크로닉스 프로브
JP2023104519A (ja) * 2022-01-18 2023-07-28 株式会社日本マイクロニクス プローブ
TWI802354B (zh) * 2022-03-31 2023-05-11 中華精測科技股份有限公司 垂直式探針頭及其柵欄狀探針
WO2023188369A1 (ja) * 2022-03-31 2023-10-05 日本電子材料株式会社 プローブピンおよびプローブカード
TWI825798B (zh) * 2022-06-22 2023-12-11 吳俊杰 彈性探針及電路測試裝置
JP2024010473A (ja) * 2022-07-12 2024-01-24 山一電機株式会社 コンタクトピン及び検査用ソケット
JP2024010472A (ja) * 2022-07-12 2024-01-24 山一電機株式会社 コンタクトピン及び検査用ソケット
KR20240017651A (ko) * 2022-08-01 2024-02-08 (주)포인트엔지니어링 전기 전도성 접촉핀 및 그 제조방법
WO2024062560A1 (ja) * 2022-09-21 2024-03-28 日本電子材料株式会社 プローブカード用プローブ

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027935A (en) * 1976-06-21 1977-06-07 International Business Machines Corporation Contact for an electrical contactor assembly
US4618821A (en) 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPH07109780B2 (ja) 1991-02-19 1995-11-22 山一電機株式会社 電気部品用ソケットにおけるコンタクト
JP2734412B2 (ja) 1995-06-29 1998-03-30 日本電気株式会社 半導体装置のソケット
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US6491968B1 (en) 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
US6672875B1 (en) 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
JP2002531915A (ja) * 1998-12-02 2002-09-24 フォームファクター，インコーポレイテッド リソグラフィ接触要素
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6252415B1 (en) 1999-09-14 2001-06-26 Advantest Corp. Pin block structure for mounting contact pins
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
JP2004156993A (ja) 2002-11-06 2004-06-03 Micronics Japan Co Ltd プローブ及びこれを用いた電気的接続装置
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
US7579856B2 (en) * 2006-04-21 2009-08-25 Formfactor, Inc. Probe structures with physically suspended electronic components
JP2008032400A (ja) 2006-07-26 2008-02-14 Fujifilm Corp Ｉｃソケットのコンタクトピン
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7825675B2 (en) * 2006-11-01 2010-11-02 Formfactor, Inc. Method and apparatus for providing active compliance in a probe card assembly
US7384277B1 (en) 2006-12-17 2008-06-10 Formfactor, Inc. Reinforced contact elements
US7851794B2 (en) 2006-12-28 2010-12-14 Formfactor, Inc. Rotating contact element and methods of fabrication
JP5099487B2 (ja) 2007-08-03 2012-12-19 軍生 木本 複数梁合成型接触子
US20090079455A1 (en) * 2007-09-26 2009-03-26 Formfactor, Inc. Reduced scrub contact element
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
DE102008023761B9 (de) 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
WO2010061857A1 (ja) * 2008-11-25 2010-06-03 日本発條株式会社 コンタクトプローブ、プローブユニットおよびプローブユニットの組立方法

Also Published As

Publication number Publication date
TWI592587B (zh) 2017-07-21
KR20140019799A (ko) 2014-02-17
JP5995953B2 (ja) 2016-09-21
TW201303182A (zh) 2013-01-16
KR101906626B1 (ko) 2018-10-10
US9702904B2 (en) 2017-07-11
US20120242363A1 (en) 2012-09-27
JP2014510283A (ja) 2014-04-24
WO2012128907A3 (en) 2012-11-08
WO2012128907A2 (en) 2012-09-27
SG193914A1 (en) 2013-11-29

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