SG10201508881RA - Polishing Apparatus And Polishing Method - Google Patents

Polishing Apparatus And Polishing Method

Info

Publication number
SG10201508881RA
SG10201508881RA SG10201508881RA SG10201508881RA SG10201508881RA SG 10201508881R A SG10201508881R A SG 10201508881RA SG 10201508881R A SG10201508881R A SG 10201508881RA SG 10201508881R A SG10201508881R A SG 10201508881RA SG 10201508881R A SG10201508881R A SG 10201508881RA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
polishing method
Prior art date
Application number
SG10201508881RA
Other languages
English (en)
Inventor
Taro Takahashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201508881RA publication Critical patent/SG10201508881RA/en

Links

SG10201508881RA 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method SG10201508881RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223293 2014-10-31
JP2015168088A JP2016087780A (ja) 2014-10-31 2015-08-27 研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
SG10201508881RA true SG10201508881RA (en) 2016-05-30

Family

ID=56015959

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201508881RA SG10201508881RA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method
SG10201801305PA SG10201801305PA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201801305PA SG10201801305PA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Country Status (2)

Country Link
JP (1) JP2016087780A (enExample)
SG (2) SG10201508881RA (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
JP6779633B2 (ja) * 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
KR102446870B1 (ko) 2016-10-21 2022-09-26 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
WO2018132424A1 (en) 2017-01-13 2018-07-19 Applied Materials, Inc. Resistivity-based adjustment of measurements from in-situ monitoring
JP2024019825A (ja) * 2022-08-01 2024-02-14 株式会社荏原製作所 研磨装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001041828A (ja) * 1999-07-27 2001-02-16 Tokyo Gas Co Ltd 温度測定装置及びそれを利用した測定方法
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
JP2004014999A (ja) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd Ｃｍｐ研磨装置及び研磨方法
KR100506942B1 (ko) * 2003-09-03 2005-08-05 삼성전자주식회사 화학적 기계적 연마장치
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
JP2009125825A (ja) * 2007-11-20 2009-06-11 Ebara Corp 電解複合研磨方法及び電解複合研磨装置
US8523429B2 (en) * 2009-10-19 2013-09-03 Tsi Technologies Llc Eddy current thermometer

Also Published As

Publication number Publication date
JP2016087780A (ja) 2016-05-23
SG10201801305PA (en) 2018-03-28

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