JP2016087780A - 研磨装置および研磨方法 - Google Patents

研磨装置および研磨方法 Download PDF

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Publication number
JP2016087780A
JP2016087780A JP2015168088A JP2015168088A JP2016087780A JP 2016087780 A JP2016087780 A JP 2016087780A JP 2015168088 A JP2015168088 A JP 2015168088A JP 2015168088 A JP2015168088 A JP 2015168088A JP 2016087780 A JP2016087780 A JP 2016087780A
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Japan
Prior art keywords
polishing
sensor
temperature
temperature sensor
polishing pad
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JP2015168088A
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Japanese (ja)
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JP2016087780A5 (enExample
Inventor
高橋　太郎
Taro Takahashi
太郎 高橋
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Ebara Corp
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Ebara Corp
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Priority to SG10201508881RA priority Critical patent/SG10201508881RA/en
Priority to US14/925,063 priority patent/US20160121452A1/en
Priority to SG10201801305PA priority patent/SG10201801305PA/en
Publication of JP2016087780A publication Critical patent/JP2016087780A/ja
Publication of JP2016087780A5 publication Critical patent/JP2016087780A5/ja
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2015168088A 2014-10-31 2015-08-27 研磨装置および研磨方法 Pending JP2016087780A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG10201508881RA SG10201508881RA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method
US14/925,063 US20160121452A1 (en) 2014-10-31 2015-10-28 Polishing apparatus and polishing method
SG10201801305PA SG10201801305PA (en) 2014-10-31 2015-10-28 Polishing Apparatus And Polishing Method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223293 2014-10-31
JP2014223293 2014-10-31

Publications (2)

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JP2016087780A true JP2016087780A (ja) 2016-05-23
JP2016087780A5 JP2016087780A5 (enExample) 2018-09-13

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JP2015168088A Pending JP2016087780A (ja) 2014-10-31 2015-08-27 研磨装置および研磨方法

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JP (1) JP2016087780A (enExample)
SG (2) SG10201508881RA (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
JP2017152471A (ja) * 2016-02-23 2017-08-31 株式会社荏原製作所 研磨装置
KR20190059328A (ko) * 2016-10-21 2019-05-30 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
JP2023071700A (ja) * 2017-01-13 2023-05-23 アプライド マテリアルズ インコーポレイテッド インシトゥ監視からの測定値の、抵抗率に基づく調整

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001041828A (ja) * 1999-07-27 2001-02-16 Tokyo Gas Co Ltd 温度測定装置及びそれを利用した測定方法
JP2004014999A (ja) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd Ｃｍｐ研磨装置及び研磨方法
US20050048875A1 (en) * 2003-09-03 2005-03-03 Ja-Eung Koo Chemical mechanical polishing apparatus
JP2005121616A (ja) * 2003-10-20 2005-05-12 Ebara Corp 渦電流センサ
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
JP2009125825A (ja) * 2007-11-20 2009-06-11 Ebara Corp 電解複合研磨方法及び電解複合研磨装置
JP2013508723A (ja) * 2009-10-19 2013-03-07 ティーエスアイ テクノロジーズ エルエルシー 渦電流温度計

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001041828A (ja) * 1999-07-27 2001-02-16 Tokyo Gas Co Ltd 温度測定装置及びそれを利用した測定方法
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
JP2004014999A (ja) * 2002-06-11 2004-01-15 Hitachi Chem Co Ltd Ｃｍｐ研磨装置及び研磨方法
US20050048875A1 (en) * 2003-09-03 2005-03-03 Ja-Eung Koo Chemical mechanical polishing apparatus
JP2005121616A (ja) * 2003-10-20 2005-05-12 Ebara Corp 渦電流センサ
JP2009125825A (ja) * 2007-11-20 2009-06-11 Ebara Corp 電解複合研磨方法及び電解複合研磨装置
JP2013508723A (ja) * 2009-10-19 2013-03-07 ティーエスアイ テクノロジーズ エルエルシー 渦電流温度計

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
JP2017152471A (ja) * 2016-02-23 2017-08-31 株式会社荏原製作所 研磨装置
KR20220132061A (ko) * 2016-10-21 2022-09-29 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
JP2019534455A (ja) * 2016-10-21 2019-11-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ インシトゥ電磁誘導モニタシステムのコア構成
JP7140760B2 (ja) 2016-10-21 2022-09-21 アプライド マテリアルズ インコーポレイテッド インシトゥ電磁誘導モニタシステムのコア構成
KR102446870B1 (ko) * 2016-10-21 2022-09-26 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
KR20190059328A (ko) * 2016-10-21 2019-05-30 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
US11638982B2 (en) 2016-10-21 2023-05-02 Applied Materials, Inc. Core configuration for in-situ electromagnetic induction monitoring system
KR102547156B1 (ko) 2016-10-21 2023-06-26 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
KR20230093548A (ko) * 2016-10-21 2023-06-27 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
US12103135B2 (en) 2016-10-21 2024-10-01 Applied Materials, Inc. Core configuration for in-situ electromagnetic induction monitoring system
KR102807367B1 (ko) * 2016-10-21 2025-05-15 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링 시스템을 위한 코어 구성
JP2023071700A (ja) * 2017-01-13 2023-05-23 アプライド マテリアルズ インコーポレイテッド インシトゥ監視からの測定値の、抵抗率に基づく調整
US12320883B2 (en) 2017-01-13 2025-06-03 Applied Materials, Inc. Resistivity-based adjustment of thresholds for in-situ monitoring
JP7693728B2 (ja) 2017-01-13 2025-06-17 アプライド マテリアルズ インコーポレイテッド インシトゥ監視からの測定値の、抵抗率に基づく調整

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SG10201801305PA (en) 2018-03-28
SG10201508881RA (en) 2016-05-30

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