SG10201506082UA - Substrate edge tuning with retaining ring - Google Patents

Substrate edge tuning with retaining ring

Info

Publication number
SG10201506082UA
SG10201506082UA SG10201506082UA SG10201506082UA SG10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA
Authority
SG
Singapore
Prior art keywords
retaining ring
substrate edge
edge tuning
tuning
substrate
Prior art date
Application number
SG10201506082UA
Other languages
English (en)
Inventor
Hung Chih Chen
Samuel Chu-Chiang Hsu
Yin Yuan
Huanbo Zhang
Gautam Shashank Dandavate
Mario David Silvetti
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201506082UA publication Critical patent/SG10201506082UA/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0428Apparatus for mechanical treatment or grinding or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • B24B37/32Retaining rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/067Work supports, e.g. adjustable steadies radially supporting workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201506082UA 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring SG10201506082UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37164410P 2010-08-06 2010-08-06
US201161479271P 2011-04-26 2011-04-26

Publications (1)

Publication Number Publication Date
SG10201506082UA true SG10201506082UA (en) 2015-09-29

Family

ID=45556486

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201506082UA SG10201506082UA (en) 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring
SG2013009766A SG187782A1 (en) 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2013009766A SG187782A1 (en) 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring

Country Status (8)

Country Link
US (5) US8721391B2 (https=)
EP (2) EP3406402B1 (https=)
JP (2) JP6073222B2 (https=)
KR (3) KR101882708B1 (https=)
CN (2) CN103252715B (https=)
SG (2) SG10201506082UA (https=)
TW (2) TWI574785B (https=)
WO (1) WO2012019144A2 (https=)

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TWI840511B (zh) * 2019-02-28 2024-05-01 美商應用材料股份有限公司 用於化學機械研磨承載頭的固定器
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US11660721B2 (en) * 2021-02-18 2023-05-30 Applied Materials, Inc. Dual loading retaining ring
JP7642086B2 (ja) 2021-03-04 2025-03-07 アプライド マテリアルズ インコーポレイテッド 変動的なエッジ制御を含む研磨キャリアヘッド
KR102556166B1 (ko) 2022-01-28 2023-07-19 지앤에스건설 주식회사 플로팅 인테리어 계단 시공방법 및 그 방법으로 시공된 플로팅 인테리어 계단
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
US20230356355A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Polishing head with local inner ring downforce control
US20230381915A1 (en) * 2022-05-27 2023-11-30 Applied Materials, Inc. Operation of clamping retainer for chemical mechanical polishing
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US20250100105A1 (en) * 2023-09-27 2025-03-27 Applied Materials, Inc. Cmp inner ring in smart head
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Also Published As

Publication number Publication date
US10022837B2 (en) 2018-07-17
US20160082571A1 (en) 2016-03-24
US20180304441A1 (en) 2018-10-25
SG187782A1 (en) 2013-03-28
JP2013536578A (ja) 2013-09-19
KR101701870B1 (ko) 2017-02-02
TW201323153A (zh) 2013-06-16
CN103098182B (zh) 2016-11-02
TWI574785B (zh) 2017-03-21
TW201221294A (en) 2012-06-01
KR101882708B1 (ko) 2018-07-27
EP3406402A1 (en) 2018-11-28
WO2012019144A2 (en) 2012-02-09
JP5924739B2 (ja) 2016-05-25
JP6073222B2 (ja) 2017-02-01
CN103098182A (zh) 2013-05-08
KR20130093618A (ko) 2013-08-22
KR101814185B1 (ko) 2018-01-02
EP2601677A2 (en) 2013-06-12
EP3406402B1 (en) 2021-06-30
CN103252715B (zh) 2016-06-22
EP2601677A4 (en) 2015-05-27
CN103252715A (zh) 2013-08-21
US20120034848A1 (en) 2012-02-09
KR20180004298A (ko) 2018-01-10
KR20130093111A (ko) 2013-08-21
US20130149942A1 (en) 2013-06-13
US8840446B2 (en) 2014-09-23
US20120034849A1 (en) 2012-02-09
EP2601677B1 (en) 2018-07-04
TWI540021B (zh) 2016-07-01
WO2012019144A3 (en) 2012-06-07
US11173579B2 (en) 2021-11-16
US8721391B2 (en) 2014-05-13
JP2013243373A (ja) 2013-12-05

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