SG10201408733PA - Electrostatic chucks and methods for refurbishing same - Google Patents
Electrostatic chucks and methods for refurbishing sameInfo
- Publication number
- SG10201408733PA SG10201408733PA SG10201408733PA SG10201408733PA SG10201408733PA SG 10201408733P A SG10201408733P A SG 10201408733PA SG 10201408733P A SG10201408733P A SG 10201408733PA SG 10201408733P A SG10201408733P A SG 10201408733PA SG 10201408733P A SG10201408733P A SG 10201408733PA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- electrostatic chucks
- refurbishing
- same
- refurbishing same
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/648,638 US8597448B2 (en) | 2009-12-29 | 2009-12-29 | Electrostatic chucks and methods for refurbishing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201408733PA true SG10201408733PA (en) | 2015-02-27 |
Family
ID=44186004
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201408733PA SG10201408733PA (en) | 2009-12-29 | 2010-12-20 | Electrostatic chucks and methods for refurbishing same |
| SG2012040978A SG181503A1 (en) | 2009-12-29 | 2010-12-20 | Electrostatic chucks and methods for refurbishing same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012040978A SG181503A1 (en) | 2009-12-29 | 2010-12-20 | Electrostatic chucks and methods for refurbishing same |
Country Status (7)
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8597448B2 (en) | 2009-12-29 | 2013-12-03 | Novellus Systems, Inc. | Electrostatic chucks and methods for refurbishing same |
| US9054148B2 (en) * | 2011-08-26 | 2015-06-09 | Lam Research Corporation | Method for performing hot water seal on electrostatic chuck |
| US9685356B2 (en) * | 2012-12-11 | 2017-06-20 | Applied Materials, Inc. | Substrate support assembly having metal bonded protective layer |
| US9999947B2 (en) * | 2015-05-01 | 2018-06-19 | Component Re-Engineering Company, Inc. | Method for repairing heaters and chucks used in semiconductor processing |
| KR20170016547A (ko) | 2015-08-03 | 2017-02-14 | 삼성전자주식회사 | 척 테이블 및 그를 포함하는 기판 제조 장치 |
| US10020218B2 (en) | 2015-11-17 | 2018-07-10 | Applied Materials, Inc. | Substrate support assembly with deposited surface features |
| US10147610B1 (en) | 2017-05-30 | 2018-12-04 | Lam Research Corporation | Substrate pedestal module including metallized ceramic tubes for RF and gas delivery |
| KR102071674B1 (ko) * | 2017-07-19 | 2020-01-30 | 주식회사 임나노텍 | 레이저 용접을 이용한 반도체 스퍼터링 정전척의 리사이클링 시스템 |
| US11488852B2 (en) | 2019-05-31 | 2022-11-01 | Applied Materials, Inc. | Methods and apparatus for reducing high voltage arcing in semiconductor process chambers |
| JP7633794B2 (ja) * | 2020-03-26 | 2025-02-20 | 三星電子株式会社 | 静電チャック装置 |
| JP2023004738A (ja) * | 2021-06-28 | 2023-01-17 | 東京エレクトロン株式会社 | 基板載置台、基板処理装置及び基板載置台の製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3513891A (en) * | 1967-06-16 | 1970-05-26 | Production Machines Inc | Chuck for veneer lathe inner spindle |
| US5581874A (en) * | 1994-03-28 | 1996-12-10 | Tokyo Electron Limited | Method of forming a bonding portion |
| JP3485390B2 (ja) * | 1995-07-28 | 2004-01-13 | 京セラ株式会社 | 静電チャック |
| JP4311600B2 (ja) * | 2001-01-30 | 2009-08-12 | 日本碍子株式会社 | 静電チャック用接合構造体及びその製造方法 |
| JP4003932B2 (ja) * | 2002-03-07 | 2007-11-07 | 日本碍子株式会社 | セラミックス−金属接合体 |
| JP4451098B2 (ja) * | 2002-08-22 | 2010-04-14 | 住友大阪セメント株式会社 | サセプタ装置 |
| JP4402949B2 (ja) | 2003-12-26 | 2010-01-20 | 株式会社クリエイティブ テクノロジー | 双極型静電チャックの再生方法 |
| US7697260B2 (en) * | 2004-03-31 | 2010-04-13 | Applied Materials, Inc. | Detachable electrostatic chuck |
| US7208325B2 (en) * | 2005-01-18 | 2007-04-24 | Applied Materials, Inc. | Refreshing wafers having low-k dielectric materials |
| JP4425850B2 (ja) * | 2005-11-07 | 2010-03-03 | 日本碍子株式会社 | 基板載置部材の分離方法及び再利用方法 |
| US7589950B2 (en) * | 2006-10-13 | 2009-09-15 | Applied Materials, Inc. | Detachable electrostatic chuck having sealing assembly |
| US8124429B2 (en) * | 2006-12-15 | 2012-02-28 | Richard Norman | Reprogrammable circuit board with alignment-insensitive support for multiple component contact types |
| US9202736B2 (en) * | 2007-07-31 | 2015-12-01 | Applied Materials, Inc. | Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing |
| US7558045B1 (en) * | 2008-03-20 | 2009-07-07 | Novellus Systems, Inc. | Electrostatic chuck assembly with capacitive sense feature, and related operating method |
| JP2011100889A (ja) * | 2009-11-06 | 2011-05-19 | Mitsui Eng & Shipbuild Co Ltd | 静電チャック、静電チャック製造方法、および静電チャック再生方法 |
| US8597448B2 (en) | 2009-12-29 | 2013-12-03 | Novellus Systems, Inc. | Electrostatic chucks and methods for refurbishing same |
-
2009
- 2009-12-29 US US12/648,638 patent/US8597448B2/en active Active
-
2010
- 2010-12-20 SG SG10201408733PA patent/SG10201408733PA/en unknown
- 2010-12-20 WO PCT/US2010/061348 patent/WO2011090650A2/en active Application Filing
- 2010-12-20 CN CN201080059991.0A patent/CN102696101B/zh active Active
- 2010-12-20 JP JP2012547130A patent/JP5769264B2/ja active Active
- 2010-12-20 KR KR1020127015127A patent/KR101821425B1/ko active Active
- 2010-12-20 SG SG2012040978A patent/SG181503A1/en unknown
- 2010-12-28 TW TW099146410A patent/TWI488257B/zh active
-
2013
- 2013-10-29 US US14/066,369 patent/US8968503B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120120165A (ko) | 2012-11-01 |
| KR101821425B1 (ko) | 2018-01-23 |
| CN102696101A (zh) | 2012-09-26 |
| US20140124123A1 (en) | 2014-05-08 |
| JP2013516084A (ja) | 2013-05-09 |
| TWI488257B (zh) | 2015-06-11 |
| US8597448B2 (en) | 2013-12-03 |
| WO2011090650A2 (en) | 2011-07-28 |
| SG181503A1 (en) | 2012-07-30 |
| WO2011090650A3 (en) | 2011-11-10 |
| US8968503B2 (en) | 2015-03-03 |
| US20110155299A1 (en) | 2011-06-30 |
| TW201138017A (en) | 2011-11-01 |
| CN102696101B (zh) | 2016-04-06 |
| JP5769264B2 (ja) | 2015-08-26 |
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