SG10201402096TA - Resist stripping compositions and methods for manufacturing electrical devices - Google Patents

Resist stripping compositions and methods for manufacturing electrical devices

Info

Publication number
SG10201402096TA
SG10201402096TA SG10201402096TA SG10201402096TA SG10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA SG 10201402096T A SG10201402096T A SG 10201402096TA
Authority
SG
Singapore
Prior art keywords
methods
electrical devices
resist stripping
manufacturing electrical
stripping compositions
Prior art date
Application number
SG10201402096TA
Other languages
English (en)
Inventor
Andreas Klipp
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG10201402096TA publication Critical patent/SG10201402096TA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • C11D3/30Amines; Substituted amines ; Quaternized amines
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/34Organic compounds containing sulfur
    • C11D3/3445Organic compounds containing sulfur containing sulfino groups, e.g. dimethyl sulfoxide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/0206Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
  • Weting (AREA)
SG10201402096TA 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices SG10201402096TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17616509P 2009-05-07 2009-05-07

Publications (1)

Publication Number Publication Date
SG10201402096TA true SG10201402096TA (en) 2014-10-30

Family

ID=42244549

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201402096TA SG10201402096TA (en) 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices
SG2011076452A SG175273A1 (en) 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2011076452A SG175273A1 (en) 2009-05-07 2010-04-20 Resist stripping compositions and methods for manufacturing electrical devices

Country Status (11)

Country Link
US (1) US9005367B2 (fr)
EP (1) EP2427803B1 (fr)
JP (1) JP5663562B2 (fr)
KR (1) KR101778313B1 (fr)
CN (1) CN102422228B (fr)
IL (1) IL215806A (fr)
MY (1) MY157093A (fr)
RU (1) RU2011149551A (fr)
SG (2) SG10201402096TA (fr)
TW (1) TWI494711B (fr)
WO (1) WO2010127942A1 (fr)

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CN103995441B (zh) * 2014-06-11 2019-05-31 深圳市华星光电技术有限公司 光阻剥离方法及光阻剥离装置
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US9650594B2 (en) * 2015-01-22 2017-05-16 Dynaloy, Llc Solutions and processes for removing substances from substrates
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US10072237B2 (en) * 2015-08-05 2018-09-11 Versum Materials Us, Llc Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
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EP3374443B1 (fr) * 2016-05-10 2020-01-08 ATOTECH Deutschland GmbH Composition de décapage non aqueuse et procédé de décapage d'un revêtement organique à partir d'un substrat
KR20180087624A (ko) 2017-01-25 2018-08-02 동우 화인켐 주식회사 레지스트 박리액 조성물
KR102224907B1 (ko) * 2018-04-17 2021-03-09 엘티씨 (주) 드라이필름 레지스트 박리액 조성물
US11180697B2 (en) 2018-11-19 2021-11-23 Versum Materials Us, Llc Etching solution having silicon oxide corrosion inhibitor and method of using the same
KR20200076778A (ko) 2018-12-19 2020-06-30 삼성전자주식회사 반도체 패키지의 제조방법
US20220056376A1 (en) * 2018-12-26 2022-02-24 3M Innovative Properties Company Removal of electroluminescenct materials for substrates
KR20220058094A (ko) 2020-10-30 2022-05-09 주식회사 이엔에프테크놀로지 포토레지스트 제거용 박리액 조성물
KR20220150134A (ko) * 2021-05-03 2022-11-10 삼성전자주식회사 포토레지스트 박리 조성물과 이를 이용하는 반도체 소자 및 반도체 패키지의 제조 방법
CN115216117B (zh) * 2022-09-21 2022-12-16 深圳市板明科技股份有限公司 一种线路板用改性塞孔树脂及其制备方法

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Also Published As

Publication number Publication date
MY157093A (en) 2016-04-29
TW201100981A (en) 2011-01-01
IL215806A0 (en) 2012-01-31
EP2427803B1 (fr) 2017-12-13
RU2011149551A (ru) 2013-06-20
WO2010127942A1 (fr) 2010-11-11
JP2012526374A (ja) 2012-10-25
KR20120023068A (ko) 2012-03-12
CN102422228A (zh) 2012-04-18
CN102422228B (zh) 2015-01-21
KR101778313B1 (ko) 2017-09-13
SG175273A1 (en) 2011-11-28
US9005367B2 (en) 2015-04-14
EP2427803A1 (fr) 2012-03-14
US20120040529A1 (en) 2012-02-16
JP5663562B2 (ja) 2015-02-04
IL215806A (en) 2017-08-31
TWI494711B (zh) 2015-08-01

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