SG102009A1 - Epoxy resin composition and process for producing the same - Google Patents

Epoxy resin composition and process for producing the same

Info

Publication number
SG102009A1
SG102009A1 SG200106284A SG200106284A SG102009A1 SG 102009 A1 SG102009 A1 SG 102009A1 SG 200106284 A SG200106284 A SG 200106284A SG 200106284 A SG200106284 A SG 200106284A SG 102009 A1 SG102009 A1 SG 102009A1
Authority
SG
Singapore
Prior art keywords
producing
same
resin composition
epoxy resin
epoxy
Prior art date
Application number
SG200106284A
Other languages
English (en)
Inventor
Murata Yasuyuki
Original Assignee
Japan Epoxy Resins Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Epoxy Resins Co Ltd filed Critical Japan Epoxy Resins Co Ltd
Publication of SG102009A1 publication Critical patent/SG102009A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145Compounds containing one epoxy group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • C08G59/245Di-epoxy compounds carbocyclic aromatic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Emergency Medicine (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
SG200106284A 2000-10-23 2001-10-12 Epoxy resin composition and process for producing the same SG102009A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000322630A JP2002128861A (ja) 2000-10-23 2000-10-23 エポキシ樹脂組成物及びその製法

Publications (1)

Publication Number Publication Date
SG102009A1 true SG102009A1 (en) 2004-02-27

Family

ID=18800475

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106284A SG102009A1 (en) 2000-10-23 2001-10-12 Epoxy resin composition and process for producing the same

Country Status (7)

Country Link
US (1) US6548620B2 (ko)
JP (1) JP2002128861A (ko)
KR (1) KR20020031316A (ko)
CN (1) CN1220729C (ko)
MY (1) MY117629A (ko)
SG (1) SG102009A1 (ko)
TW (1) TW555777B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002363254A (ja) * 2001-06-06 2002-12-18 Nippon Kayaku Co Ltd エポキシ化合物、エポキシ樹脂組成物及びその硬化物
JP4433368B2 (ja) * 2003-04-08 2010-03-17 ジャパンエポキシレジン株式会社 エポキシ樹脂粒状化物及びその製造方法
JP5607447B2 (ja) * 2010-07-22 2014-10-15 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置
JP6507506B2 (ja) * 2014-07-16 2019-05-08 住友ベークライト株式会社 封止用樹脂組成物及び半導体装置
KR102466597B1 (ko) * 2014-12-04 2022-11-11 미쯔비시 케미컬 주식회사 테트라메틸비페놀형 에폭시 수지, 에폭시 수지 조성물, 경화물 및 반도체 봉지재
JP2019104906A (ja) * 2017-12-12 2019-06-27 三菱ケミカル株式会社 エポキシ樹脂組成物、硬化物及び電気・電子部品
EP4375309A1 (en) * 2021-07-19 2024-05-29 Mitsubishi Chemical Corporation Phenol mixture, epoxy resin, epoxy resin composition, cured product, and electrical/electronic component
TW202402865A (zh) * 2022-06-14 2024-01-16 南韓商新亚T&C公司 四甲基雙酚型環氧樹脂以及其製備方法,四甲基雙酚型環氧樹脂組成物,固化物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817077A (ja) * 1981-07-22 1983-02-01 株式会社東芝 エレベ−タの群管理制御方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147725A (ja) 1984-08-16 1986-03-08 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JPH0621086B2 (ja) 1985-05-23 1994-03-23 三菱油化株式会社 3,3’,5,5’‐テトラメチル‐4,4’‐ジヒドロキシジフェニルの製造法
JPH0212225A (ja) 1988-06-30 1990-01-17 Nippon Mektron Ltd 電気泳動表示素子
US5844062A (en) * 1997-04-29 1998-12-01 Industrial Technology Research Institute Process for preparing phenolepoxy resins in the absence of an aqueous phase

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817077A (ja) * 1981-07-22 1983-02-01 株式会社東芝 エレベ−タの群管理制御方法

Also Published As

Publication number Publication date
KR20020031316A (ko) 2002-05-01
US6548620B2 (en) 2003-04-15
MY117629A (en) 2004-07-31
US20020077422A1 (en) 2002-06-20
CN1220729C (zh) 2005-09-28
TW555777B (en) 2003-10-01
CN1350032A (zh) 2002-05-22
JP2002128861A (ja) 2002-05-09

Similar Documents

Publication Publication Date Title
AU2001234176A1 (en) Conductive resin composition and process for producing the same
EP1114836A4 (en) RESIN-BASED COMPOSITION AND PROCESS FOR PRODUCING THE SAME
HK1070142A1 (en) Radiation-curable resin composition and rapid prototyping process using the same
WO2002015264A3 (de) Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung
AU4105501A (en) Woody formed article and method for producing the same
EP1275674A4 (en) EPOXY RESIN COMPOSITION AND PREPREG MADE FROM THIS COMPOSITION
EP1174484A4 (en) WATER AND OIL REPELLENT COMPOSITION AND METHOD FOR PRODUCING THE SAME
AU2408202A (en) Dimethyl terephthalate composition and process for producing the same
HK1047071A1 (en) Fiber reinforced epoxy resin product and method for the manufacture thereof
AU2002301311A1 (en) Polyacetal resin composition and process for producing the same
HK1059795A1 (en) Process for producing colored resin composition and utilization thereof.
SG106098A1 (en) Process for preparing epoxy resin
SG92831A1 (en) Polypropylene resin composition and process for producing the same
GB0122195D0 (en) Epoxy resin composition
EP1270647A4 (en) BRANCHED POLYOLEFIN, METHOD FOR THE PRODUCTION THEREOF, AND THE BRANCHED POLYOLEFIN-CONTAINING THERMOPLASTIC RESIN COMPOSITION
EP1369508A4 (en) RESIN COMPOSITIONS, MONOFILAMENTS, METHOD OF PRODUCTION AND FISHING LINES
GB0005106D0 (en) Improvements in the manufacture of resin impregnated components
SG101993A1 (en) Thermoplastic resin composition
EP1516890A4 (en) AQUEOUS RESIN DISPERSION COMPOSITION AND PROCESS FOR PRODUCING THE SAME
EP1437337A4 (en) 1,3-BUTYLENE GLYCOL AND METHOD FOR THE PRODUCTION THEREOF
AU2002226010A1 (en) Epoxy resins and process for making the same
AU2001275473A1 (en) Epoxy resing and process for making the same
SG102009A1 (en) Epoxy resin composition and process for producing the same
EP1426465A4 (en) PLATED RESIN MOLD BODY AND METHOD FOR THE PRODUCTION THEREOF
EP1153955A4 (en) POLYCARBONATE RESIN AND METHOD FOR THE PRODUCTION THEREOF