SE9904594D0 - Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav - Google Patents

Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav

Info

Publication number
SE9904594D0
SE9904594D0 SE9904594A SE9904594A SE9904594D0 SE 9904594 D0 SE9904594 D0 SE 9904594D0 SE 9904594 A SE9904594 A SE 9904594A SE 9904594 A SE9904594 A SE 9904594A SE 9904594 D0 SE9904594 D0 SE 9904594D0
Authority
SE
Sweden
Prior art keywords
module
power
power amplifier
power transistor
electrical connections
Prior art date
Application number
SE9904594A
Other languages
English (en)
Other versions
SE517852C2 (sv
SE9904594L (sv
Inventor
Lars-Anders Olofsson
Bengt Ahl
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9904594A priority Critical patent/SE517852C2/sv
Publication of SE9904594D0 publication Critical patent/SE9904594D0/sv
Priority to TW089104168A priority patent/TW469690B/zh
Priority to EP00989082A priority patent/EP1238429A1/en
Priority to JP2001545367A priority patent/JP2003517211A/ja
Priority to PCT/SE2000/002499 priority patent/WO2001045168A1/en
Priority to AU25630/01A priority patent/AU2563001A/en
Priority to CNB008172315A priority patent/CN1210797C/zh
Priority to US09/735,533 priority patent/US6501159B2/en
Publication of SE9904594L publication Critical patent/SE9904594L/sv
Publication of SE517852C2 publication Critical patent/SE517852C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SE9904594A 1999-12-15 1999-12-15 Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav SE517852C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9904594A SE517852C2 (sv) 1999-12-15 1999-12-15 Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav
TW089104168A TW469690B (en) 1999-12-15 2000-03-08 Power transistor module, power amplifier and method in the fabrication thereof
EP00989082A EP1238429A1 (en) 1999-12-15 2000-12-12 Power transistor module, power amplifier and method in the fabrication thereof
JP2001545367A JP2003517211A (ja) 1999-12-15 2000-12-12 電力用トランジスタモジュール、電力用増幅器、及びそれらの製造方法（１）
PCT/SE2000/002499 WO2001045168A1 (en) 1999-12-15 2000-12-12 Power transistor module, power amplifier and method in the fabrication thereof
AU25630/01A AU2563001A (en) 1999-12-15 2000-12-12 Power transistor module, power amplifier and method in the fabrication thereof
CNB008172315A CN1210797C (zh) 1999-12-15 2000-12-12 功率晶体管模块和功率放大器及其制造方法
US09/735,533 US6501159B2 (en) 1999-12-15 2000-12-14 Power transistor module, power amplifier and method in the fabrication thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9904594A SE517852C2 (sv) 1999-12-15 1999-12-15 Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav

Publications (3)

Publication Number Publication Date
SE9904594D0 true SE9904594D0 (sv) 1999-12-15
SE9904594L SE9904594L (sv) 2001-06-16
SE517852C2 SE517852C2 (sv) 2002-07-23

Family

ID=20418138

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9904594A SE517852C2 (sv) 1999-12-15 1999-12-15 Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav

Country Status (8)

Country Link
US (1) US6501159B2 (sv)
EP (1) EP1238429A1 (sv)
JP (1) JP2003517211A (sv)
CN (1) CN1210797C (sv)
AU (1) AU2563001A (sv)
SE (1) SE517852C2 (sv)
TW (1) TW469690B (sv)
WO (1) WO2001045168A1 (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633005B2 (en) * 2001-10-22 2003-10-14 Micro Mobio Corporation Multilayer RF amplifier module
US20080042221A1 (en) * 2006-08-15 2008-02-21 Liming Tsau High voltage transistor
US8138587B2 (en) 2008-09-30 2012-03-20 Infineon Technologies Ag Device including two mounting surfaces
JP5240155B2 (ja) * 2009-10-06 2013-07-17 三菱電機株式会社 実装回路基板
CN103390647A (zh) * 2012-05-10 2013-11-13 无锡华润上华半导体有限公司 一种功率mos器件结构
US10110178B2 (en) 2014-08-20 2018-10-23 Nxp Usa, Inc. Frequency selective isolation circuit and method for suppressing parametric oscillation
CN104432207A (zh) * 2014-12-01 2015-03-25 孙永锋 一种混合蛋的制作方法
WO2016094718A1 (en) * 2014-12-10 2016-06-16 Texas Instruments Incorporated Power field-effect transistor (fet), pre-driver, controller, and sense resistor integration
US9659847B2 (en) * 2015-09-18 2017-05-23 Nxp Usa, Inc. Terminal structure for active power device
DE102016108500B4 (de) * 2016-05-09 2023-12-14 Infineon Technologies Ag Verfahren zum Herstellen einer Halbleitervorrichtung mit einem Stützelement und eine Halbleitervorrichtung mit einem Stützelement
CN110088893B (zh) * 2017-08-02 2023-10-03 住友电工光电子器件创新株式会社 组装半导体器件的方法
US10875781B2 (en) 2018-03-28 2020-12-29 Gene Lee Hunsucker Phosphorus pentafluoride reactions
JP2021175073A (ja) * 2020-04-23 2021-11-01 株式会社村田製作所 高周波モジュールおよび通信装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2042802A (en) * 1979-02-14 1980-09-24 Ferranti Ltd Encapsulation of semiconductor devices
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
JPH0834312B2 (ja) * 1988-12-06 1996-03-29 富士電機株式会社 縦形電界効果トランジスタ
US5438305A (en) * 1991-08-12 1995-08-01 Hitachi, Ltd. High frequency module including a flexible substrate
JPH10294401A (ja) 1997-04-21 1998-11-04 Matsushita Electric Ind Co Ltd パッケージ及び半導体装置
DK174111B1 (da) * 1998-01-26 2002-06-24 Giga As Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
US6201701B1 (en) * 1998-03-11 2001-03-13 Kimball International, Inc. Integrated substrate with enhanced thermal characteristics
SE517455C2 (sv) * 1999-12-15 2002-06-11 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande för framställning därav

Also Published As

Publication number Publication date
WO2001045168A1 (en) 2001-06-21
SE517852C2 (sv) 2002-07-23
CN1210797C (zh) 2005-07-13
SE9904594L (sv) 2001-06-16
EP1238429A1 (en) 2002-09-11
JP2003517211A (ja) 2003-05-20
TW469690B (en) 2001-12-21
US20010004115A1 (en) 2001-06-21
AU2563001A (en) 2001-06-25
CN1411608A (zh) 2003-04-16
US6501159B2 (en) 2002-12-31

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