SE9904184L - Testfixtur - Google Patents

Testfixtur

Info

Publication number
SE9904184L
SE9904184L SE9904184A SE9904184A SE9904184L SE 9904184 L SE9904184 L SE 9904184L SE 9904184 A SE9904184 A SE 9904184A SE 9904184 A SE9904184 A SE 9904184A SE 9904184 L SE9904184 L SE 9904184L
Authority
SE
Sweden
Prior art keywords
printed circuit
module
sleeves
test fixture
contacting
Prior art date
Application number
SE9904184A
Other languages
Unknown language ( )
English (en)
Other versions
SE515298C2 (sv
SE9904184D0 (sv
Inventor
Are Bjoerneklett
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9904184A priority Critical patent/SE515298C2/sv
Publication of SE9904184D0 publication Critical patent/SE9904184D0/sv
Priority to PCT/SE2000/002131 priority patent/WO2001036984A1/en
Priority to AU15641/01A priority patent/AU1564101A/en
Priority to US09/711,079 priority patent/US6411113B1/en
Publication of SE9904184L publication Critical patent/SE9904184L/sv
Publication of SE515298C2 publication Critical patent/SE515298C2/sv

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SE9904184A 1999-11-19 1999-11-19 Testfixtur SE515298C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9904184A SE515298C2 (sv) 1999-11-19 1999-11-19 Testfixtur
PCT/SE2000/002131 WO2001036984A1 (en) 1999-11-19 2000-10-31 A test fixture
AU15641/01A AU1564101A (en) 1999-11-19 2000-10-31 A test fixture
US09/711,079 US6411113B1 (en) 1999-11-19 2000-11-14 Radio frequency test fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9904184A SE515298C2 (sv) 1999-11-19 1999-11-19 Testfixtur

Publications (3)

Publication Number Publication Date
SE9904184D0 SE9904184D0 (sv) 1999-11-19
SE9904184L true SE9904184L (sv) 2001-05-20
SE515298C2 SE515298C2 (sv) 2001-07-09

Family

ID=20417773

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9904184A SE515298C2 (sv) 1999-11-19 1999-11-19 Testfixtur

Country Status (4)

Country Link
US (1) US6411113B1 (sv)
AU (1) AU1564101A (sv)
SE (1) SE515298C2 (sv)
WO (1) WO2001036984A1 (sv)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1438591A1 (en) * 2001-10-10 2004-07-21 Delaware Capital Formation, Inc. Coaxial tilt pin fixture for testing high frequency circuit boards
GB2477358A (en) * 2010-02-02 2011-08-03 Thales Holdings Uk Plc RF testing an integrated circuit assembly during manufacture using a interposed adaptor layer which is removed after test to attach the IC to a BGA
CN108205081B (zh) * 2018-01-19 2024-04-02 桂林电子科技大学 一种用于微尺度焊球回波损耗测量的装置
CN111781431A (zh) * 2020-07-13 2020-10-16 芝纶自动化科技(上海)有限公司 一种测试装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5532983A (en) * 1992-12-30 1996-07-02 Intel Corporation Circuit design for point-to-point chip for high speed testing
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
US5859538A (en) * 1996-01-31 1999-01-12 Hewlett-Packard Company Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both
US5955888A (en) * 1997-09-10 1999-09-21 Xilinx, Inc. Apparatus and method for testing ball grid array packaged integrated circuits
US6246011B1 (en) * 1998-12-02 2001-06-12 Nortel Networks Limited Solder joint reliability
US6218729B1 (en) * 1999-03-11 2001-04-17 Atmel Corporation Apparatus and method for an integrated circuit having high Q reactive components

Also Published As

Publication number Publication date
SE515298C2 (sv) 2001-07-09
WO2001036984A1 (en) 2001-05-25
AU1564101A (en) 2001-05-30
SE9904184D0 (sv) 1999-11-19
US6411113B1 (en) 2002-06-25

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Legal Events

Date Code Title Description
NUG Patent has lapsed