SE9900840L - Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden - Google Patents

Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden

Info

Publication number
SE9900840L
SE9900840L SE9900840A SE9900840A SE9900840L SE 9900840 L SE9900840 L SE 9900840L SE 9900840 A SE9900840 A SE 9900840A SE 9900840 A SE9900840 A SE 9900840A SE 9900840 L SE9900840 L SE 9900840L
Authority
SE
Sweden
Prior art keywords
heat dissipation
circuit boards
made according
producing circuit
laminate
Prior art date
Application number
SE9900840A
Other languages
English (en)
Other versions
SE9900840D0 (sv
SE513786C2 (sv
Inventor
Leif Bergstedt
Per Ligander
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9900840A priority Critical patent/SE513786C2/sv
Publication of SE9900840D0 publication Critical patent/SE9900840D0/sv
Priority to AU36883/00A priority patent/AU3688300A/en
Priority to PCT/SE2000/000432 priority patent/WO2000054560A1/en
Priority to US09/520,840 priority patent/US6459585B1/en
Publication of SE9900840L publication Critical patent/SE9900840L/sv
Publication of SE513786C2 publication Critical patent/SE513786C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
SE9900840A 1999-03-09 1999-03-09 Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden SE513786C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9900840A SE513786C2 (sv) 1999-03-09 1999-03-09 Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden
AU36883/00A AU3688300A (en) 1999-03-09 2000-03-03 A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
PCT/SE2000/000432 WO2000054560A1 (en) 1999-03-09 2000-03-03 A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
US09/520,840 US6459585B1 (en) 1999-03-09 2000-03-08 Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9900840A SE513786C2 (sv) 1999-03-09 1999-03-09 Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden

Publications (3)

Publication Number Publication Date
SE9900840D0 SE9900840D0 (sv) 1999-03-09
SE9900840L true SE9900840L (sv) 2000-09-10
SE513786C2 SE513786C2 (sv) 2000-11-06

Family

ID=20414773

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9900840A SE513786C2 (sv) 1999-03-09 1999-03-09 Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden

Country Status (4)

Country Link
US (1) US6459585B1 (sv)
AU (1) AU3688300A (sv)
SE (1) SE513786C2 (sv)
WO (1) WO2000054560A1 (sv)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100815653B1 (ko) * 2000-05-08 2008-03-20 브라이엄 영 유니버시티 마찰교반용접 도구 및 마찰교반용접하기 위한 방법
CN100352317C (zh) * 2002-06-07 2007-11-28 松下电器产业株式会社 电子元件安装板、电子元件模块、制造电子元件安装板的方法及通信设备
ES2328018T3 (es) 2002-09-02 2009-11-06 EBERSPACHER CATEM GMBH & CO. KG Calefaccion electrica para vehiculos a motor.
US20050098613A1 (en) * 2003-11-07 2005-05-12 Barker William W. Method for diffusion bond welding for use in a multilayer electronic assembly
JP4308716B2 (ja) * 2004-06-09 2009-08-05 新光電気工業株式会社 半導体パッケージの製造方法
TWI279175B (en) * 2005-07-21 2007-04-11 Phoenix Prec Technology Corp Circuit board structure and method for fabricating the same
KR100771291B1 (ko) * 2006-05-24 2007-10-29 삼성전기주식회사 방열기판 및 그 제조방법
US8248803B2 (en) * 2010-03-31 2012-08-21 Hong Kong Applied Science and Technology Research Institute Company Limited Semiconductor package and method of manufacturing the same
JP2016015432A (ja) * 2014-07-03 2016-01-28 イビデン株式会社 回路基板及びその製造方法
US10433413B2 (en) * 2014-08-15 2019-10-01 Unimicron Technology Corp. Manufacturing method of circuit structure embedded with heat-dissipation block
JP2017162913A (ja) * 2016-03-08 2017-09-14 イビデン株式会社 配線板及びその製造方法
CN113966067A (zh) * 2020-07-20 2022-01-21 宏恒胜电子科技（淮安）有限公司 线路板及其制作方法
CN112566362A (zh) * 2020-12-11 2021-03-26 乐健科技（珠海）有限公司 高载流高导热电路板及其制作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1153476A (en) 1980-09-22 1983-09-06 Legrand D. Feeley Axial lead heat sink
US4387413A (en) 1980-12-24 1983-06-07 Rca Corporation Semiconductor apparatus with integral heat sink tab
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4577402A (en) * 1984-06-13 1986-03-25 Penn Engineering & Manufacturing Corp. Stud for mounting and method of mounting heat sinks on printed circuit boards
JP2603102B2 (ja) 1988-05-12 1997-04-23 イビデン株式会社 電子部品搭載用基板の製造方法
US5311407A (en) 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
JP3079773B2 (ja) 1992-05-15 2000-08-21 富士通株式会社 熱伝導スペーサーの実装構造
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
DE69225896T2 (de) * 1992-12-15 1998-10-15 St Microelectronics Srl Träger für Halbleitergehäuse
US5617294A (en) * 1995-09-29 1997-04-01 Intel Corporation Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
US5920458A (en) * 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element

Also Published As

Publication number Publication date
SE9900840D0 (sv) 1999-03-09
WO2000054560A1 (en) 2000-09-14
US6459585B1 (en) 2002-10-01
SE513786C2 (sv) 2000-11-06
AU3688300A (en) 2000-09-28

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