SE9704894D0 - Method of producing a printed board assembly and a shielding element for shielding components on a printed board assembly - Google Patents

Method of producing a printed board assembly and a shielding element for shielding components on a printed board assembly

Info

Publication number
SE9704894D0
SE9704894D0 SE9704894A SE9704894A SE9704894D0 SE 9704894 D0 SE9704894 D0 SE 9704894D0 SE 9704894 A SE9704894 A SE 9704894A SE 9704894 A SE9704894 A SE 9704894A SE 9704894 D0 SE9704894 D0 SE 9704894D0
Authority
SE
Sweden
Prior art keywords
printed board
board assembly
components
shielding
producing
Prior art date
Application number
SE9704894A
Other languages
English (en)
Other versions
SE9704894L (sv
SE511330C2 (sv
Inventor
Per Holmberg
Tommy Sandevi
Daniel Friman
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9704894A priority Critical patent/SE511330C2/sv
Publication of SE9704894D0 publication Critical patent/SE9704894D0/sv
Priority to MYPI98005682A priority patent/MY120468A/en
Priority to JP2000527133A priority patent/JP2002500449A/ja
Priority to EEP200000406A priority patent/EE03794B1/xx
Priority to PCT/SE1998/002385 priority patent/WO1999034659A1/en
Priority to CN98812135A priority patent/CN1281630A/zh
Priority to KR1020007007304A priority patent/KR20010033777A/ko
Priority to BR9814535-5A priority patent/BR9814535A/pt
Priority to HU0100628A priority patent/HUP0100628A2/hu
Priority to AU21933/99A priority patent/AU743764B2/en
Priority to EP98965921A priority patent/EP1042947A1/en
Priority to US09/221,519 priority patent/US6263564B1/en
Publication of SE9704894L publication Critical patent/SE9704894L/sv
Publication of SE511330C2 publication Critical patent/SE511330C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE9704894A 1997-12-29 1997-12-29 Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort SE511330C2 (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9704894A SE511330C2 (sv) 1997-12-29 1997-12-29 Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort
MYPI98005682A MY120468A (en) 1997-12-29 1998-12-16 Method of producing a printed board assembly and a shielding element for shielding components on a printed board assembly.
EP98965921A EP1042947A1 (en) 1997-12-29 1998-12-18 A method of shielding a printed board assembly with at least one component and a shielding element for shielding components on such a printed board assembly
KR1020007007304A KR20010033777A (ko) 1997-12-29 1998-12-18 최소한 하나의 구성요소를 가지는 인쇄 기판 조립품을차폐하는 방법과 인쇄기판 조립품의 구성요소를 차폐하기위한 차폐 소자
EEP200000406A EE03794B1 (et) 1997-12-29 1998-12-18 Meetod vähemalt ühe komponendiga trükkplaadi varjestamiseks ja varjestuselement sellel trükkplaadilolevate komponentide varjestamiseks
PCT/SE1998/002385 WO1999034659A1 (en) 1997-12-29 1998-12-18 A method of shielding a printed board assembly with at least one component and a shielding element for shielding components on such a printed board assembly
CN98812135A CN1281630A (zh) 1997-12-29 1998-12-18 屏蔽具有至少一个部件的印刷板组件的方法和用于屏蔽在这种印刷板组件上的部件的屏蔽元件
JP2000527133A JP2002500449A (ja) 1997-12-29 1998-12-18 少なくとも一つの電気素子を具備したプリント基板組立体を遮へいする方法および同プリント基板組立体上の素子を遮へいするための遮へい要素
BR9814535-5A BR9814535A (pt) 1997-12-29 1998-12-18 Processo para produzir uma montagem de placa de circuito impresso a partir de uma placa de circuito impresso, e, elemento de blindagem
HU0100628A HUP0100628A2 (hu) 1997-12-29 1998-12-18 Eljárás szerelt nyomtatott áramköri lemez előállítására, valamint árnyékolóelem szerelt nyomtatott áramköri lemezen elhelyezett alkatrész árnyékolására
AU21933/99A AU743764B2 (en) 1997-12-29 1998-12-18 A method of shielding a printed board assembly with at least one component and a shielding element for shielding components on such a printed board assembly
US09/221,519 US6263564B1 (en) 1997-12-29 1998-12-28 Method of producing a printed board assembly and a shielding element for shielding components on a printed board assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9704894A SE511330C2 (sv) 1997-12-29 1997-12-29 Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort

Publications (3)

Publication Number Publication Date
SE9704894D0 true SE9704894D0 (sv) 1997-12-29
SE9704894L SE9704894L (sv) 1999-06-30
SE511330C2 SE511330C2 (sv) 1999-09-13

Family

ID=20409595

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9704894A SE511330C2 (sv) 1997-12-29 1997-12-29 Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort

Country Status (12)

Country Link
US (1) US6263564B1 (sv)
EP (1) EP1042947A1 (sv)
JP (1) JP2002500449A (sv)
KR (1) KR20010033777A (sv)
CN (1) CN1281630A (sv)
AU (1) AU743764B2 (sv)
BR (1) BR9814535A (sv)
EE (1) EE03794B1 (sv)
HU (1) HUP0100628A2 (sv)
MY (1) MY120468A (sv)
SE (1) SE511330C2 (sv)
WO (1) WO1999034659A1 (sv)

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* Cited by examiner, † Cited by third party
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TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
JP3714088B2 (ja) * 1999-02-18 2005-11-09 株式会社村田製作所 電子部品及びその製造方法
JP2001237585A (ja) * 2000-02-22 2001-08-31 Murata Mfg Co Ltd 電子部品及びその製造方法
EP1198164A1 (en) * 2000-10-11 2002-04-17 Telefonaktiebolaget L M Ericsson (Publ) A method of making a gasket on a PCB and a PCB.
AU2002214013A1 (en) * 2000-10-11 2002-04-22 Telefonaktiebolager L M Ericsson (Publ) A method of making a gasket on a pcb and a pcb
SE0100855L (sv) * 2001-03-12 2002-04-09 Nolato Silikonteknik Ab Anordning för elektromagnetisk skärmning samt förfarande för framställning därav
ATE376763T1 (de) * 2003-02-07 2007-11-15 Sony Ericsson Mobile Comm Ab Abschirmdeckel zur abschirmung von elektronischen bauteilen auf einer leiterplatte
JP5685098B2 (ja) * 2011-01-28 2015-03-18 京セラケミカル株式会社 電子部品の製造方法
KR20120110435A (ko) * 2011-03-29 2012-10-10 삼성전기주식회사 Ｒｆ 모듈 차폐 방법 및 이를 이용한 ｒｆ 통신 모듈
CN102365013A (zh) * 2011-10-20 2012-02-29 镇江船舶电器有限责任公司 屏蔽电磁泄漏的电器箱柜
WO2016144039A1 (en) 2015-03-06 2016-09-15 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
US10477737B2 (en) * 2016-05-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method of a hollow shielding structure for circuit elements
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
KR102551657B1 (ko) 2016-12-12 2023-07-06 삼성전자주식회사 전자파 차폐구조 및 그 제조방법
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
KR102373931B1 (ko) 2017-09-08 2022-03-14 삼성전자주식회사 전자파 차폐구조
US11297718B2 (en) * 2020-06-30 2022-04-05 Gentherm Gmbh Methods of manufacturing flex circuits with mechanically formed conductive traces
US11792913B2 (en) * 2022-10-13 2023-10-17 Google Llc Mitigation of physical impact-induced mechanical stress damage to printed circuit boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001629A (en) * 1974-08-26 1977-01-04 Panel Technology, Inc. Segmented gas discharge display panel
US4157007A (en) * 1976-12-22 1979-06-05 National Semiconductor Corporation Asymmetric digital watch module
US4714905A (en) * 1986-10-08 1987-12-22 K & L Microwave SMC filter and method of manufacture thereof
US4945633A (en) * 1989-03-01 1990-08-07 Nokia-Mobira Oy Method of mounting a printed circuit board and securing the earthing to a casing
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
FI915242A (fi) * 1991-11-06 1993-05-07 Nokia Mobile Phones Ltd Rf-skaermning av kretskort
US5318651A (en) * 1991-11-27 1994-06-07 Nec Corporation Method of bonding circuit boards
FR2687153B1 (fr) * 1992-02-07 1994-05-13 Hoechst Ste Francaise Procede de preparation de la (thenyl-2)-5 hydantouine.
JPH06296080A (ja) * 1993-04-08 1994-10-21 Sony Corp 電子部品実装基板及び電子部品実装方法
DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
US5975408A (en) * 1997-10-23 1999-11-02 Lucent Technologies Inc. Solder bonding of electrical components
US6090728A (en) * 1998-05-01 2000-07-18 3M Innovative Properties Company EMI shielding enclosures

Also Published As

Publication number Publication date
AU743764B2 (en) 2002-02-07
EE200000406A (et) 2001-12-17
EP1042947A1 (en) 2000-10-11
JP2002500449A (ja) 2002-01-08
AU2193399A (en) 1999-07-19
SE9704894L (sv) 1999-06-30
CN1281630A (zh) 2001-01-24
US6263564B1 (en) 2001-07-24
MY120468A (en) 2005-10-31
SE511330C2 (sv) 1999-09-13
KR20010033777A (ko) 2001-04-25
EE03794B1 (et) 2002-06-17
HUP0100628A2 (hu) 2001-07-30
WO1999034659A1 (en) 1999-07-08
BR9814535A (pt) 2000-10-17

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