CN1281630A - 屏蔽具有至少一个部件的印刷板组件的方法和用于屏蔽在这种印刷板组件上的部件的屏蔽元件 - Google Patents
屏蔽具有至少一个部件的印刷板组件的方法和用于屏蔽在这种印刷板组件上的部件的屏蔽元件 Download PDFInfo
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- CN1281630A CN1281630A CN98812135A CN98812135A CN1281630A CN 1281630 A CN1281630 A CN 1281630A CN 98812135 A CN98812135 A CN 98812135A CN 98812135 A CN98812135 A CN 98812135A CN 1281630 A CN1281630 A CN 1281630A
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- Prior art keywords
- shielding
- printed board
- board assembly
- parts
- conductor
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- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000001723 curing Methods 0.000 abstract 1
- 238000013007 heat curing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 238000012216 screening Methods 0.000 description 3
- 208000034189 Sclerosis Diseases 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
- H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
在由印刷板(1,2,3,4)生产印刷板组件的方法中,通过炉内焊接将部件(7)焊接到印刷板上。在要屏蔽的部件进行炉内焊接的点周围淀积热固化的线(6),该线(6)为一种导电材料并且在固化后有弹性。在炉内焊接的步骤中将该线(6)固化为屏蔽垫圈,即该步骤与将部件(7)焊接到印刷板的生产步骤相同。屏蔽垫圈与屏蔽壳体(8,9)相配合以屏蔽部件(7)。
Description
一般地说，本发明涉及在印刷板组件上的部件的屏蔽，更具体地说，涉及一种生产一种具有屏蔽装置的印刷板组件的方法，以及一种与在印刷板组件上的屏蔽装置相配合以对在印刷板组件上的部件进行电屏蔽的屏蔽元件。
从GB-2261324-A中我们可以得知，通过将屏蔽材料应用于在印刷板上的导体来屏蔽印刷板组件，然后根据屏蔽材料的具体情况例如通过UV光(紫外光)的方式使其硬化。要使在印刷板上的屏蔽材料与屏蔽壳体相配合，就必须在该壳体上形成凹槽或凹口，以提高密封性并改善与在印刷板上的屏蔽材料的接触。
将屏蔽材料应用在已经生产的印刷板组件上，这要通过一附加的加工步骤，使分离的屏蔽材料硬化。
因此，生产依据GB-2261324-A的印刷板组件将会十分昂贵。
本发明的目的是提供一种具有屏蔽装置的印刷板组件的生产方法，该方法比迄今所知的方法都更成本低廉且简单。
依据本发明，该方法是按如下方案实现的：在炉内焊接步骤中在将部件焊接到印刷板上的导体上之前，在将需要电屏蔽的至少一个部件进行炉内焊接到印刷板的点周围沉积一种导电材料且热固化的线(string)，并且在与将部件通过炉内焊接到在印刷板上的导体上相同的步骤中将所说的线进行固化以形成屏蔽衬垫。
因此，通过相同的工艺步骤而不是在不同的工艺步骤中进行固化和焊接，极大地节省了生产成本。
下文参考附图更详细地描述本发明，其中：
图1-4中说明了依据本发明的生产印刷板组件的方法的不同阶段；
图5所示为在图4中的印刷板组件的剖面图，该印刷板组件具有依据本发明的屏蔽元件。
图1所示为印刷板1的一个实施例的局部横截面图，在该印刷板1的一侧具有导体2和导体3(包围导体2)的分布模式，在其另一侧具有导电材料层4。导体2和3以及层4一般为铜。在通常情况下壳体中并不需要导体3，但可取的是具有它。
在图1中所示的实施例中，假设将需要屏蔽的部件都焊接在导体2上，同时假设导体3具有屏蔽衬垫。
在图2中，在要屏蔽的电子部件将要焊接到导体2的点上在印刷板1上的导体2已经具有焊料层5。
在图3中，热固化线6为一种导电材料，在固化后有弹性，在印刷板1上的且在包围在导体2的周围的导体3上已经沉积了固化线6，该导体2已经具有焊料层5。
在图4中，将要屏蔽的两个部件7已经放在焊料层5上，以焊接到导体2上。
这里，值得指出的是，作为一种变型，也可以在印刷板1上的导体3上沉积线6之前将部件7同样地放在焊料层5上。
然后如图4所示将印刷板1送入焊接炉内以使将部件7在炉内焊接到导体2，并且在一个相同的步骤中使热固化材料线6固化，使其成为弹性屏蔽垫圈。
在图5中，依据本发明具有固化线或屏蔽垫圈的整个印刷板组件具有屏蔽元件8，结合在印刷板1上的导体层4和屏蔽垫圈6，屏蔽元件8对部件7进行屏蔽。
从图5中可明显看出，依据本发明屏蔽元件8具有容纳部件7的隔室。屏蔽元件8的边沿9具有与弹性的导电的屏蔽垫圈6相配合的形状。最后，依据本发明边沿9具有如图5所示的尖端。边沿9可以是刀刃状或是锯齿状或其它尖形。
当然，可以理解的是屏蔽元件8可以不止一个。屏蔽元件可以是导电材料或具有导电材料层的绝缘包层。通过将部件焊接到印刷板上的步骤和使沉积在印刷板上的屏蔽垫圈固化的步骤相结合，降低了整个的印刷板组件的生产成本。
Claims (5)
1.一种由印刷板(1，2，3，4)生产印刷板组件的方法，包括如下步骤：
-在印刷板上的导体(2)上在要焊接电子部件到导体(2)上的点上沉积焊料(5)，
-在所说的点上放置所说的部件(7)，和
-将所说的部件(7)炉内焊接到导体(2)，其特征在于
-在将要屏蔽的至少一个部件进行炉内焊接的点的周围沉积热固化线(6)，该热固化线(6)为一种导电材料并且在固化后具有弹性，和
-在与要屏蔽的至少一个部件进行炉内焊接的步骤相同的步骤中，固化所说的线(6)以将其变为弹性屏蔽垫圈，使该弹性屏蔽垫圈与屏蔽元件(8，9)相配合以屏蔽所说的至少一个部件(7)。
2.如权利要求1所述的方法，其特征在于所说的固化线(6)沉积在围绕所说的点的导体(3)上。
3.一种屏蔽在印刷板组件上的至少一个部件(7)的屏蔽元件，该屏蔽元件(8)具有容纳至少一个部件(7)的至少一个隔室，所说的至少一个隔室的边沿(9)与有弹性的且导电的垫圈(6)相配合，该垫圈(6)沉积在围绕所说的至少一个要屏蔽的部件(7)的周围的印刷板组件上，其特征在于所说的边沿(9)为尖形。
4.如权利要求3所述的屏蔽元件，其特征在于所说的边沿(9)为刀刃形。
5.如权利要求3所述的屏蔽元件，其特征在于所说的边沿(9)为锯齿形。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9704894A SE511330C2 (sv) | 1997-12-29 | 1997-12-29 | Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort |
| SE97048946 | 1997-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1281630A true CN1281630A (zh) | 2001-01-24 |
Family
ID=20409595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98812135A Pending CN1281630A (zh) | 1997-12-29 | 1998-12-18 | 屏蔽具有至少一个部件的印刷板组件的方法和用于屏蔽在这种印刷板组件上的部件的屏蔽元件 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6263564B1 (zh) |
| EP (1) | EP1042947A1 (zh) |
| JP (1) | JP2002500449A (zh) |
| KR (1) | KR20010033777A (zh) |
| CN (1) | CN1281630A (zh) |
| AU (1) | AU743764B2 (zh) |
| BR (1) | BR9814535A (zh) |
| EE (1) | EE03794B1 (zh) |
| HU (1) | HUP0100628A2 (zh) |
| MY (1) | MY120468A (zh) |
| SE (1) | SE511330C2 (zh) |
| WO (1) | WO1999034659A1 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100423625C (zh) * | 2003-02-07 | 2008-10-01 | 索尼爱立信移动通讯股份有限公司 | 用于屏蔽印刷电路板上电子元件的屏蔽盒 |
| CN102365013A (zh) * | 2011-10-20 | 2012-02-29 | 镇江船舶电器有限责任公司 | 屏蔽电磁泄漏的电器箱柜 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW486238U (en) * | 1996-08-18 | 2002-05-01 | Helmut Kahl | Shielding cap |
| JP3714088B2 (ja) * | 1999-02-18 | 2005-11-09 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP2001237585A (ja) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
| EP1198164A1 (en) * | 2000-10-11 | 2002-04-17 | Telefonaktiebolaget L M Ericsson (Publ) | A method of making a gasket on a PCB and a PCB. |
| AU2002214013A1 (en) * | 2000-10-11 | 2002-04-22 | Telefonaktiebolager L M Ericsson (Publ) | A method of making a gasket on a pcb and a pcb |
| SE0100855L (sv) * | 2001-03-12 | 2002-04-09 | Nolato Silikonteknik Ab | Anordning för elektromagnetisk skärmning samt förfarande för framställning därav |
| JP5685098B2 (ja) * | 2011-01-28 | 2015-03-18 | 京セラケミカル株式会社 | 電子部品の製造方法 |
| KR20120110435A (ko) * | 2011-03-29 | 2012-10-10 | 삼성전기주식회사 | Ｒｆ 모듈 차폐 방법 및 이를 이용한 ｒｆ 통신 모듈 |
| WO2016144039A1 (en) | 2015-03-06 | 2016-09-15 | Samsung Electronics Co., Ltd. | Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof |
| US10477737B2 (en) | 2016-05-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method of a hollow shielding structure for circuit elements |
| US10477687B2 (en) | 2016-08-04 | 2019-11-12 | Samsung Electronics Co., Ltd. | Manufacturing method for EMI shielding structure |
| KR102551657B1 (ko) | 2016-12-12 | 2023-07-06 | 삼성전자주식회사 | 전자파 차폐구조 및 그 제조방법 |
| US10594020B2 (en) | 2017-07-19 | 2020-03-17 | Samsung Electronics Co., Ltd. | Electronic device having antenna element and method for manufacturing the same |
| KR102373931B1 (ko) | 2017-09-08 | 2022-03-14 | 삼성전자주식회사 | 전자파 차폐구조 |
| US11297718B2 (en) * | 2020-06-30 | 2022-04-05 | Gentherm Gmbh | Methods of manufacturing flex circuits with mechanically formed conductive traces |
| US11792913B2 (en) * | 2022-10-13 | 2023-10-17 | Google Llc | Mitigation of physical impact-induced mechanical stress damage to printed circuit boards |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4001629A (en) * | 1974-08-26 | 1977-01-04 | Panel Technology, Inc. | Segmented gas discharge display panel |
| US4157007A (en) * | 1976-12-22 | 1979-06-05 | National Semiconductor Corporation | Asymmetric digital watch module |
| US4714905A (en) * | 1986-10-08 | 1987-12-22 | K & L Microwave | SMC filter and method of manufacture thereof |
| US4945633A (en) * | 1989-03-01 | 1990-08-07 | Nokia-Mobira Oy | Method of mounting a printed circuit board and securing the earthing to a casing |
| JP2657429B2 (ja) * | 1990-04-09 | 1997-09-24 | 株式会社ミクロ技術研究所 | 基板の回路実装方法及びその方法に使用する回路基板 |
| FI915242A (fi) * | 1991-11-06 | 1993-05-07 | Nokia Mobile Phones Ltd | Rf-skaermning av kretskort |
| US5318651A (en) * | 1991-11-27 | 1994-06-07 | Nec Corporation | Method of bonding circuit boards |
| FR2687153B1 (fr) * | 1992-02-07 | 1994-05-13 | Hoechst Ste Francaise | Procede de preparation de la (thenyl-2)-5 hydantouine. |
| JPH06296080A (ja) * | 1993-04-08 | 1994-10-21 | Sony Corp | 電子部品実装基板及び電子部品実装方法 |
| DE4340108C3 (de) * | 1993-11-22 | 2003-08-14 | Emi Tec Elektronische Material | Abschirmelement und Verfahren zu dessen Herstellung |
| US5761053A (en) * | 1996-05-08 | 1998-06-02 | W. L. Gore & Associates, Inc. | Faraday cage |
| US5975408A (en) * | 1997-10-23 | 1999-11-02 | Lucent Technologies Inc. | Solder bonding of electrical components |
| US6090728A (en) * | 1998-05-01 | 2000-07-18 | 3M Innovative Properties Company | EMI shielding enclosures |
-
1997
- 1997-12-29 SE SE9704894A patent/SE511330C2/sv not_active IP Right Cessation
-
1998
- 1998-12-16 MY MYPI98005682A patent/MY120468A/en unknown
- 1998-12-18 HU HU0100628A patent/HUP0100628A2/hu unknown
- 1998-12-18 JP JP2000527133A patent/JP2002500449A/ja active Pending
- 1998-12-18 KR KR1020007007304A patent/KR20010033777A/ko not_active Application Discontinuation
- 1998-12-18 EP EP98965921A patent/EP1042947A1/en not_active Withdrawn
- 1998-12-18 WO PCT/SE1998/002385 patent/WO1999034659A1/en not_active Application Discontinuation
- 1998-12-18 BR BR9814535-5A patent/BR9814535A/pt not_active IP Right Cessation
- 1998-12-18 AU AU21933/99A patent/AU743764B2/en not_active Ceased
- 1998-12-18 CN CN98812135A patent/CN1281630A/zh active Pending
- 1998-12-18 EE EEP200000406A patent/EE03794B1/xx not_active IP Right Cessation
- 1998-12-28 US US09/221,519 patent/US6263564B1/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100423625C (zh) * | 2003-02-07 | 2008-10-01 | 索尼爱立信移动通讯股份有限公司 | 用于屏蔽印刷电路板上电子元件的屏蔽盒 |
| CN102365013A (zh) * | 2011-10-20 | 2012-02-29 | 镇江船舶电器有限责任公司 | 屏蔽电磁泄漏的电器箱柜 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU743764B2 (en) | 2002-02-07 |
| EE03794B1 (et) | 2002-06-17 |
| SE9704894L (sv) | 1999-06-30 |
| JP2002500449A (ja) | 2002-01-08 |
| EE200000406A (et) | 2001-12-17 |
| KR20010033777A (ko) | 2001-04-25 |
| SE511330C2 (sv) | 1999-09-13 |
| HUP0100628A2 (hu) | 2001-07-30 |
| WO1999034659A1 (en) | 1999-07-08 |
| EP1042947A1 (en) | 2000-10-11 |
| AU2193399A (en) | 1999-07-19 |
| MY120468A (en) | 2005-10-31 |
| SE9704894D0 (sv) | 1997-12-29 |
| US6263564B1 (en) | 2001-07-24 |
| BR9814535A (pt) | 2000-10-17 |
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