BR9814535A - Processo para produzir uma montagem de placa de circuito impresso a partir de uma placa de circuito impresso, e, elemento de blindagem - Google Patents

Processo para produzir uma montagem de placa de circuito impresso a partir de uma placa de circuito impresso, e, elemento de blindagem

Info

Publication number
BR9814535A
BR9814535A BR9814535-5A BR9814535A BR9814535A BR 9814535 A BR9814535 A BR 9814535A BR 9814535 A BR9814535 A BR 9814535A BR 9814535 A BR9814535 A BR 9814535A
Authority
BR
Brazil
Prior art keywords
circuit board
printed circuit
components
producing
shielding element
Prior art date
Application number
BR9814535-5A
Other languages
English (en)
Inventor
Per Holmberg
Tommy Sandevi
Daniel Friman
Original Assignee
Telefonaktibolaget Lm Ericsson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktibolaget Lm Ericsson filed Critical Telefonaktibolaget Lm Ericsson
Publication of BR9814535A publication Critical patent/BR9814535A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

"PROCESSO PARA PRODUZIR UMA MONTAGEM DE PLACA DE CIRCUITO IMPRESSO A PARTIR DE UMA PLACA DE CIRCUITO IMPRESSO, E, ELEMENTO DE BLINDAGEM" Em um processo de produzir uma montagem de placa de circuito impresso de uma placa de circuito impresso (1, 2, 3, 4), componentes (7) são soldados em forno com solda branca à placa de circuito impresso. Um filete (6) de material eletricamente condutivo de cura por calor, elástico depois de cura, é depositado ao redor do local onde os componentes (7) a serem blindados, estão para serem soldados em forno com solda branca. Aquele filete (6) é curado em uma gaxeta de blindagem na etapa de soldagem em forno com solda branca, isto é na mesma etapa de produção como os componentes (7) são soldados com solda branca à placa de circuito impresso. A gaxeta de blindagem é adaptada para cooperar com um alojamento de blindagem (8, 9) para blindar os componentes (7).
BR9814535-5A 1997-12-29 1998-12-18 Processo para produzir uma montagem de placa de circuito impresso a partir de uma placa de circuito impresso, e, elemento de blindagem BR9814535A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9704894A SE511330C2 (sv) 1997-12-29 1997-12-29 Förfarande för framställning av ett kretskort jämte skärmningselement för skärmning av komponenter på ett dylikt kretskort
PCT/SE1998/002385 WO1999034659A1 (en) 1997-12-29 1998-12-18 A method of shielding a printed board assembly with at least one component and a shielding element for shielding components on such a printed board assembly

Publications (1)

Publication Number Publication Date
BR9814535A true BR9814535A (pt) 2000-10-17

Family

ID=20409595

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9814535-5A BR9814535A (pt) 1997-12-29 1998-12-18 Processo para produzir uma montagem de placa de circuito impresso a partir de uma placa de circuito impresso, e, elemento de blindagem

Country Status (12)

Country Link
US (1) US6263564B1 (pt)
EP (1) EP1042947A1 (pt)
JP (1) JP2002500449A (pt)
KR (1) KR20010033777A (pt)
CN (1) CN1281630A (pt)
AU (1) AU743764B2 (pt)
BR (1) BR9814535A (pt)
EE (1) EE03794B1 (pt)
HU (1) HUP0100628A2 (pt)
MY (1) MY120468A (pt)
SE (1) SE511330C2 (pt)
WO (1) WO1999034659A1 (pt)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW486238U (en) * 1996-08-18 2002-05-01 Helmut Kahl Shielding cap
JP3714088B2 (ja) * 1999-02-18 2005-11-09 株式会社村田製作所 電子部品及びその製造方法
JP2001237585A (ja) * 2000-02-22 2001-08-31 Murata Mfg Co Ltd 電子部品及びその製造方法
EP1198164A1 (en) * 2000-10-11 2002-04-17 Telefonaktiebolaget L M Ericsson (Publ) A method of making a gasket on a PCB and a PCB.
AU2002214013A1 (en) * 2000-10-11 2002-04-22 Telefonaktiebolager L M Ericsson (Publ) A method of making a gasket on a pcb and a pcb
SE0100855L (sv) * 2001-03-12 2002-04-09 Nolato Silikonteknik Ab Anordning för elektromagnetisk skärmning samt förfarande för framställning därav
ATE376763T1 (de) * 2003-02-07 2007-11-15 Sony Ericsson Mobile Comm Ab Abschirmdeckel zur abschirmung von elektronischen bauteilen auf einer leiterplatte
JP5685098B2 (ja) * 2011-01-28 2015-03-18 京セラケミカル株式会社 電子部品の製造方法
KR20120110435A (ko) * 2011-03-29 2012-10-10 삼성전기주식회사 Ｒｆ 모듈 차폐 방법 및 이를 이용한 ｒｆ 통신 모듈
CN102365013A (zh) * 2011-10-20 2012-02-29 镇江船舶电器有限责任公司 屏蔽电磁泄漏的电器箱柜
WO2016144039A1 (en) 2015-03-06 2016-09-15 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
US10477737B2 (en) 2016-05-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method of a hollow shielding structure for circuit elements
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
KR102551657B1 (ko) 2016-12-12 2023-07-06 삼성전자주식회사 전자파 차폐구조 및 그 제조방법
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
KR102373931B1 (ko) 2017-09-08 2022-03-14 삼성전자주식회사 전자파 차폐구조
US11297718B2 (en) * 2020-06-30 2022-04-05 Gentherm Gmbh Methods of manufacturing flex circuits with mechanically formed conductive traces
US11792913B2 (en) * 2022-10-13 2023-10-17 Google Llc Mitigation of physical impact-induced mechanical stress damage to printed circuit boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001629A (en) * 1974-08-26 1977-01-04 Panel Technology, Inc. Segmented gas discharge display panel
US4157007A (en) * 1976-12-22 1979-06-05 National Semiconductor Corporation Asymmetric digital watch module
US4714905A (en) * 1986-10-08 1987-12-22 K & L Microwave SMC filter and method of manufacture thereof
US4945633A (en) * 1989-03-01 1990-08-07 Nokia-Mobira Oy Method of mounting a printed circuit board and securing the earthing to a casing
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
FI915242A (fi) * 1991-11-06 1993-05-07 Nokia Mobile Phones Ltd Rf-skaermning av kretskort
US5318651A (en) * 1991-11-27 1994-06-07 Nec Corporation Method of bonding circuit boards
FR2687153B1 (fr) * 1992-02-07 1994-05-13 Hoechst Ste Francaise Procede de preparation de la (thenyl-2)-5 hydantouine.
JPH06296080A (ja) * 1993-04-08 1994-10-21 Sony Corp 電子部品実装基板及び電子部品実装方法
DE4340108C3 (de) * 1993-11-22 2003-08-14 Emi Tec Elektronische Material Abschirmelement und Verfahren zu dessen Herstellung
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
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US6090728A (en) * 1998-05-01 2000-07-18 3M Innovative Properties Company EMI shielding enclosures

Also Published As

Publication number Publication date
AU743764B2 (en) 2002-02-07
EE03794B1 (et) 2002-06-17
SE9704894L (sv) 1999-06-30
CN1281630A (zh) 2001-01-24
JP2002500449A (ja) 2002-01-08
EE200000406A (et) 2001-12-17
KR20010033777A (ko) 2001-04-25
SE511330C2 (sv) 1999-09-13
HUP0100628A2 (hu) 2001-07-30
WO1999034659A1 (en) 1999-07-08
EP1042947A1 (en) 2000-10-11
AU2193399A (en) 1999-07-19
MY120468A (en) 2005-10-31
SE9704894D0 (sv) 1997-12-29
US6263564B1 (en) 2001-07-24

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A, 9A E 10A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 1975 DE 11/11/2008.