SE9703961L - Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort - Google Patents

Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort

Info

Publication number
SE9703961L
SE9703961L SE9703961A SE9703961A SE9703961L SE 9703961 L SE9703961 L SE 9703961L SE 9703961 A SE9703961 A SE 9703961A SE 9703961 A SE9703961 A SE 9703961A SE 9703961 L SE9703961 L SE 9703961L
Authority
SE
Sweden
Prior art keywords
circuit board
transistor unit
bridge
attach
clamp
Prior art date
Application number
SE9703961A
Other languages
English (en)
Other versions
SE9703961D0 (sv
SE511103C2 (sv
Inventor
Bengt Yngve Haerdin
Nils Martin Schoeoen
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9703961A priority Critical patent/SE511103C2/sv
Publication of SE9703961D0 publication Critical patent/SE9703961D0/sv
Priority to US09/177,823 priority patent/US6128190A/en
Priority to PCT/SE1998/001953 priority patent/WO1999022553A1/en
Priority to BRPI9813350-0A priority patent/BR9813350B1/pt
Priority to CA002307631A priority patent/CA2307631A1/en
Priority to AU97730/98A priority patent/AU9773098A/en
Priority to JP2000518523A priority patent/JP4094808B2/ja
Publication of SE9703961L publication Critical patent/SE9703961L/sv
Publication of SE511103C2 publication Critical patent/SE511103C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE9703961A 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort SE511103C2 (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE9703961A SE511103C2 (sv) 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort
US09/177,823 US6128190A (en) 1997-10-29 1998-10-23 Electronic assembly
PCT/SE1998/001953 WO1999022553A1 (en) 1997-10-29 1998-10-28 Transistor clamp
BRPI9813350-0A BR9813350B1 (pt) 1997-10-29 1998-10-28 grampo para fixar uma unidade de transistor ou similar a uma placa de circuito ou similar.
CA002307631A CA2307631A1 (en) 1997-10-29 1998-10-28 Transistor clamp
AU97730/98A AU9773098A (en) 1997-10-29 1998-10-28 Transistor clamp
JP2000518523A JP4094808B2 (ja) 1997-10-29 1998-10-28 トランジスタ・クランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9703961A SE511103C2 (sv) 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort

Publications (3)

Publication Number Publication Date
SE9703961D0 SE9703961D0 (sv) 1997-10-29
SE9703961L true SE9703961L (sv) 1999-04-30
SE511103C2 SE511103C2 (sv) 1999-08-02

Family

ID=20408797

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9703961A SE511103C2 (sv) 1997-10-29 1997-10-29 Klämma för att fästa en effekttransistorenhet eller liknande mot ett kretskort

Country Status (7)

Country Link
US (1) US6128190A (sv)
JP (1) JP4094808B2 (sv)
AU (1) AU9773098A (sv)
BR (1) BR9813350B1 (sv)
CA (1) CA2307631A1 (sv)
SE (1) SE511103C2 (sv)
WO (1) WO1999022553A1 (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591363B (en) * 2001-10-10 2004-06-11 Aavid Thermalloy Llc Heat collector with mounting plate
JP4457895B2 (ja) * 2005-01-14 2010-04-28 船井電機株式会社 電源装置、並びにそれに適用可能な放熱部材固定構造及び回路基板
WO2009078767A1 (en) * 2007-12-17 2009-06-25 Telefonaktiebolaget Lm Ericsson (Publ) A device for reducing thermal stress on connection points
US8674446B2 (en) * 2012-01-05 2014-03-18 Harris Corporation Electronic device including electrically conductive body for ESD protection and related methods
US10588234B2 (en) * 2016-01-26 2020-03-10 Hewlett Packard Enterprise Development Lp Semiconductor assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
JPH02121353A (ja) * 1988-10-31 1990-05-09 Nec Corp モールドケース型半導体の保持用バンド
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
JPH04162382A (ja) * 1990-10-25 1992-06-05 Canon Inc Ｉｃソケット
US5825089A (en) * 1991-05-01 1998-10-20 Spectrian, Inc. Low thermal resistance spring biased RF semiconductor package mounting structure
US5439398A (en) * 1992-12-10 1995-08-08 Radio Frequency Systems, Inc. Transistor mounting clamp assembly
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
DE4338393A1 (de) * 1993-11-10 1995-05-11 Philips Patentverwaltung Anordnung zur Entwärmung eines auf eine Platine gelöteten elektronischen Bauelements
JP2804433B2 (ja) * 1994-01-14 1998-09-24 ソニー・テクトロニクス株式会社 パワー・トランジスタの固定方法
US5468996A (en) * 1994-03-25 1995-11-21 International Business Machines Corporation Electronic package assembly and connector for use therewith
US5392193A (en) * 1994-05-31 1995-02-21 Motorola, Inc. Transistor mounting device
US5459640A (en) * 1994-09-23 1995-10-17 Motorola, Inc. Electrical module mounting apparatus and method thereof
US5796584A (en) * 1996-04-30 1998-08-18 Telefonaktiebolaget Lm Ericsson Bridge for power transistors with improved cooling

Also Published As

Publication number Publication date
CA2307631A1 (en) 1999-05-06
BR9813350B1 (pt) 2011-03-09
BR9813350A (pt) 2000-08-22
SE9703961D0 (sv) 1997-10-29
JP2001522137A (ja) 2001-11-13
JP4094808B2 (ja) 2008-06-04
SE511103C2 (sv) 1999-08-02
WO1999022553A1 (en) 1999-05-06
AU9773098A (en) 1999-05-17
US6128190A (en) 2000-10-03

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