SE8703913A - - Google Patents

Info

Publication number
SE8703913A
SE8703913A SE8703913A SE8703913A SE8703913A SE 8703913 A SE8703913 A SE 8703913A SE 8703913 A SE8703913 A SE 8703913A SE 8703913 A SE8703913 A SE 8703913A SE 8703913 A SE8703913 A SE 8703913A
Authority
SE
Sweden
Prior art keywords
decoupling
foil
circuits
circuit
edge
Prior art date
Application number
SE8703913A
Other languages
English (en)
Other versions
SE8703913D0 (sv
SE458004B (sv
SE458004C (sv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of SE8703913D0 publication Critical patent/SE8703913D0/xx
Priority to SE8703913A priority Critical patent/SE458004C/sv
Application filed filed Critical
Priority to HU886251A priority patent/HUT54265A/hu
Priority to EP88909138A priority patent/EP0391926A1/en
Priority to AU25564/88A priority patent/AU610283B2/en
Priority to JP63508452A priority patent/JPH03500593A/ja
Priority to BR888807736A priority patent/BR8807736A/pt
Priority to PCT/SE1988/000493 priority patent/WO1989003634A1/en
Priority to US07/251,640 priority patent/US4920444A/en
Priority to ES8803499A priority patent/ES2009117A6/es
Priority to CN88109121A priority patent/CN1013463B/zh
Publication of SE458004B publication Critical patent/SE458004B/sv
Publication of SE8703913A publication Critical patent/SE8703913A/xx
Priority to KR1019890701031A priority patent/KR890702419A/ko
Priority to FI901524A priority patent/FI901524A0/fi
Priority to BG091634A priority patent/BG51169A3/xx
Priority to DK086990A priority patent/DK86990D0/da
Priority to NO901618A priority patent/NO901618D0/no
Publication of SE458004C publication Critical patent/SE458004C/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SE8703913A 1987-10-09 1987-10-09 Anordning foer elektrisk avkoppling av integrerade kretsar SE458004C (sv)

Priority Applications (15)

Application Number Priority Date Filing Date Title
SE8703913A SE458004C (sv) 1987-10-09 1987-10-09 Anordning foer elektrisk avkoppling av integrerade kretsar
HU886251A HUT54265A (en) 1987-10-09 1988-09-23 Arrangement for electrical separation of integrated circuits
EP88909138A EP0391926A1 (en) 1987-10-09 1988-09-23 An arrangement for deactivating integrated circuits electrically
AU25564/88A AU610283B2 (en) 1987-10-09 1988-09-23 An arrangement for deactivating integrated circuits electrically
JP63508452A JPH03500593A (ja) 1987-10-09 1988-09-23 集積回路を電気的に非活性化する装置
BR888807736A BR8807736A (pt) 1987-10-09 1988-09-23 Um arranjo para desativar circuitos integrados eletricamente
PCT/SE1988/000493 WO1989003634A1 (en) 1987-10-09 1988-09-23 An arrangement for deactivating integrated circuits electrically
US07/251,640 US4920444A (en) 1987-10-09 1988-10-03 Arrangement for decoupling integrated circuits electrically
ES8803499A ES2009117A6 (es) 1987-10-09 1988-10-07 Disposicion para desactivar electricamente circuitos integrados.
CN88109121A CN1013463B (zh) 1987-10-09 1988-10-08 一种电钝化集成电路的装置
KR1019890701031A KR890702419A (ko) 1987-10-09 1989-06-08 집적회로의 전기적 불활성 배열
FI901524A FI901524A0 (fi) 1987-10-09 1990-03-27 Anordning foer elektrisk avkoppling av integrerade kretsar.
BG091634A BG51169A3 (en) 1987-10-09 1990-04-02 Device for deactivation of integrated circuits electrically
DK086990A DK86990D0 (da) 1987-10-09 1990-04-06 Anordning til elektrisk afkobling af integrerede kredsloeb
NO901618A NO901618D0 (no) 1987-10-09 1990-04-09 Anordning for elektrisk avkobling av integrerte kretser.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8703913A SE458004C (sv) 1987-10-09 1987-10-09 Anordning foer elektrisk avkoppling av integrerade kretsar

Publications (4)

Publication Number Publication Date
SE8703913D0 SE8703913D0 (sv) 1987-10-09
SE458004B SE458004B (sv) 1989-02-13
SE8703913A true SE8703913A (pt) 1989-02-23
SE458004C SE458004C (sv) 1991-10-07

Family

ID=20369821

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8703913A SE458004C (sv) 1987-10-09 1987-10-09 Anordning foer elektrisk avkoppling av integrerade kretsar

Country Status (14)

Country Link
US (1) US4920444A (pt)
EP (1) EP0391926A1 (pt)
JP (1) JPH03500593A (pt)
KR (1) KR890702419A (pt)
CN (1) CN1013463B (pt)
AU (1) AU610283B2 (pt)
BG (1) BG51169A3 (pt)
BR (1) BR8807736A (pt)
DK (1) DK86990D0 (pt)
ES (1) ES2009117A6 (pt)
FI (1) FI901524A0 (pt)
HU (1) HUT54265A (pt)
SE (1) SE458004C (pt)
WO (1) WO1989003634A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6577492B2 (en) 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614546A (en) * 1970-01-07 1971-10-19 Rca Corp Shielded semiconductor device
US4177480A (en) * 1975-10-02 1979-12-04 Licentia Patent-Verwaltungs-G.M.B.H. Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads
US4636918A (en) * 1982-07-30 1987-01-13 Rogers Corporation Decoupled integrated circuit package
JPS5934625A (ja) * 1982-08-20 1984-02-25 松尾電機株式会社 チツプ型固体電解コンデンサの製造方法
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS60117705A (ja) * 1983-11-30 1985-06-25 日本メクトロン株式会社 集積回路用バイパスコンデンサ
US4626958A (en) * 1985-01-22 1986-12-02 Rogers Corporation Decoupling capacitor for Pin Grid Array package

Also Published As

Publication number Publication date
FI901524A0 (fi) 1990-03-27
WO1989003634A1 (en) 1989-04-20
DK86990A (da) 1990-04-06
US4920444A (en) 1990-04-24
KR890702419A (ko) 1989-12-23
CN1032470A (zh) 1989-04-19
BG51169A3 (en) 1993-02-15
JPH03500593A (ja) 1991-02-07
EP0391926A1 (en) 1990-10-17
AU610283B2 (en) 1991-05-16
SE8703913D0 (sv) 1987-10-09
SE458004B (sv) 1989-02-13
BR8807736A (pt) 1990-08-07
SE458004C (sv) 1991-10-07
HUT54265A (en) 1991-01-28
HU886251D0 (en) 1990-11-28
CN1013463B (zh) 1991-08-07
DK86990D0 (da) 1990-04-06
AU2556488A (en) 1989-05-02
ES2009117A6 (es) 1989-08-16

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