ES2009117A6 - Disposicion para desactivar electricamente circuitos integrados. - Google Patents
Disposicion para desactivar electricamente circuitos integrados.Info
- Publication number
- ES2009117A6 ES2009117A6 ES8803499A ES8803499A ES2009117A6 ES 2009117 A6 ES2009117 A6 ES 2009117A6 ES 8803499 A ES8803499 A ES 8803499A ES 8803499 A ES8803499 A ES 8803499A ES 2009117 A6 ES2009117 A6 ES 2009117A6
- Authority
- ES
- Spain
- Prior art keywords
- arrangement
- deactivating
- integrated circuits
- foil
- circuits electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
DISPOSICION PARA DESACTIVAR ELECTRICAMENTE CIRCUITOS INTEGRADOS. SE REFIERE A UNA DISPOSICION PARA DESACTIVAR ELECTRICAMENTE CIRCUITOS INTEGRADOS POR MEDIO DE CONDENSADORES DE DESACTIVACION. COMPRENDE UNA LAMINA METALICA (2) MONTADA POR EJEMPLO POR ENCOLADO SOBRE EL CIRCUITO INTEGRADO. LA CONEXION DE TIERRA (3) DEL CIRCUITO ESTA UNIDA CON EL BORDE DE LA LAMINA A TRAVES DE UN CORTO CONDUCTOR, Y CADA UNA DE LAS SALIDAS DE SEÑAL (4) Y CADA CONDUCTOR DE ALIMENTACION (5) ESTAN CONECTADOS DIRECTAMENTE AL BORDE DE LA LAMINA A TRAVES DE UN RESPECTIVO CONDENSADOR DE CHIP (7, 8) SOLDADO. DE ACUERDO CON LA INVENCION SE CONSIGUE UNA DESACTIVACION ELECTRICA PARTICULARMENTE SENCILLA Y EFICAZ DE TALES CIRCUITOS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8703913A SE458004C (sv) | 1987-10-09 | 1987-10-09 | Anordning foer elektrisk avkoppling av integrerade kretsar |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2009117A6 true ES2009117A6 (es) | 1989-08-16 |
Family
ID=20369821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8803499A Expired ES2009117A6 (es) | 1987-10-09 | 1988-10-07 | Disposicion para desactivar electricamente circuitos integrados. |
Country Status (14)
Country | Link |
---|---|
US (1) | US4920444A (es) |
EP (1) | EP0391926A1 (es) |
JP (1) | JPH03500593A (es) |
KR (1) | KR890702419A (es) |
CN (1) | CN1013463B (es) |
AU (1) | AU610283B2 (es) |
BG (1) | BG51169A3 (es) |
BR (1) | BR8807736A (es) |
DK (1) | DK86990D0 (es) |
ES (1) | ES2009117A6 (es) |
FI (1) | FI901524A0 (es) |
HU (1) | HUT54265A (es) |
SE (1) | SE458004C (es) |
WO (1) | WO1989003634A1 (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5557504A (en) * | 1993-08-31 | 1996-09-17 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with detachable module |
US5570273A (en) * | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
US6274224B1 (en) | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
US6577492B2 (en) | 2001-07-10 | 2003-06-10 | 3M Innovative Properties Company | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3614546A (en) * | 1970-01-07 | 1971-10-19 | Rca Corp | Shielded semiconductor device |
US4177480A (en) * | 1975-10-02 | 1979-12-04 | Licentia Patent-Verwaltungs-G.M.B.H. | Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads |
US4636918A (en) * | 1982-07-30 | 1987-01-13 | Rogers Corporation | Decoupled integrated circuit package |
JPS5934625A (ja) * | 1982-08-20 | 1984-02-25 | 松尾電機株式会社 | チツプ型固体電解コンデンサの製造方法 |
JPS5954249A (ja) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | 半導体装置 |
JPS60117705A (ja) * | 1983-11-30 | 1985-06-25 | 日本メクトロン株式会社 | 集積回路用バイパスコンデンサ |
US4626958A (en) * | 1985-01-22 | 1986-12-02 | Rogers Corporation | Decoupling capacitor for Pin Grid Array package |
-
1987
- 1987-10-09 SE SE8703913A patent/SE458004C/sv not_active IP Right Cessation
-
1988
- 1988-09-23 AU AU25564/88A patent/AU610283B2/en not_active Ceased
- 1988-09-23 EP EP88909138A patent/EP0391926A1/en not_active Withdrawn
- 1988-09-23 BR BR888807736A patent/BR8807736A/pt unknown
- 1988-09-23 JP JP63508452A patent/JPH03500593A/ja active Pending
- 1988-09-23 HU HU886251A patent/HUT54265A/hu unknown
- 1988-09-23 WO PCT/SE1988/000493 patent/WO1989003634A1/en not_active Application Discontinuation
- 1988-10-03 US US07/251,640 patent/US4920444A/en not_active Expired - Fee Related
- 1988-10-07 ES ES8803499A patent/ES2009117A6/es not_active Expired
- 1988-10-08 CN CN88109121A patent/CN1013463B/zh not_active Expired
-
1989
- 1989-06-08 KR KR1019890701031A patent/KR890702419A/ko not_active Application Discontinuation
-
1990
- 1990-03-27 FI FI901524A patent/FI901524A0/fi not_active IP Right Cessation
- 1990-04-02 BG BG91634A patent/BG51169A3/xx unknown
- 1990-04-06 DK DK086990A patent/DK86990D0/da unknown
Also Published As
Publication number | Publication date |
---|---|
SE458004C (sv) | 1991-10-07 |
JPH03500593A (ja) | 1991-02-07 |
SE458004B (sv) | 1989-02-13 |
KR890702419A (ko) | 1989-12-23 |
CN1032470A (zh) | 1989-04-19 |
WO1989003634A1 (en) | 1989-04-20 |
SE8703913D0 (sv) | 1987-10-09 |
AU610283B2 (en) | 1991-05-16 |
SE8703913A (es) | 1989-02-23 |
FI901524A0 (fi) | 1990-03-27 |
US4920444A (en) | 1990-04-24 |
DK86990A (da) | 1990-04-06 |
EP0391926A1 (en) | 1990-10-17 |
BR8807736A (pt) | 1990-08-07 |
AU2556488A (en) | 1989-05-02 |
HU886251D0 (en) | 1990-11-28 |
HUT54265A (en) | 1991-01-28 |
DK86990D0 (da) | 1990-04-06 |
BG51169A3 (en) | 1993-02-15 |
CN1013463B (zh) | 1991-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2008-10-07 |
|
FD1A | Patent lapsed |
Effective date: 20001102 |