SE8501064D0 - Stenciltryckmaskin anpassad for att utbilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta - Google Patents
Stenciltryckmaskin anpassad for att utbilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en plattaInfo
- Publication number
- SE8501064D0 SE8501064D0 SE8501064A SE8501064A SE8501064D0 SE 8501064 D0 SE8501064 D0 SE 8501064D0 SE 8501064 A SE8501064 A SE 8501064A SE 8501064 A SE8501064 A SE 8501064A SE 8501064 D0 SE8501064 D0 SE 8501064D0
- Authority
- SE
- Sweden
- Prior art keywords
- plate
- coating
- educate
- hall
- material layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
- Printing Methods (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8501064A SE453708B (sv) | 1985-03-05 | 1985-03-05 | Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta |
EP86850076A EP0194247A3 (en) | 1985-03-05 | 1986-03-03 | A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate |
JP4948786A JPS61273963A (ja) | 1985-03-05 | 1986-03-05 | プレ−トを貫通する孔の内面に材料の層を設けるためのシルクスクリ−ンプリンタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8501064A SE453708B (sv) | 1985-03-05 | 1985-03-05 | Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta |
Publications (3)
Publication Number | Publication Date |
---|---|
SE8501064D0 true SE8501064D0 (sv) | 1985-03-05 |
SE8501064L SE8501064L (sv) | 1986-09-06 |
SE453708B SE453708B (sv) | 1988-02-22 |
Family
ID=20359365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8501064A SE453708B (sv) | 1985-03-05 | 1985-03-05 | Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0194247A3 (sv) |
JP (1) | JPS61273963A (sv) |
SE (1) | SE453708B (sv) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62211992A (ja) * | 1986-03-13 | 1987-09-17 | 北陸電気工業株式会社 | 回路基板のスル−ホ−ル接続部形成方法 |
US4919970A (en) * | 1986-09-15 | 1990-04-24 | International Business Machines Corporation | Solder deposition control |
US4747211A (en) * | 1987-02-09 | 1988-05-31 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films |
JPS63163941U (sv) * | 1987-04-15 | 1988-10-26 | ||
GB8802393D0 (en) * | 1988-02-03 | 1988-03-02 | Gen Electric Co Plc | Apparatus for selectively coating part of member |
EP0327298A3 (en) * | 1988-02-03 | 1990-06-27 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Apparatus for selectively coating part of a member |
JPH0494591A (ja) * | 1990-08-10 | 1992-03-26 | Cmk Corp | スルーホールを有するプリント配線板の製造方法 |
IT1252381B (it) * | 1991-11-12 | 1995-06-12 | Occleppo Di Francesco Occleppo | Dispositivo per la formazione d'una pellicola sulle pareti dei forellini nelle piastre per circuiti stampati |
DE4318604A1 (de) * | 1993-06-04 | 1994-12-08 | Blaupunkt Werke Gmbh | Verfahren zur Durchkontaktierung von Leiterplatten |
DE4439108C1 (de) * | 1994-11-02 | 1996-04-11 | Lpkf Cad Cam Systeme Gmbh | Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten |
DE19547124C2 (de) * | 1995-12-16 | 2001-04-19 | Lpkf D O O | Drehschieberventil zur wahlweisen Druck- oder Saugluftbeaufschlagung |
IT1289327B1 (it) * | 1996-03-13 | 1998-10-02 | So Ma Ci S Spa | Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia faccia |
US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
WO2001093647A2 (en) | 2000-05-31 | 2001-12-06 | Honeywell International Inc. | Filling method |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
AU2001264968A1 (en) | 2000-05-31 | 2001-12-11 | Honeywell International, Inc. | Filling device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556832A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Method of manufacturing flexible circuit substrate |
IT1137331B (it) * | 1981-04-10 | 1986-09-10 | Italtel Spa | Metodo per rendere conduttivi fori passanti in supporti per circuiti elettrici |
EP0109084B1 (en) * | 1982-11-15 | 1987-06-10 | Storno A/S | A method of making a double-sided thick-film integrated circuit |
BE896966A (nl) * | 1983-06-06 | 1983-12-06 | Bell Telephone Mfg | Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens |
-
1985
- 1985-03-05 SE SE8501064A patent/SE453708B/sv not_active IP Right Cessation
-
1986
- 1986-03-03 EP EP86850076A patent/EP0194247A3/en not_active Ceased
- 1986-03-05 JP JP4948786A patent/JPS61273963A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0194247A3 (en) | 1989-03-22 |
EP0194247A2 (en) | 1986-09-10 |
JPS61273963A (ja) | 1986-12-04 |
SE453708B (sv) | 1988-02-22 |
SE8501064L (sv) | 1986-09-06 |
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Legal Events
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NUG | Patent has lapsed |
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