IT1289327B1 - Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia faccia - Google Patents
Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia facciaInfo
- Publication number
- IT1289327B1 IT1289327B1 IT96MC000032A ITMC960032A IT1289327B1 IT 1289327 B1 IT1289327 B1 IT 1289327B1 IT 96MC000032 A IT96MC000032 A IT 96MC000032A IT MC960032 A ITMC960032 A IT MC960032A IT 1289327 B1 IT1289327 B1 IT 1289327B1
- Authority
- IT
- Italy
- Prior art keywords
- tracks
- implementation
- double
- printed circuits
- sided printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Dc Digital Transmission (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT96MC000032A IT1289327B1 (it) | 1996-03-13 | 1996-03-13 | Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia faccia |
AU19388/97A AU1938897A (en) | 1996-03-13 | 1997-03-06 | System for realising connection jumpers between the tracks of double-sided printed circuit boards |
PCT/IT1997/000049 WO1997034451A1 (en) | 1996-03-13 | 1997-03-06 | System for realising connection jumpers between the tracks of double-sided printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT96MC000032A IT1289327B1 (it) | 1996-03-13 | 1996-03-13 | Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia faccia |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMC960032A0 ITMC960032A0 (it) | 1996-03-13 |
ITMC960032A1 ITMC960032A1 (it) | 1997-09-13 |
IT1289327B1 true IT1289327B1 (it) | 1998-10-02 |
Family
ID=11357175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT96MC000032A IT1289327B1 (it) | 1996-03-13 | 1996-03-13 | Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia faccia |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1938897A (it) |
IT (1) | IT1289327B1 (it) |
WO (1) | WO1997034451A1 (it) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1094447A (en) * | 1965-11-19 | 1967-12-13 | Telas | A method of electrically interconnecting double-sided printed circuits |
US3576669A (en) * | 1968-08-15 | 1971-04-27 | Nasa | Method for coating through-holes |
US4383495A (en) * | 1980-06-02 | 1983-05-17 | Western Electric Company, Inc. | Apparatus for coating surfaces of a substrate |
SE453708B (sv) * | 1985-03-05 | 1988-02-22 | Svecia Silkscreen Maskiner Ab | Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta |
-
1996
- 1996-03-13 IT IT96MC000032A patent/IT1289327B1/it active IP Right Grant
-
1997
- 1997-03-06 AU AU19388/97A patent/AU1938897A/en not_active Abandoned
- 1997-03-06 WO PCT/IT1997/000049 patent/WO1997034451A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
AU1938897A (en) | 1997-10-01 |
ITMC960032A1 (it) | 1997-09-13 |
WO1997034451A1 (en) | 1997-09-18 |
ITMC960032A0 (it) | 1996-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |