AU1938897A - System for realising connection jumpers between the tracks of double-sided printed circuit boards - Google Patents
System for realising connection jumpers between the tracks of double-sided printed circuit boardsInfo
- Publication number
- AU1938897A AU1938897A AU19388/97A AU1938897A AU1938897A AU 1938897 A AU1938897 A AU 1938897A AU 19388/97 A AU19388/97 A AU 19388/97A AU 1938897 A AU1938897 A AU 1938897A AU 1938897 A AU1938897 A AU 1938897A
- Authority
- AU
- Australia
- Prior art keywords
- realising
- tracks
- double
- printed circuit
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT96MC000032A IT1289327B1 (en) | 1996-03-13 | 1996-03-13 | SYSTEM FOR THE IMPLEMENTATION OF CONNECTION JUMPERS BETWEEN THE TRACKS OF DOUBLE-SIDED PRINTED CIRCUITS |
ITMC96A0032 | 1996-03-13 | ||
PCT/IT1997/000049 WO1997034451A1 (en) | 1996-03-13 | 1997-03-06 | System for realising connection jumpers between the tracks of double-sided printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1938897A true AU1938897A (en) | 1997-10-01 |
Family
ID=11357175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU19388/97A Abandoned AU1938897A (en) | 1996-03-13 | 1997-03-06 | System for realising connection jumpers between the tracks of double-sided printed circuit boards |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1938897A (en) |
IT (1) | IT1289327B1 (en) |
WO (1) | WO1997034451A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1094447A (en) * | 1965-11-19 | 1967-12-13 | Telas | A method of electrically interconnecting double-sided printed circuits |
US3576669A (en) * | 1968-08-15 | 1971-04-27 | Nasa | Method for coating through-holes |
US4383495A (en) * | 1980-06-02 | 1983-05-17 | Western Electric Company, Inc. | Apparatus for coating surfaces of a substrate |
SE453708B (en) * | 1985-03-05 | 1988-02-22 | Svecia Silkscreen Maskiner Ab | STONE PRINTING MACHINE TO CREATE A MATERIAL LAYER ON AN INNER WALL PART FOR A THROUGH HALL IN A PLATE |
-
1996
- 1996-03-13 IT IT96MC000032A patent/IT1289327B1/en active IP Right Grant
-
1997
- 1997-03-06 WO PCT/IT1997/000049 patent/WO1997034451A1/en active Application Filing
- 1997-03-06 AU AU19388/97A patent/AU1938897A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
ITMC960032A1 (en) | 1997-09-13 |
WO1997034451A1 (en) | 1997-09-18 |
IT1289327B1 (en) | 1998-10-02 |
ITMC960032A0 (en) | 1996-03-13 |
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