DE29623190U1 - Multi-layer circuit board - Google Patents

Multi-layer circuit board

Info

Publication number
DE29623190U1
DE29623190U1 DE29623190U DE29623190U DE29623190U1 DE 29623190 U1 DE29623190 U1 DE 29623190U1 DE 29623190 U DE29623190 U DE 29623190U DE 29623190 U DE29623190 U DE 29623190U DE 29623190 U1 DE29623190 U1 DE 29623190U1
Authority
DE
Germany
Prior art keywords
circuit board
layer circuit
layer
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29623190U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29623190U priority Critical patent/DE29623190U1/en
Publication of DE29623190U1 publication Critical patent/DE29623190U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE29623190U 1996-11-28 1996-11-28 Multi-layer circuit board Expired - Lifetime DE29623190U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29623190U DE29623190U1 (en) 1996-11-28 1996-11-28 Multi-layer circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19649364 1996-11-28
DE29623190U DE29623190U1 (en) 1996-11-28 1996-11-28 Multi-layer circuit board

Publications (1)

Publication Number Publication Date
DE29623190U1 true DE29623190U1 (en) 1997-12-11

Family

ID=26031695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29623190U Expired - Lifetime DE29623190U1 (en) 1996-11-28 1996-11-28 Multi-layer circuit board

Country Status (1)

Country Link
DE (1) DE29623190U1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation
EP1568070A2 (en) * 2002-11-12 2005-08-31 Lamina Ceramics, Inc. Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
EP1659839A2 (en) * 2004-11-19 2006-05-24 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
WO2008002268A1 (en) * 2006-06-27 2008-01-03 Agency For Science, Technology And Research Ltcc substrate structure
DE102009058914A1 (en) * 2009-12-17 2011-06-22 Conti Temic microelectronic GmbH, 90411 High density interconnect-multi layered printed circuit board, has upper and lower board layers with conducting layers, where total surface of conducting layer of upper layer is larger than total surface of conducting layer of lower layer
DE102010043077A1 (en) * 2010-10-28 2011-11-17 Continental Automotive Gmbh Multilayer circuit carrier i.e. printed circuit board, has electronic component and cooling body connected together such that there is no direct electrical connection between metal layer and electronic component
US8339789B2 (en) 2007-07-12 2012-12-25 Continental Automotive Gmbh Use of an electronic module for an integrated mechatronic transmission control of simplified design
DE102018217607A1 (en) * 2018-10-15 2020-04-16 Continental Automotive Gmbh Semiconductor component arrangement, method for their production and heat dissipation device
CN112543546A (en) * 2019-09-20 2021-03-23 宏启胜精密电子(秦皇岛)有限公司 Circuit board with heat dissipation structure and manufacturing method thereof
DE102021114658A1 (en) 2021-06-08 2022-12-08 Continental Automotive Gmbh Printed circuit board for a power semiconductor module, power semiconductor module and method for producing a printed circuit board and a power semiconductor module

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1568070A2 (en) * 2002-11-12 2005-08-31 Lamina Ceramics, Inc. Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
EP1568070A4 (en) * 2002-11-12 2008-05-07 Lamina Ceramics Inc Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation
EP1659839A2 (en) * 2004-11-19 2006-05-24 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
WO2008002268A1 (en) * 2006-06-27 2008-01-03 Agency For Science, Technology And Research Ltcc substrate structure
US8339789B2 (en) 2007-07-12 2012-12-25 Continental Automotive Gmbh Use of an electronic module for an integrated mechatronic transmission control of simplified design
DE102009058914A1 (en) * 2009-12-17 2011-06-22 Conti Temic microelectronic GmbH, 90411 High density interconnect-multi layered printed circuit board, has upper and lower board layers with conducting layers, where total surface of conducting layer of upper layer is larger than total surface of conducting layer of lower layer
DE102010043077A1 (en) * 2010-10-28 2011-11-17 Continental Automotive Gmbh Multilayer circuit carrier i.e. printed circuit board, has electronic component and cooling body connected together such that there is no direct electrical connection between metal layer and electronic component
DE102018217607A1 (en) * 2018-10-15 2020-04-16 Continental Automotive Gmbh Semiconductor component arrangement, method for their production and heat dissipation device
CN112543546A (en) * 2019-09-20 2021-03-23 宏启胜精密电子(秦皇岛)有限公司 Circuit board with heat dissipation structure and manufacturing method thereof
CN112543546B (en) * 2019-09-20 2022-05-27 宏启胜精密电子(秦皇岛)有限公司 Circuit board with heat dissipation structure and manufacturing method thereof
DE102021114658A1 (en) 2021-06-08 2022-12-08 Continental Automotive Gmbh Printed circuit board for a power semiconductor module, power semiconductor module and method for producing a printed circuit board and a power semiconductor module

Similar Documents

Publication Publication Date Title
DE69740139D1 (en) Multi-layer printed circuit board
DE69831467D1 (en) Multi-layer circuit board
DE69737317D1 (en) Multilayer printed circuit board
DE59813841D1 (en) Multi-layer printed circuit board
DE69842069D1 (en) Multilayer printed circuit board
DE69812221D1 (en) Printed circuit board
DE69705119D1 (en) CIRCUIT BOARD
DE69535391D1 (en) Multi-layer circuit substrate
DE69637655D1 (en) Assembled multilayer printed circuit board
DE69716359T2 (en) Multi-layer dielectric line circuit
DE69837520D1 (en) Printed circuit board
DE69631236D1 (en) Printed circuit boards
ATA68094A (en) CIRCUIT BOARD
DE29623190U1 (en) Multi-layer circuit board
DE69637558D1 (en) Multi-layer printed circuit board
DE29515223U1 (en) Circuit board
DE69827754D1 (en) Printed circuit board
DE29616339U1 (en) Circuit board
DE9401567U1 (en) Circuit board arrangement
DE29516161U1 (en) Circuit board
DE29617021U1 (en) Circuit board
DE59711637D1 (en) circuit board
DE9419868U1 (en) Multi-layer circuit board
DE69500696D1 (en) Compact circuit board
DE29602392U1 (en) Circuit board

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980129

R120 Application withdrawn or ip right abandoned

Effective date: 19990820