SE8301028L - Odling av monokristallint skikt - Google Patents

Odling av monokristallint skikt

Info

Publication number
SE8301028L
SE8301028L SE8301028A SE8301028A SE8301028L SE 8301028 L SE8301028 L SE 8301028L SE 8301028 A SE8301028 A SE 8301028A SE 8301028 A SE8301028 A SE 8301028A SE 8301028 L SE8301028 L SE 8301028L
Authority
SE
Sweden
Prior art keywords
cultivation
mask
monocrystalline
monocrystalline layers
edges
Prior art date
Application number
SE8301028A
Other languages
Unknown language ( )
English (en)
Swedish (sv)
Other versions
SE8301028D0 (sv
Inventor
J T Mcginn
L L Jastrzebski
Jr J F Corboy
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of SE8301028D0 publication Critical patent/SE8301028D0/xx
Publication of SE8301028L publication Critical patent/SE8301028L/

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02647—Lateral overgrowth

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
SE8301028A 1982-02-26 1983-02-24 Odling av monokristallint skikt SE8301028L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/352,883 US4482422A (en) 1982-02-26 1982-02-26 Method for growing a low defect monocrystalline layer on a mask

Publications (2)

Publication Number Publication Date
SE8301028D0 SE8301028D0 (sv) 1983-02-24
SE8301028L true SE8301028L (sv) 1983-08-27

Family

ID=23386893

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8301028A SE8301028L (sv) 1982-02-26 1983-02-24 Odling av monokristallint skikt

Country Status (7)

Country Link
US (1) US4482422A (de)
JP (1) JPH0624184B2 (de)
DE (1) DE3305985A1 (de)
FR (1) FR2522339B1 (de)
GB (1) GB2116067B (de)
IT (1) IT1167618B (de)
SE (1) SE8301028L (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612072A (en) * 1983-06-24 1986-09-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for growing low defect, high purity crystalline layers utilizing lateral overgrowth of a patterned mask
JPS6016420A (ja) * 1983-07-08 1985-01-28 Mitsubishi Electric Corp 選択的エピタキシヤル成長方法
JPS60178620A (ja) * 1984-02-24 1985-09-12 Nec Corp 半導体基板の製造方法
US4891092A (en) * 1986-01-13 1990-01-02 General Electric Company Method for making a silicon-on-insulator substrate
US4946543A (en) * 1986-06-02 1990-08-07 Kalisher Murray H Method and apparatus for growing films on a substrate
JP2505754B2 (ja) * 1986-07-11 1996-06-12 キヤノン株式会社 光電変換装置の製造方法
EP0307109A1 (de) * 1987-08-24 1989-03-15 Canon Kabushiki Kaisha Verfahren zur Herstellung eines Halbleiterkristalls und dabei hergestellter Halbleiterkristall
US4923826A (en) * 1989-08-02 1990-05-08 Harris Corporation Method for forming dielectrically isolated transistor
US5443032A (en) * 1992-06-08 1995-08-22 Air Products And Chemicals, Inc. Method for the manufacture of large single crystals
US6039803A (en) * 1996-06-28 2000-03-21 Massachusetts Institute Of Technology Utilization of miscut substrates to improve relaxed graded silicon-germanium and germanium layers on silicon
US6348096B1 (en) 1997-03-13 2002-02-19 Nec Corporation Method for manufacturing group III-V compound semiconductors
ATE550461T1 (de) * 1997-04-11 2012-04-15 Nichia Corp Wachstumsmethode für einen nitrid-halbleiter
AU9674498A (en) * 1997-10-10 1999-05-03 Cornell Research Foundation Inc. Methods for growing defect-free heteroepitaxial layers
JPH11340576A (ja) * 1998-05-28 1999-12-10 Sumitomo Electric Ind Ltd 窒化ガリウム系半導体デバイス
KR100455277B1 (ko) * 1999-02-12 2004-11-06 삼성전자주식회사 변형된 선택 성장 공정을 이용한 ＧａＮ 단결정 성장 방법
US6693033B2 (en) 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
US6392257B1 (en) 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
US6596377B1 (en) * 2000-03-27 2003-07-22 Science & Technology Corporation @ Unm Thin film product and method of forming
WO2001093336A1 (en) 2000-05-31 2001-12-06 Motorola, Inc. Semiconductor device and method for manufacturing the same
US6501973B1 (en) 2000-06-30 2002-12-31 Motorola, Inc. Apparatus and method for measuring selected physical condition of an animate subject
US6590236B1 (en) 2000-07-24 2003-07-08 Motorola, Inc. Semiconductor structure for use with high-frequency signals
AU2001277001A1 (en) 2000-07-24 2002-02-05 Motorola, Inc. Heterojunction tunneling diodes and process for fabricating same
US6555946B1 (en) 2000-07-24 2003-04-29 Motorola, Inc. Acoustic wave device and process for forming the same
US6493497B1 (en) 2000-09-26 2002-12-10 Motorola, Inc. Electro-optic structure and process for fabricating same
US6638838B1 (en) 2000-10-02 2003-10-28 Motorola, Inc. Semiconductor structure including a partially annealed layer and method of forming the same
US6501121B1 (en) 2000-11-15 2002-12-31 Motorola, Inc. Semiconductor structure
US6559471B2 (en) 2000-12-08 2003-05-06 Motorola, Inc. Quantum well infrared photodetector and method for fabricating same
US20020096683A1 (en) 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
US6673646B2 (en) 2001-02-28 2004-01-06 Motorola, Inc. Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
WO2002082551A1 (en) 2001-04-02 2002-10-17 Motorola, Inc. A semiconductor structure exhibiting reduced leakage current
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US6992321B2 (en) 2001-07-13 2006-01-31 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials
US6531740B2 (en) 2001-07-17 2003-03-11 Motorola, Inc. Integrated impedance matching and stability network
US6646293B2 (en) 2001-07-18 2003-11-11 Motorola, Inc. Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
US7019332B2 (en) 2001-07-20 2006-03-28 Freescale Semiconductor, Inc. Fabrication of a wavelength locker within a semiconductor structure
US6498358B1 (en) 2001-07-20 2002-12-24 Motorola, Inc. Structure and method for fabricating an electro-optic system having an electrochromic diffraction grating
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US6855992B2 (en) 2001-07-24 2005-02-15 Motorola Inc. Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same
US6667196B2 (en) 2001-07-25 2003-12-23 Motorola, Inc. Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
US6639249B2 (en) 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US6589856B2 (en) 2001-08-06 2003-07-08 Motorola, Inc. Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
US20030034491A1 (en) 2001-08-14 2003-02-20 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices for detecting an object
US6673667B2 (en) 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US20030071327A1 (en) 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
US6916717B2 (en) 2002-05-03 2005-07-12 Motorola, Inc. Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate
EP1536043B1 (de) * 2002-06-18 2011-03-02 Sumitomo Electric Industries, Ltd. Verfahren zur herstellung von n-halbleiterdiamant und halbleiterdiamant
US7169619B2 (en) 2002-11-19 2007-01-30 Freescale Semiconductor, Inc. Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process
US6885065B2 (en) 2002-11-20 2005-04-26 Freescale Semiconductor, Inc. Ferromagnetic semiconductor structure and method for forming the same
EP1437426A1 (de) * 2003-01-10 2004-07-14 Siemens Aktiengesellschaft Verfahren zum Herstellen von einkristallinen Strukturen
US6965128B2 (en) 2003-02-03 2005-11-15 Freescale Semiconductor, Inc. Structure and method for fabricating semiconductor microresonator devices
US7020374B2 (en) 2003-02-03 2006-03-28 Freescale Semiconductor, Inc. Optical waveguide structure and method for fabricating the same
US20060113596A1 (en) * 2004-12-01 2006-06-01 Samsung Electronics Co., Ltd. Single crystal substrate and method of fabricating the same
US7777250B2 (en) * 2006-03-24 2010-08-17 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures and related methods for device fabrication
US8502263B2 (en) * 2006-10-19 2013-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Light-emitter-based devices with lattice-mismatched semiconductor structures
DE112008002387B4 (de) * 2007-09-07 2022-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Struktur einer Mehrfachübergangs-Solarzelle, Verfahren zur Bildung einer photonischenVorrichtung, Photovoltaische Mehrfachübergangs-Zelle und Photovoltaische Mehrfachübergangs-Zellenvorrichtung,
KR20130087843A (ko) * 2012-01-30 2013-08-07 한국전자통신연구원 단결정 물질을 이용한 엑스선 제어 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL131048C (de) * 1960-01-15
US3200018A (en) * 1962-01-29 1965-08-10 Hughes Aircraft Co Controlled epitaxial crystal growth by focusing electromagnetic radiation
GB1060474A (en) * 1963-03-27 1967-03-01 Siemens Ag The production of monocrystalline semiconductor bodies of silicon or germanium
US3425879A (en) * 1965-10-24 1969-02-04 Texas Instruments Inc Method of making shaped epitaxial deposits
US3746908A (en) * 1970-08-03 1973-07-17 Gen Electric Solid state light sensitive storage array
DE2059116C3 (de) * 1970-12-01 1974-11-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung eines Halbleiterbauelementes
JPS4944554A (de) * 1972-09-04 1974-04-26
US3985590A (en) * 1973-06-13 1976-10-12 Harris Corporation Process for forming heteroepitaxial structure
US3945864A (en) * 1974-05-28 1976-03-23 Rca Corporation Method of growing thick expitaxial layers of silicon
DE3176676D1 (en) * 1980-04-10 1988-04-07 Massachusetts Inst Technology Methods of producing sheets of crystalline material and devices amde therefrom

Also Published As

Publication number Publication date
GB8303792D0 (en) 1983-03-16
GB2116067B (en) 1985-10-09
GB2116067A (en) 1983-09-21
JPS58159322A (ja) 1983-09-21
JPH0624184B2 (ja) 1994-03-30
US4482422A (en) 1984-11-13
DE3305985A1 (de) 1983-09-08
FR2522339A1 (fr) 1983-09-02
IT8347762A0 (it) 1983-02-23
FR2522339B1 (fr) 1988-03-11
IT1167618B (it) 1987-05-13
SE8301028D0 (sv) 1983-02-24

Similar Documents

Publication Publication Date Title
SE8301028L (sv) Odling av monokristallint skikt
JPS54161268A (en) Method of manufacturing semiconductor device growing silicon layer on sapphire substrate
JPS5346274A (en) Method of forming epitaxial layer on substrate surface
EP0239958A3 (en) Thin film semiconductor device and method of manufacturing the same
AT387105B (de) Halbleiteranordnung mit herabgesetzter oberflaechenfeldstaerke
DE2862399D1 (en) Device and method for growing doped semiconductor material layers on the surface of a semiconductor substrate
KR890015346A (ko) 웨이퍼기판 및 화합물 반도체층으로 구성된 반도체기판
DK317984D0 (da) Katodeforstoevede halvlederfilm af kaedeformet phosphormateriale samt anordninger fremstillet ved hjaelp af samme
SE7705536L (sv) Sett och anordning for tillverkning av sammansatta ytelement
SE8300040L (sv) Odling av monokristallin kisel
JPS5651736A (en) Substrateecopying film deposition system* negative resist* and substrate covered with same resist film
DK313279A (da) Fremgangsmaade til fremstilling af mangfoldige kantlimede saet af trykfoelsomme kopieringsark
JPS55121669A (en) Method of forming inactive layer on integrated circuit device having substrate of semiconductor material
KR840005918A (ko) 반도체 장치의 기판구조 및 그 제조방법
SE423330B (sv) Forfarande for vakuumformning samt anordning for genomforande av forfarandet
JPS6481247A (en) Method of forming field oxide film of semiconductor device and semiconductor device
IT7951008A0 (it) Perfezionamento nelle strutture di dispositivi elettronici a semiconduttore e procedimento di fabbricazione
SE7711985L (sv) Halvledaranordnings-struktur och sett for framstellning derav
EP0100739A3 (de) Akustische Oberflächenwellenanordnung und deren Herstellungsverfahren
JPS5364463A (en) Fixing tray of semiconductor wafers
EP0136534A3 (en) Method of forming a large surface area integrated circuit
JPS51132277A (en) Method of forming water repellent porous film and film having substantially no pinhole on substrate
JPS5694684A (en) Thin film fine pattern and method of manufacturing same
DD137867A1 (de) Substrat fuer keramische halbleiterwiderstaende und herstellungsverfahren
JPS5773970A (en) Semiconductor device

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 8301028-0

Effective date: 19940419

Format of ref document f/p: F