SE514424C2 - Övergång mellan symmetrisk och asymmetrisk stripline i ett flerlagers mönsterkort - Google Patents

Övergång mellan symmetrisk och asymmetrisk stripline i ett flerlagers mönsterkort

Info

Publication number
SE514424C2
SE514424C2 SE9902302A SE9902302A SE514424C2 SE 514424 C2 SE514424 C2 SE 514424C2 SE 9902302 A SE9902302 A SE 9902302A SE 9902302 A SE9902302 A SE 9902302A SE 514424 C2 SE514424 C2 SE 514424C2
Authority
SE
Sweden
Prior art keywords
stripline
section
transition
ground plane
coverpad
Prior art date
Application number
SE9902302A
Other languages
English (en)
Swedish (sv)
Other versions
SE9902302L (sv
SE9902302D0 (sv
Inventor
Bjoern Albinsson
Thomas Harju
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9902302A priority Critical patent/SE514424C2/sv
Publication of SE9902302D0 publication Critical patent/SE9902302D0/xx
Priority to IL14690800A priority patent/IL146908A/xx
Priority to JP2001504730A priority patent/JP4198912B2/ja
Priority to DE60027297T priority patent/DE60027297T2/de
Priority to EP00944477A priority patent/EP1195080B1/en
Priority to PCT/SE2000/001012 priority patent/WO2000079846A1/en
Priority to AU58569/00A priority patent/AU5856900A/en
Priority to US09/594,771 priority patent/US6348844B1/en
Publication of SE9902302L publication Critical patent/SE9902302L/xx
Publication of SE514424C2 publication Critical patent/SE514424C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguide Connection Structure (AREA)
SE9902302A 1999-06-17 1999-06-17 Övergång mellan symmetrisk och asymmetrisk stripline i ett flerlagers mönsterkort SE514424C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE9902302A SE514424C2 (sv) 1999-06-17 1999-06-17 Övergång mellan symmetrisk och asymmetrisk stripline i ett flerlagers mönsterkort
IL14690800A IL146908A (en) 1999-06-17 2000-06-13 Transition between symmetric stripline and asymmetric stripline
JP2001504730A JP4198912B2 (ja) 1999-06-17 2000-06-13 対称ストリップラインと非対称ストリップラインの間の遷移構造
DE60027297T DE60027297T2 (de) 1999-06-17 2000-06-13 Übergang zwischen einem symetrischen und einem asymetrischen streifenleiter
EP00944477A EP1195080B1 (en) 1999-06-17 2000-06-13 Transition between symmetric stripline and asymmetric stripline
PCT/SE2000/001012 WO2000079846A1 (en) 1999-06-17 2000-06-13 Transition between symmetric stripline and asymmetric stripline
AU58569/00A AU5856900A (en) 1999-06-17 2000-06-13 Transition between symmetric stripline and asymmetric stripline
US09/594,771 US6348844B1 (en) 1999-06-17 2000-06-16 Transition between symmetric stripline and asymmetric stripline

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9902302A SE514424C2 (sv) 1999-06-17 1999-06-17 Övergång mellan symmetrisk och asymmetrisk stripline i ett flerlagers mönsterkort

Publications (3)

Publication Number Publication Date
SE9902302D0 SE9902302D0 (sv) 1999-06-17
SE9902302L SE9902302L (sv) 2000-12-18
SE514424C2 true SE514424C2 (sv) 2001-02-19

Family

ID=20416131

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9902302A SE514424C2 (sv) 1999-06-17 1999-06-17 Övergång mellan symmetrisk och asymmetrisk stripline i ett flerlagers mönsterkort

Country Status (8)

Country Link
US (1) US6348844B1 (enExample)
EP (1) EP1195080B1 (enExample)
JP (1) JP4198912B2 (enExample)
AU (1) AU5856900A (enExample)
DE (1) DE60027297T2 (enExample)
IL (1) IL146908A (enExample)
SE (1) SE514424C2 (enExample)
WO (1) WO2000079846A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483404B1 (en) * 2001-08-20 2002-11-19 Xytrans, Inc. Millimeter wave filter for surface mount applications
US6872962B1 (en) 2003-09-30 2005-03-29 National Semiconductor Corporation Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate
US6873228B1 (en) 2003-09-30 2005-03-29 National Semiconductor Corporation Buried self-resonant bypass capacitors within multilayered low temperature co-fired ceramic (LTCC) substrate
US6881895B1 (en) 2003-09-30 2005-04-19 National Semiconductor Corporation Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate
US20050088258A1 (en) * 2003-10-27 2005-04-28 Xytrans, Inc. Millimeter wave surface mount filter
DE102006047427B4 (de) * 2006-10-06 2012-10-25 Epcos Ag Substrat mit HF-tauglicher Leitung
DE102007038514A1 (de) * 2007-08-16 2009-02-19 Robert Bosch Gmbh Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung
US8248183B2 (en) * 2009-07-30 2012-08-21 Sierra Wireless, Inc. Circuit board pad having impedance matched to a transmission line and method for providing same
GB201113131D0 (en) * 2011-07-29 2011-09-14 Bae Systems Plc Radio frequency communication
US11342647B2 (en) 2019-11-26 2022-05-24 Raytheon Company Free-form dual dual-conductor integrated radio frequency media
US12456808B2 (en) 2021-10-01 2025-10-28 The Boeing Company High isolation ring slot patch radiator for phased array antennas
EP4576420A1 (en) * 2023-12-18 2025-06-25 The Boeing Company High isolation ring slot patch radiator for phased array antennas

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69318879T2 (de) * 1992-04-03 1998-10-08 Matsushita Electric Ind Co Ltd Keramisches Mehrschicht-Substrat für hohe Frequenzen
JP3023265B2 (ja) * 1992-09-26 2000-03-21 日本特殊陶業株式会社 集積回路用パッケージ本体
JPH06334449A (ja) * 1993-05-25 1994-12-02 Matsushita Electric Ind Co Ltd 高周波増幅器回路多層基板

Also Published As

Publication number Publication date
DE60027297D1 (de) 2006-05-24
JP2003502968A (ja) 2003-01-21
EP1195080B1 (en) 2006-04-12
EP1195080A1 (en) 2002-04-10
JP4198912B2 (ja) 2008-12-17
US6348844B1 (en) 2002-02-19
SE9902302L (sv) 2000-12-18
IL146908A0 (en) 2002-08-14
WO2000079846A1 (en) 2000-12-28
AU5856900A (en) 2001-01-09
DE60027297T2 (de) 2007-03-29
SE9902302D0 (sv) 1999-06-17
IL146908A (en) 2005-11-20

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