SE508138C2 - Metod och anordning för anslutning av elektrisk komponent till kretskort - Google Patents

Metod och anordning för anslutning av elektrisk komponent till kretskort

Info

Publication number
SE508138C2
SE508138C2 SE9604702A SE9604702A SE508138C2 SE 508138 C2 SE508138 C2 SE 508138C2 SE 9604702 A SE9604702 A SE 9604702A SE 9604702 A SE9604702 A SE 9604702A SE 508138 C2 SE508138 C2 SE 508138C2
Authority
SE
Sweden
Prior art keywords
connections
conductors
electrically conductive
power component
circuit board
Prior art date
Application number
SE9604702A
Other languages
English (en)
Swedish (sv)
Other versions
SE9604702D0 (sv
SE9604702L (sv
Inventor
Christer Olsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604702A priority Critical patent/SE508138C2/sv
Publication of SE9604702D0 publication Critical patent/SE9604702D0/xx
Priority to PCT/SE1997/002114 priority patent/WO1998028787A1/en
Priority to AU55017/98A priority patent/AU5501798A/en
Priority to CA002275653A priority patent/CA2275653A1/en
Priority to BR9713775A priority patent/BR9713775A/pt
Priority to US08/993,781 priority patent/US6271479B1/en
Publication of SE9604702L publication Critical patent/SE9604702L/xx
Publication of SE508138C2 publication Critical patent/SE508138C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
SE9604702A 1996-12-20 1996-12-20 Metod och anordning för anslutning av elektrisk komponent till kretskort SE508138C2 (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE9604702A SE508138C2 (sv) 1996-12-20 1996-12-20 Metod och anordning för anslutning av elektrisk komponent till kretskort
PCT/SE1997/002114 WO1998028787A1 (en) 1996-12-20 1997-12-16 Method and device for connecting electrical components to circuit boards
AU55017/98A AU5501798A (en) 1996-12-20 1997-12-16 Method and device for connecting electrical components to circuit boards
CA002275653A CA2275653A1 (en) 1996-12-20 1997-12-16 Method and device for connecting electrical components to circuit boards
BR9713775A BR9713775A (pt) 1996-12-20 1997-12-16 Processo e sistema de conexão para conexão elétrica de um componente de alta potência a um condutor em uma placa de circuito
US08/993,781 US6271479B1 (en) 1996-12-20 1997-12-18 Method and apparatus for connecting an electric component to a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604702A SE508138C2 (sv) 1996-12-20 1996-12-20 Metod och anordning för anslutning av elektrisk komponent till kretskort

Publications (3)

Publication Number Publication Date
SE9604702D0 SE9604702D0 (sv) 1996-12-20
SE9604702L SE9604702L (sv) 1998-06-21
SE508138C2 true SE508138C2 (sv) 1998-08-31

Family

ID=20405064

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604702A SE508138C2 (sv) 1996-12-20 1996-12-20 Metod och anordning för anslutning av elektrisk komponent till kretskort

Country Status (6)

Country Link
US (1) US6271479B1 (pt)
AU (1) AU5501798A (pt)
BR (1) BR9713775A (pt)
CA (1) CA2275653A1 (pt)
SE (1) SE508138C2 (pt)
WO (1) WO1998028787A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2154593B1 (es) * 1999-06-08 2001-10-16 Mecanismos Aux Es Ind S L Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.
TW200403066A (en) * 2002-04-30 2004-03-01 Novartis Ag New uses of substituted aminoalkanephosphonic acids
US20100147558A1 (en) * 2008-12-12 2010-06-17 Harry Pon Anchor pin lead frame
EP2494855B1 (en) * 2009-10-30 2018-02-14 Research Frontiers Incorporated Spd films and light valve laminates with improved bus-bar connections
US20120118635A1 (en) * 2010-11-15 2012-05-17 Aisin Aw Co., Ltd. Connection terminal and circuit component
GB2523145A (en) * 2014-02-14 2015-08-19 Nokia Technologies Oy A circuit board and associated apparatus and methods
WO2023107130A1 (en) * 2021-12-06 2023-06-15 Hewlett-Packard Development Company, L.P. Breakage features provided for circuit boards

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872236A (en) * 1971-06-11 1975-03-18 Amp Inc Bonded wire i interconnection system
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component
EP0180906B1 (de) * 1984-11-02 1989-01-18 Siemens Aktiengesellschaft Wellenwiderstandsgetreuer Chipträger für Mikrowellenhalbleiter
WO1987004855A1 (en) * 1986-02-07 1987-08-13 Fujitsu Limited Semiconductor device
EP0264635B1 (de) * 1986-09-25 1991-08-21 Siemens Aktiengesellschaft Elektrisch leitfähiger Klebstoff für hohen Temperaturbereich
US4777564A (en) 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPS6450444U (pt) 1987-09-22 1989-03-29
EP0437312B1 (en) * 1990-01-08 1994-10-26 Nec Corporation Electronic part mountable on the surface of a printed circuit board and method of mounting the same
US5241134A (en) * 1990-09-17 1993-08-31 Yoo Clarence S Terminals of surface mount components
EP0563873B1 (en) * 1992-04-03 1998-06-03 Matsushita Electric Industrial Co., Ltd. High frequency ceramic multi-layer substrate
EP0673547A4 (en) * 1992-12-09 1996-03-13 Olin Corp ELECTRONIC COMPONENT SEALED WITH ADHESIVE DISPENSER.
JPH06252310A (ja) * 1993-02-24 1994-09-09 Toppan Printing Co Ltd リードフレームならびにその製造方法
US5395876A (en) * 1993-04-19 1995-03-07 Acheson Industries, Inc. Surface mount conductive adhesives
BE1007856A3 (nl) * 1993-12-06 1995-11-07 Philips Electronics Nv Samenstellen van een printplaat en tenminste een component alsmede werkwijze voor het bevestigen van een component aan een printplaat.
JP2673098B2 (ja) * 1994-08-03 1997-11-05 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント配線基板及び実装構造体
US5616888A (en) * 1995-09-29 1997-04-01 Allen-Bradley Company, Inc. Rigid-flex circuit board having a window for an insulated mounting area

Also Published As

Publication number Publication date
WO1998028787A1 (en) 1998-07-02
AU5501798A (en) 1998-07-17
BR9713775A (pt) 2000-03-21
SE9604702D0 (sv) 1996-12-20
US6271479B1 (en) 2001-08-07
SE9604702L (sv) 1998-06-21
CA2275653A1 (en) 1998-07-02

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