BR9713775A - Processo e sistema de conexão para conexão elétrica de um componente de alta potência a um condutor em uma placa de circuito - Google Patents

Processo e sistema de conexão para conexão elétrica de um componente de alta potência a um condutor em uma placa de circuito

Info

Publication number
BR9713775A
BR9713775A BR9713775A BR9713775A BR9713775A BR 9713775 A BR9713775 A BR 9713775A BR 9713775 A BR9713775 A BR 9713775A BR 9713775 A BR9713775 A BR 9713775A BR 9713775 A BR9713775 A BR 9713775A
Authority
BR
Brazil
Prior art keywords
circuit board
connections
connection
conductor
power component
Prior art date
Application number
BR9713775A
Other languages
English (en)
Inventor
Christer Olsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of BR9713775A publication Critical patent/BR9713775A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

EM UMA PLACA DE CIRCUITO". A presente invenção relaciona-se a um dispositivo e um processo para conexão elétrica e mecânica de uma componente elétrico de alta potência (111) que transmite sinais elétuma placa de circuito (119). O componente compreenordo com a invenção são coladas aos condutores na placa de circuito com um adesivo de condução elétrica (112), do qual a adesão à base é maior do que um predeterminado valor. O componente está sujeito a repetidas mudanças de temperaturas que conduzem as estresses na conexão entre as conexões (114) e os condutores (120). O comprimento das conexões é escolhido dependendo de um predeterminado valor para a atenuação aceitável mais alta para qual o sipotência via as conexões. A superfície de contato das conexões em direção a junção colada pode ser pcavidades, pelas quais o adesivo obtém uma melhor pega às conexões.
BR9713775A 1996-12-20 1997-12-16 Processo e sistema de conexão para conexão elétrica de um componente de alta potência a um condutor em uma placa de circuito BR9713775A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9604702A SE508138C2 (sv) 1996-12-20 1996-12-20 Metod och anordning för anslutning av elektrisk komponent till kretskort
PCT/SE1997/002114 WO1998028787A1 (en) 1996-12-20 1997-12-16 Method and device for connecting electrical components to circuit boards

Publications (1)

Publication Number Publication Date
BR9713775A true BR9713775A (pt) 2000-03-21

Family

ID=20405064

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9713775A BR9713775A (pt) 1996-12-20 1997-12-16 Processo e sistema de conexão para conexão elétrica de um componente de alta potência a um condutor em uma placa de circuito

Country Status (6)

Country Link
US (1) US6271479B1 (pt)
AU (1) AU5501798A (pt)
BR (1) BR9713775A (pt)
CA (1) CA2275653A1 (pt)
SE (1) SE508138C2 (pt)
WO (1) WO1998028787A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2154593B1 (es) * 1999-06-08 2001-10-16 Mecanismos Aux Es Ind S L Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.
TW200403066A (en) * 2002-04-30 2004-03-01 Novartis Ag New uses of substituted aminoalkanephosphonic acids
US20100147558A1 (en) * 2008-12-12 2010-06-17 Harry Pon Anchor pin lead frame
JP6037328B2 (ja) * 2009-10-30 2016-12-07 リサーチ フロンティアーズ インコーポレイテッド 懸濁粒子デバイスの導電層と電源バスとの間に接続部を設ける方法
US20120118635A1 (en) * 2010-11-15 2012-05-17 Aisin Aw Co., Ltd. Connection terminal and circuit component
GB2523145A (en) * 2014-02-14 2015-08-19 Nokia Technologies Oy A circuit board and associated apparatus and methods
WO2023107130A1 (en) * 2021-12-06 2023-06-15 Hewlett-Packard Development Company, L.P. Breakage features provided for circuit boards

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872236A (en) * 1971-06-11 1975-03-18 Amp Inc Bonded wire i interconnection system
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component
DE3567771D1 (en) * 1984-11-02 1989-02-23 Siemens Ag Wave resistance-adapted chip support for a microwave semiconductor
KR910002302B1 (ko) * 1986-02-07 1991-04-11 후지쓰 가부시끼가이샤 반도체 장치
DE3772321D1 (de) * 1986-09-25 1991-09-26 Wacker Chemie Gmbh Elektrisch leitfaehiger klebstoff fuer hohen temperaturbereich.
US4777564A (en) 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
JPS6450444U (pt) 1987-09-22 1989-03-29
DE69104734T2 (de) * 1990-01-08 1995-03-02 Nippon Electric Co Elektronisches Bauteil auf der Oberfläche einer gedruckten Schaltplatine montierbar und Verfahren zur Montage.
US5241134A (en) * 1990-09-17 1993-08-31 Yoo Clarence S Terminals of surface mount components
DE69318879T2 (de) * 1992-04-03 1998-10-08 Matsushita Electric Ind Co Ltd Keramisches Mehrschicht-Substrat für hohe Frequenzen
CA2150569A1 (en) * 1992-12-09 1994-06-23 Dexin Liang Electronic package sealed with a dispensable adhesive
JPH06252310A (ja) * 1993-02-24 1994-09-09 Toppan Printing Co Ltd リードフレームならびにその製造方法
US5395876A (en) * 1993-04-19 1995-03-07 Acheson Industries, Inc. Surface mount conductive adhesives
BE1007856A3 (nl) * 1993-12-06 1995-11-07 Philips Electronics Nv Samenstellen van een printplaat en tenminste een component alsmede werkwijze voor het bevestigen van een component aan een printplaat.
JP2673098B2 (ja) * 1994-08-03 1997-11-05 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント配線基板及び実装構造体
US5616888A (en) * 1995-09-29 1997-04-01 Allen-Bradley Company, Inc. Rigid-flex circuit board having a window for an insulated mounting area

Also Published As

Publication number Publication date
SE9604702D0 (sv) 1996-12-20
CA2275653A1 (en) 1998-07-02
SE508138C2 (sv) 1998-08-31
WO1998028787A1 (en) 1998-07-02
US6271479B1 (en) 2001-08-07
AU5501798A (en) 1998-07-17
SE9604702L (sv) 1998-06-21

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A,7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1836 DE 14/03/2006.