SE468575B - Anordning med laminaera ledningsmoenster och valbara dielektrika - Google Patents

Anordning med laminaera ledningsmoenster och valbara dielektrika

Info

Publication number
SE468575B
SE468575B SE9101835A SE9101835A SE468575B SE 468575 B SE468575 B SE 468575B SE 9101835 A SE9101835 A SE 9101835A SE 9101835 A SE9101835 A SE 9101835A SE 468575 B SE468575 B SE 468575B
Authority
SE
Sweden
Prior art keywords
support frame
dielectric
window
conductor
disks
Prior art date
Application number
SE9101835A
Other languages
English (en)
Swedish (sv)
Other versions
SE9101835D0 (sv
SE9101835L (sv
Inventor
K-E Leeb
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9101835A priority Critical patent/SE468575B/sv
Publication of SE9101835D0 publication Critical patent/SE9101835D0/xx
Priority to PCT/SE1992/000406 priority patent/WO1992022994A1/en
Priority to EP92912905A priority patent/EP0543979B1/de
Priority to US07/897,821 priority patent/US5319330A/en
Priority to JP50082493A priority patent/JP3299265B2/ja
Priority to DE69209978T priority patent/DE69209978T2/de
Publication of SE9101835L publication Critical patent/SE9101835L/xx
Publication of SE468575B publication Critical patent/SE468575B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Waveguides (AREA)
  • Laser Beam Processing (AREA)
SE9101835A 1991-06-14 1991-06-14 Anordning med laminaera ledningsmoenster och valbara dielektrika SE468575B (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE9101835A SE468575B (sv) 1991-06-14 1991-06-14 Anordning med laminaera ledningsmoenster och valbara dielektrika
PCT/SE1992/000406 WO1992022994A1 (en) 1991-06-14 1992-06-12 A device comprising laminated conductive patterns and easily selectable dielectrics
EP92912905A EP0543979B1 (de) 1991-06-14 1992-06-12 Anordnung mit laminierten leiterbahnen und einfach selektierbaren dielektrika
US07/897,821 US5319330A (en) 1991-06-14 1992-06-12 Device comprising laminated conductive patterns and easily selectable dielectrics
JP50082493A JP3299265B2 (ja) 1991-06-14 1992-06-12 ラミネートされた導電性パターン並びに容易に選択可能な絶縁体を有する装置
DE69209978T DE69209978T2 (de) 1991-06-14 1992-06-12 Anordnung mit laminierten leiterbahnen und einfach selektierbaren dielektrika

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9101835A SE468575B (sv) 1991-06-14 1991-06-14 Anordning med laminaera ledningsmoenster och valbara dielektrika

Publications (3)

Publication Number Publication Date
SE9101835D0 SE9101835D0 (sv) 1991-06-14
SE9101835L SE9101835L (sv) 1992-12-15
SE468575B true SE468575B (sv) 1993-02-08

Family

ID=20383043

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9101835A SE468575B (sv) 1991-06-14 1991-06-14 Anordning med laminaera ledningsmoenster och valbara dielektrika

Country Status (6)

Country Link
US (1) US5319330A (de)
EP (1) EP0543979B1 (de)
JP (1) JP3299265B2 (de)
DE (1) DE69209978T2 (de)
SE (1) SE468575B (de)
WO (1) WO1992022994A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476970A (en) * 1984-02-16 1995-12-19 Velsicol Chemical Corporation Method for preparing aryl ketones
JP2000068702A (ja) * 1998-08-24 2000-03-03 Sony Corp フィルタ素子およびその製造方法
JP5293239B2 (ja) * 2009-02-04 2013-09-18 株式会社デンソー プリント基板およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL181611C (nl) * 1978-11-14 1987-09-16 Philips Nv Werkwijze ter vervaardiging van een bedradingssysteem, alsmede een halfgeleiderinrichting voorzien van een dergelijk bedradingssysteem.
US4349862A (en) * 1980-08-11 1982-09-14 International Business Machines Corporation Capacitive chip carrier and multilayer ceramic capacitors
DE3462652D1 (en) * 1983-03-25 1987-04-16 Bbc Brown Boveri & Cie Board fixture, especially for a circuit board, and method for its manufacture
DE3412290A1 (de) * 1984-04-03 1985-10-03 System Kontakt Gesellschaft für elektronische Bauelemente mbH, 7107 Bad Friedrichshall Mehrlagige leiterplatte in multilayer- oder stapeltechnik
US4772864A (en) * 1987-02-09 1988-09-20 Harris Corporation Multilayer circuit prototyping board
US4870377A (en) * 1987-11-27 1989-09-26 General Electric Company Electronic circuit substrate construction
FR2635920B1 (fr) * 1988-08-30 1990-10-12 Thomson Csf Procede de fabrication d'une zone de connexion pour un circuit hyperfrequence de type triplaque et circuit ainsi obtenu
GB2232822A (en) * 1989-06-05 1990-12-19 Marconi Co Ltd Signal carrier support
US5184210A (en) * 1990-03-20 1993-02-02 Digital Equipment Corporation Structure for controlling impedance and cross-talk in a printed circuit substrate
US5184095A (en) * 1991-07-31 1993-02-02 Hughes Aircraft Company Constant impedance transition between transmission structures of different dimensions
US5164692A (en) * 1991-09-05 1992-11-17 Ael Defense Corp. Triplet plated-through double layered transmission line
US5194833A (en) * 1991-11-15 1993-03-16 Motorola, Inc. Airbridge compensated microwave conductors

Also Published As

Publication number Publication date
EP0543979A1 (de) 1993-06-02
EP0543979B1 (de) 1996-04-17
SE9101835D0 (sv) 1991-06-14
JPH06500904A (ja) 1994-01-27
DE69209978T2 (de) 1996-09-05
WO1992022994A1 (en) 1992-12-23
DE69209978D1 (de) 1996-05-23
JP3299265B2 (ja) 2002-07-08
US5319330A (en) 1994-06-07
SE9101835L (sv) 1992-12-15

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