SE447191B - Forfarande for tillverkning av elektriska kretsar - Google Patents

Forfarande for tillverkning av elektriska kretsar

Info

Publication number
SE447191B
SE447191B SE7806960A SE7806960A SE447191B SE 447191 B SE447191 B SE 447191B SE 7806960 A SE7806960 A SE 7806960A SE 7806960 A SE7806960 A SE 7806960A SE 447191 B SE447191 B SE 447191B
Authority
SE
Sweden
Prior art keywords
card
lines
wire
grid pattern
substrate
Prior art date
Application number
SE7806960A
Other languages
English (en)
Swedish (sv)
Other versions
SE7806960L (sv
Inventor
J B Burr
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE7806960L publication Critical patent/SE7806960L/xx
Publication of SE447191B publication Critical patent/SE447191B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
  • Measuring Or Testing Involving Enzymes Or Micro-Organisms (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
SE7806960A 1977-06-20 1978-06-16 Forfarande for tillverkning av elektriska kretsar SE447191B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80836377A 1977-06-20 1977-06-20

Publications (2)

Publication Number Publication Date
SE7806960L SE7806960L (sv) 1978-12-21
SE447191B true SE447191B (sv) 1986-10-27

Family

ID=25198567

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7806960A SE447191B (sv) 1977-06-20 1978-06-16 Forfarande for tillverkning av elektriska kretsar

Country Status (13)

Country Link
JP (1) JPS548874A (de)
AT (1) AT374330B (de)
AU (1) AU523939B2 (de)
CA (1) CA1111569A (de)
CH (1) CH635715A5 (de)
DE (1) DE2827312C2 (de)
FR (1) FR2395673A1 (de)
GB (1) GB2004703B (de)
IL (1) IL54900A (de)
IT (1) IT1105425B (de)
NL (1) NL189107C (de)
SE (1) SE447191B (de)
ZA (1) ZA781637B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US5008619A (en) * 1988-11-18 1991-04-16 Amp-Akzo Corporation Multilevel circuit board precision positioning
DE19618917C1 (de) * 1996-05-12 1997-10-02 Markus Woelfel Verfahren und Vorrichtung zur Herstellung von drahtgeschriebenen Leiterplatten

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
JPS5550399B1 (de) * 1970-03-05 1980-12-17

Also Published As

Publication number Publication date
IT1105425B (it) 1985-11-04
CA1111569A (en) 1981-10-27
NL189107B (nl) 1992-08-03
CH635715A5 (de) 1983-04-15
GB2004703B (en) 1982-01-13
IT7849944A0 (it) 1978-06-20
ATA413478A (de) 1983-08-15
DE2827312C2 (de) 1982-05-27
AU3615478A (en) 1979-11-22
FR2395673B1 (de) 1980-10-24
DE2827312A1 (de) 1978-12-21
NL189107C (nl) 1993-01-04
GB2004703A (en) 1979-04-04
AT374330B (de) 1984-04-10
JPS548874A (en) 1979-01-23
ZA781637B (en) 1979-02-28
IL54900A (en) 1980-07-31
IL54900A0 (en) 1978-08-31
AU523939B2 (en) 1982-08-26
FR2395673A1 (fr) 1979-01-19
SE7806960L (sv) 1978-12-21
NL7806608A (nl) 1978-12-22

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