SE402035B - Halvledaranordning, innefattande ett isolerande substrat och pa detta en tunn skiktliknande kropp av halvledarmaterial, och forfarande for dess framstellning - Google Patents

Halvledaranordning, innefattande ett isolerande substrat och pa detta en tunn skiktliknande kropp av halvledarmaterial, och forfarande for dess framstellning

Info

Publication number
SE402035B
SE402035B SE7502893A SE7502893A SE402035B SE 402035 B SE402035 B SE 402035B SE 7502893 A SE7502893 A SE 7502893A SE 7502893 A SE7502893 A SE 7502893A SE 402035 B SE402035 B SE 402035B
Authority
SE
Sweden
Prior art keywords
thin
procedure
manufacture
insulating substrate
semiconductor material
Prior art date
Application number
SE7502893A
Other languages
English (en)
Swedish (sv)
Other versions
SE7502893L (sv
Inventor
T G Athanas
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of SE7502893L publication Critical patent/SE7502893L/xx
Publication of SE402035B publication Critical patent/SE402035B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651—Silicon transistors
    • H01L29/78654—Monocrystalline silicon transistors
    • H01L29/78657—SOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H01L21/86—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7838—Field effect transistors with field effect produced by an insulated gate without inversion channel, e.g. buried channel lateral MISFETs, normally-on lateral MISFETs, depletion-mode lateral MISFETs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/053—Field effect transistors fets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/15—Silicon on sapphire SOS

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
  • Bipolar Transistors (AREA)
  • Junction Field-Effect Transistors (AREA)
SE7502893A 1974-04-19 1975-03-14 Halvledaranordning, innefattande ett isolerande substrat och pa detta en tunn skiktliknande kropp av halvledarmaterial, och forfarande for dess framstellning SE402035B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/462,494 US3958266A (en) 1974-04-19 1974-04-19 Deep depletion insulated gate field effect transistors

Publications (2)

Publication Number Publication Date
SE7502893L SE7502893L (sv) 1975-10-20
SE402035B true SE402035B (sv) 1978-06-12

Family

ID=23836618

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7502893A SE402035B (sv) 1974-04-19 1975-03-14 Halvledaranordning, innefattande ett isolerande substrat och pa detta en tunn skiktliknande kropp av halvledarmaterial, och forfarande for dess framstellning

Country Status (14)

Country Link
US (1) US3958266A (de)
JP (1) JPS5436033B2 (de)
BE (1) BE827147A (de)
BR (1) BR7501870A (de)
CA (1) CA1024266A (de)
CH (1) CH592963A5 (de)
DE (1) DE2512373B2 (de)
FR (1) FR2268361B1 (de)
GB (1) GB1465244A (de)
IN (1) IN144098B (de)
IT (1) IT1034492B (de)
NL (1) NL7503726A (de)
SE (1) SE402035B (de)
SU (1) SU679168A3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304811A1 (de) * 1987-08-24 1989-03-01 Asea Brown Boveri Ab MOS-Transistor

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JPS5179371A (de) * 1974-12-18 1976-07-10 Suwa Seikosha Kk
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JPS605069B2 (ja) * 1976-05-28 1985-02-08 工業技術院長 Ｓｏｓ半導体装置
US4096509A (en) * 1976-07-22 1978-06-20 The United States Of America As Represented By The Secretary Of The Air Force MNOS memory transistor having a redeposited silicon nitride gate dielectric
US4097314A (en) * 1976-12-30 1978-06-27 Rca Corp. Method of making a sapphire gate transistor
US4091527A (en) * 1977-03-07 1978-05-30 Rca Corporation Method for adjusting the leakage current of silicon-on-sapphire insulated gate field effect transistors
US4070211A (en) * 1977-04-04 1978-01-24 The United States Of America As Represented By The Secretary Of The Navy Technique for threshold control over edges of devices on silicon-on-sapphire
US4104087A (en) * 1977-04-07 1978-08-01 The United States Of America As Represented By The Secretary Of The Air Force Method for fabricating MNOS memory circuits
JPS5433679A (en) * 1977-08-22 1979-03-12 Agency Of Ind Science & Technol Semiconductor intergrated circuit on insulation substrate
US4183033A (en) * 1978-03-13 1980-01-08 National Research Development Corporation Field effect transistors
US4196443A (en) * 1978-08-25 1980-04-01 Rca Corporation Buried contact configuration for CMOS/SOS integrated circuits
US5191396B1 (en) * 1978-10-13 1995-12-26 Int Rectifier Corp High power mosfet with low on-resistance and high breakdown voltage
JPS5553462A (en) * 1978-10-13 1980-04-18 Int Rectifier Corp Mosfet element
JPS55160457A (en) * 1979-03-30 1980-12-13 Toshiba Corp Semiconductor device
US5130767C1 (en) * 1979-05-14 2001-08-14 Int Rectifier Corp Plural polygon source pattern for mosfet
DE3028718C2 (de) * 1979-07-31 1982-08-19 Sharp K.K., Osaka Dünnfilmtransistor in Verbindung mit einer Anzeigevorrichtung
IT1131790B (it) * 1979-08-20 1986-06-25 Rca Corp Complesso universale di collegamento interno per circuiti integrati cmos/sos ad alta densita'
US4253162A (en) * 1979-08-28 1981-02-24 Rca Corporation Blocked source node field-effect circuitry
US4276688A (en) * 1980-01-21 1981-07-07 Rca Corporation Method for forming buried contact complementary MOS devices
US4523368A (en) * 1980-03-03 1985-06-18 Raytheon Company Semiconductor devices and manufacturing methods
GB2140617B (en) * 1980-03-03 1985-06-19 Raytheon Co Methods of forming a field effect transistor
US4336550A (en) * 1980-03-20 1982-06-22 Rca Corporation CMOS Device with silicided sources and drains and method
US4277884A (en) * 1980-08-04 1981-07-14 Rca Corporation Method for forming an improved gate member utilizing special masking and oxidation to eliminate projecting points on silicon islands
US4418470A (en) * 1981-10-21 1983-12-06 General Electric Company Method for fabricating silicon-on-sapphire monolithic microwave integrated circuits
FR2524714B1 (fr) * 1982-04-01 1986-05-02 Suwa Seikosha Kk Transistor a couche mince
JPS58186961A (ja) * 1982-04-26 1983-11-01 Toshiba Corp 半導体装置
US4862237A (en) * 1983-01-10 1989-08-29 Seiko Epson Corporation Solid state image sensor
JPS59201460A (ja) * 1983-04-30 1984-11-15 Sharp Corp Ｃｍｏｓ△ｆｅｔ集積回路の製造方法
US5111260A (en) * 1983-06-17 1992-05-05 Texax Instruments Incorporated Polysilicon FETs
US4575746A (en) * 1983-11-28 1986-03-11 Rca Corporation Crossunders for high density SOS integrated circuits
GB2233822A (en) * 1989-07-12 1991-01-16 Philips Electronic Associated A thin film field effect transistor
RU2130668C1 (ru) * 1994-09-30 1999-05-20 Акционерное общество закрытого типа "VL" Полевой транзистор типа металл - диэлектрик-полупроводник
US5869371A (en) * 1995-06-07 1999-02-09 Stmicroelectronics, Inc. Structure and process for reducing the on-resistance of mos-gated power devices
US5614433A (en) * 1995-12-18 1997-03-25 International Business Machines Corporation Method of fabricating low leakage SOI integrated circuits
US20070040222A1 (en) * 2005-06-15 2007-02-22 Benjamin Van Camp Method and apparatus for improved ESD performance
JP5128064B2 (ja) * 2005-06-17 2013-01-23 国立大学法人東北大学 半導体装置
US8273617B2 (en) 2009-09-30 2012-09-25 Suvolta, Inc. Electronic devices and systems, and methods for making and using the same
US8421162B2 (en) 2009-09-30 2013-04-16 Suvolta, Inc. Advanced transistors with punch through suppression
US8530286B2 (en) 2010-04-12 2013-09-10 Suvolta, Inc. Low power semiconductor transistor structure and method of fabrication thereof
US8569128B2 (en) 2010-06-21 2013-10-29 Suvolta, Inc. Semiconductor structure and method of fabrication thereof with mixed metal types
US8759872B2 (en) 2010-06-22 2014-06-24 Suvolta, Inc. Transistor with threshold voltage set notch and method of fabrication thereof
US8377783B2 (en) 2010-09-30 2013-02-19 Suvolta, Inc. Method for reducing punch-through in a transistor device
US8404551B2 (en) 2010-12-03 2013-03-26 Suvolta, Inc. Source/drain extension control for advanced transistors
US8461875B1 (en) 2011-02-18 2013-06-11 Suvolta, Inc. Digital circuits having improved transistors, and methods therefor
US8525271B2 (en) 2011-03-03 2013-09-03 Suvolta, Inc. Semiconductor structure with improved channel stack and method for fabrication thereof
US8400219B2 (en) 2011-03-24 2013-03-19 Suvolta, Inc. Analog circuits having improved transistors, and methods therefor
US8748270B1 (en) 2011-03-30 2014-06-10 Suvolta, Inc. Process for manufacturing an improved analog transistor
US8796048B1 (en) 2011-05-11 2014-08-05 Suvolta, Inc. Monitoring and measurement of thin film layers
US8999861B1 (en) 2011-05-11 2015-04-07 Suvolta, Inc. Semiconductor structure with substitutional boron and method for fabrication thereof
US8811068B1 (en) 2011-05-13 2014-08-19 Suvolta, Inc. Integrated circuit devices and methods
US8569156B1 (en) 2011-05-16 2013-10-29 Suvolta, Inc. Reducing or eliminating pre-amorphization in transistor manufacture
US8735987B1 (en) 2011-06-06 2014-05-27 Suvolta, Inc. CMOS gate stack structures and processes
US8995204B2 (en) 2011-06-23 2015-03-31 Suvolta, Inc. Circuit devices and methods having adjustable transistor body bias
US8629016B1 (en) 2011-07-26 2014-01-14 Suvolta, Inc. Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304811A1 (de) * 1987-08-24 1989-03-01 Asea Brown Boveri Ab MOS-Transistor

Also Published As

Publication number Publication date
FR2268361B1 (de) 1979-03-16
GB1465244A (en) 1977-02-23
IT1034492B (it) 1979-09-10
SU679168A3 (ru) 1979-08-05
DE2512373A1 (de) 1975-11-06
NL7503726A (nl) 1975-10-21
CA1024266A (en) 1978-01-10
IN144098B (de) 1978-03-25
AU7947975A (en) 1976-09-30
CH592963A5 (de) 1977-11-15
BR7501870A (pt) 1976-03-09
BE827147A (fr) 1975-07-16
DE2512373B2 (de) 1978-08-10
FR2268361A1 (de) 1975-11-14
JPS5436033B2 (de) 1979-11-07
JPS50137688A (de) 1975-10-31
US3958266A (en) 1976-05-18
SE7502893L (sv) 1975-10-20

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