SE390083B - Fastklemningsorgan for att klemma fast en halvledaranordning mellan tva vermeavledande kroppar - Google Patents

Fastklemningsorgan for att klemma fast en halvledaranordning mellan tva vermeavledande kroppar

Info

Publication number
SE390083B
SE390083B SE7307845A SE7307845A SE390083B SE 390083 B SE390083 B SE 390083B SE 7307845 A SE7307845 A SE 7307845A SE 7307845 A SE7307845 A SE 7307845A SE 390083 B SE390083 B SE 390083B
Authority
SE
Sweden
Prior art keywords
clamping
age
bodies
semiconductor device
derivative
Prior art date
Application number
SE7307845A
Other languages
English (en)
Swedish (sv)
Inventor
J Morton
K D Stevens
G S Thexton
Original Assignee
Cableform Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cableform Ltd filed Critical Cableform Ltd
Publication of SE390083B publication Critical patent/SE390083B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Thyristors (AREA)
SE7307845A 1972-06-08 1973-06-04 Fastklemningsorgan for att klemma fast en halvledaranordning mellan tva vermeavledande kroppar SE390083B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2667072A GB1381778A (en) 1972-06-08 1972-06-08 Semiconductor clamping means

Publications (1)

Publication Number Publication Date
SE390083B true SE390083B (sv) 1976-11-29

Family

ID=10247327

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7307845A SE390083B (sv) 1972-06-08 1973-06-04 Fastklemningsorgan for att klemma fast en halvledaranordning mellan tva vermeavledande kroppar

Country Status (7)

Country Link
US (1) US3867003A (xx)
BG (1) BG22089A3 (xx)
DE (1) DE2328945C2 (xx)
FR (1) FR2188306B1 (xx)
GB (1) GB1381778A (xx)
IT (1) IT985334B (xx)
SE (1) SE390083B (xx)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688150A (en) * 1984-06-15 1987-08-18 Texas Instruments Incorporated High pin count chip carrier package
EP0750341A1 (en) * 1995-06-19 1996-12-27 BULL HN INFORMATION SYSTEMS ITALIA S.p.A. A releasable mount heat-sink for a very large scale integrated circuit
US5654876A (en) * 1996-01-05 1997-08-05 International Business Machines Corporation Demountable heat sink
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US6324073B1 (en) 1998-12-22 2001-11-27 S&C Electric Co. Clamping arrangement for compression-mounted power electronic devices
JP4213329B2 (ja) * 2000-06-15 2009-01-21 三菱電機株式会社 限流装置
US6791181B2 (en) * 2000-11-29 2004-09-14 Mitsubishi Chemical Corporation Semiconductor light emitting device
KR100389920B1 (ko) * 2000-12-12 2003-07-04 삼성전자주식회사 열팽창에 의한 신뢰성 저하를 개선할 수 있는 반도체 모듈
TWI273670B (en) * 2006-01-16 2007-02-11 Advanced Semiconductor Eng Clamping device and method for a curing process
EP2109885B1 (en) * 2007-01-26 2016-05-04 Inductotherm Corp. Compression clamping of semiconductor components
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink
US11396746B2 (en) * 2019-06-14 2022-07-26 Quaketek Inc. Beam coupler operating as a seismic brake, seismic energy dissipation device and seismic damage control device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL207356A (xx) * 1955-05-23
US2819435A (en) * 1955-09-14 1958-01-07 Gen Electric Co Ltd Rectifier assemblies
DE1185728B (de) * 1960-05-18 1965-01-21 Siemens Ag Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
US3027535A (en) * 1960-05-20 1962-03-27 Gen Dynamics Corp Tube holder for ceramic button tubes
FR1600561A (xx) * 1968-01-26 1970-07-27
CH474153A (de) * 1968-05-16 1969-06-15 Bbc Brown Boveri & Cie Verfahren zur Herstellung einer Halbleitereinheit durch Montage eines scheibenförmigen Halbleiterelementes mit zwei Kühlkörpern sowie Halbleitereinheit, hergestellt nach diesem Verfahren
JPS5030428B1 (xx) * 1969-03-31 1975-10-01
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
CH522288A (de) * 1970-09-29 1972-06-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
US3867003A (en) 1975-02-18
FR2188306A1 (xx) 1974-01-18
GB1381778A (en) 1975-01-29
IT985334B (it) 1974-11-30
BG22089A3 (xx) 1976-11-25
DE2328945A1 (de) 1973-12-20
DE2328945C2 (de) 1985-01-24
FR2188306B1 (xx) 1977-12-30

Similar Documents

Publication Publication Date Title
SE398319B (sv) Anordning for deckframstellning
SE388015B (sv) Forbindningsanordning for skivformiga kroppar
AT344623B (de) Spannvorrichtung
NO138611C (no) Markeringsanordning til anbringelse paa kleshengere
IT981860B (it) Dispositivo semiconduttore
SE431372B (sv) Programmerad manipulatoranordning
SE392968B (sv) Anordning for bestemning av matten hos mekaniska arbetsstycken
NO138668C (no) Anordning til understoettelse av et legeme paa et annet
SE409004B (sv) Anordning for tillslutning av defekta vermevexlare
SE390083B (sv) Fastklemningsorgan for att klemma fast en halvledaranordning mellan tva vermeavledande kroppar
IT996680B (it) Dispositivo semiconduttore
CH498029A (de) Ubergabevorrichtung für Werkstücke, vorzugsweise Packungen
IT1002384B (it) Dispositivo semiconduttore
IT996919B (it) Dispositivo semiconduttore
AT326704B (de) Schnellspannvorrichtung
IT986562B (it) Dispositivo semiconduttore
SE7509118L (sv) Spennanordning for fastspennande av arbetsstycken
IT1002416B (it) Dispositivo semiconduttore
IT981505B (it) Dispositivo a semiconduttori a cariche accoppiate perfezionato
IT977703B (it) Dispositivo semiconduttore
IT989098B (it) Dispositivo pneumatico di serraggio
SE384141B (sv) Silanordning
IT991623B (it) Dispositivo di imballaggio
IT982699B (it) Memoria a semiconduttori perfezionata
CH437178A (de) Tiefziehvorrichtung zum Herstellen nahtloser Büchsen