IT985334B - Perfezionamento nelle disposi zioni di serraggio di dispositi vi a semiconduttori su dissipa tori termici - Google Patents

Perfezionamento nelle disposi zioni di serraggio di dispositi vi a semiconduttori su dissipa tori termici

Info

Publication number
IT985334B
IT985334B IT5048473A IT5048473A IT985334B IT 985334 B IT985334 B IT 985334B IT 5048473 A IT5048473 A IT 5048473A IT 5048473 A IT5048473 A IT 5048473A IT 985334 B IT985334 B IT 985334B
Authority
IT
Italy
Prior art keywords
dissipers
improvement
thermal
semiconductor devices
clamping arrangements
Prior art date
Application number
IT5048473A
Other languages
English (en)
Original Assignee
Cableform Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cableform Ltd filed Critical Cableform Ltd
Application granted granted Critical
Publication of IT985334B publication Critical patent/IT985334B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Thyristors (AREA)
IT5048473A 1972-06-08 1973-06-06 Perfezionamento nelle disposi zioni di serraggio di dispositi vi a semiconduttori su dissipa tori termici IT985334B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2667072A GB1381778A (en) 1972-06-08 1972-06-08 Semiconductor clamping means

Publications (1)

Publication Number Publication Date
IT985334B true IT985334B (it) 1974-11-30

Family

ID=10247327

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5048473A IT985334B (it) 1972-06-08 1973-06-06 Perfezionamento nelle disposi zioni di serraggio di dispositi vi a semiconduttori su dissipa tori termici

Country Status (7)

Country Link
US (1) US3867003A (it)
BG (1) BG22089A3 (it)
DE (1) DE2328945C2 (it)
FR (1) FR2188306B1 (it)
GB (1) GB1381778A (it)
IT (1) IT985334B (it)
SE (1) SE390083B (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688150A (en) * 1984-06-15 1987-08-18 Texas Instruments Incorporated High pin count chip carrier package
EP0750341A1 (en) * 1995-06-19 1996-12-27 BULL HN INFORMATION SYSTEMS ITALIA S.p.A. A releasable mount heat-sink for a very large scale integrated circuit
US5654876A (en) * 1996-01-05 1997-08-05 International Business Machines Corporation Demountable heat sink
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US6324073B1 (en) 1998-12-22 2001-11-27 S&C Electric Co. Clamping arrangement for compression-mounted power electronic devices
JP4213329B2 (ja) * 2000-06-15 2009-01-21 三菱電機株式会社 限流装置
US6791181B2 (en) * 2000-11-29 2004-09-14 Mitsubishi Chemical Corporation Semiconductor light emitting device
KR100389920B1 (ko) * 2000-12-12 2003-07-04 삼성전자주식회사 열팽창에 의한 신뢰성 저하를 개선할 수 있는 반도체 모듈
TWI273670B (en) * 2006-01-16 2007-02-11 Advanced Semiconductor Eng Clamping device and method for a curing process
EP2109885B1 (en) * 2007-01-26 2016-05-04 Inductotherm Corp. Compression clamping of semiconductor components
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink
US11396746B2 (en) * 2019-06-14 2022-07-26 Quaketek Inc. Beam coupler operating as a seismic brake, seismic energy dissipation device and seismic damage control device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL207356A (it) * 1955-05-23
US2819435A (en) * 1955-09-14 1958-01-07 Gen Electric Co Ltd Rectifier assemblies
DE1185728B (de) * 1960-05-18 1965-01-21 Siemens Ag Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
US3027535A (en) * 1960-05-20 1962-03-27 Gen Dynamics Corp Tube holder for ceramic button tubes
FR1600561A (it) * 1968-01-26 1970-07-27
CH474153A (de) * 1968-05-16 1969-06-15 Bbc Brown Boveri & Cie Verfahren zur Herstellung einer Halbleitereinheit durch Montage eines scheibenförmigen Halbleiterelementes mit zwei Kühlkörpern sowie Halbleitereinheit, hergestellt nach diesem Verfahren
JPS5030428B1 (it) * 1969-03-31 1975-10-01
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
CH522288A (de) * 1970-09-29 1972-06-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
US3867003A (en) 1975-02-18
FR2188306A1 (it) 1974-01-18
GB1381778A (en) 1975-01-29
SE390083B (sv) 1976-11-29
BG22089A3 (it) 1976-11-25
DE2328945A1 (de) 1973-12-20
DE2328945C2 (de) 1985-01-24
FR2188306B1 (it) 1977-12-30

Similar Documents

Publication Publication Date Title
AT326707B (de) Kuhlturm
IT956495B (it) Metodo perfezionato per la fabbri cazione di dispositivi semicondut tori
IT970487B (it) Torre di lavaggio
IT985334B (it) Perfezionamento nelle disposi zioni di serraggio di dispositi vi a semiconduttori su dissipa tori termici
AT320693B (de) Kühlturm
AT303439B (de) Mehrfachpflanzensockel
AT337734B (de) Kuhlturm
AR195728A1 (es) Aparato rectificador con semiconductores
IT963391B (it) Generatore di superfici curve
AT376844B (de) Halbleiterbauteil
SE384943B (sv) Vibrationsdempat omvandlarhuvud
BE793267A (fr) Surface porteuse perfectionnee
BE803196A (fr) Thyristor
DK138248C (da) Halvlederelement
IT955233B (it) Generatore di effetti speciali
CH543178A (de) Kontinuierlich steuerbares Leistungshalbleiterbauelement
IT957217B (it) Dispositivo di serraggio di pezzi
AT318077B (de) Thyristor
CH541869A (de) Halbleiterbauelement
CH541870A (de) Thyristor
BR7304811D0 (pt) Elemento retificador semi-condutor controlavel
IT968657B (it) Dispositivo di serraggio
CH539339A (de) Halbleiteranordnung mit einer Kühlvorrichtung
AR193280A1 (es) Mejoras en los procesos de hidrodesalquilacion termica
CH542515A (de) Thyristor