SE385757B - Fukttett holje for elektriska komponenter samt forfarande for framstellning av ett dylikt fukttett holje - Google Patents

Fukttett holje for elektriska komponenter samt forfarande for framstellning av ett dylikt fukttett holje

Info

Publication number
SE385757B
SE385757B SE7400046A SE7400046A SE385757B SE 385757 B SE385757 B SE 385757B SE 7400046 A SE7400046 A SE 7400046A SE 7400046 A SE7400046 A SE 7400046A SE 385757 B SE385757 B SE 385757B
Authority
SE
Sweden
Prior art keywords
seal cover
moisture
procedures
production
electrical components
Prior art date
Application number
SE7400046A
Other languages
English (en)
Swedish (sv)
Inventor
F Utner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE385757B publication Critical patent/SE385757B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/01—
    • H10W74/144—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cable Accessories (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
SE7400046A 1973-01-30 1974-01-03 Fukttett holje for elektriska komponenter samt forfarande for framstellning av ett dylikt fukttett holje SE385757B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Publications (1)

Publication Number Publication Date
SE385757B true SE385757B (sv) 1976-07-19

Family

ID=5870335

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7400046A SE385757B (sv) 1973-01-30 1974-01-03 Fukttett holje for elektriska komponenter samt forfarande for framstellning av ett dylikt fukttett holje

Country Status (18)

Country Link
JP (1) JPS49105161A (enExample)
AT (1) AT327345B (enExample)
AU (1) AU6352073A (enExample)
BE (1) BE810374A (enExample)
BR (1) BR7309911D0 (enExample)
CH (1) CH562512A5 (enExample)
CS (1) CS170484B2 (enExample)
DD (1) DD109475A5 (enExample)
DE (1) DE2304412A1 (enExample)
ES (2) ES422706A1 (enExample)
FR (1) FR2215780B1 (enExample)
GB (1) GB1418949A (enExample)
IT (1) IT1006156B (enExample)
LU (1) LU68391A1 (enExample)
NL (1) NL7317195A (enExample)
SE (1) SE385757B (enExample)
SU (1) SU528892A3 (enExample)
ZA (1) ZA74310B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
DE2830472C3 (de) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren
DE3216192A1 (de) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896C2 (de) * 1983-12-23 1995-05-11 Siemens Ag Vorrichtung zum Schutz von Anzeigeelementen und mit diesen verbundenen Schaltungen vor Störungen durch elektrostatische Ladungen
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
DE20011590U1 (de) * 2000-07-03 2000-09-07 Infineon Technologies AG, 81541 München Halbleiterchip-Modul mit Schutzfolie
EP2293657A1 (en) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Electronic component and method of forming an electronic component
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Also Published As

Publication number Publication date
DE2304412A1 (de) 1974-08-01
BE810374A (fr) 1974-05-16
DD109475A5 (enExample) 1974-11-05
SU528892A3 (ru) 1976-09-15
FR2215780A1 (enExample) 1974-08-23
AT327345B (de) 1976-01-26
IT1006156B (it) 1976-09-30
NL7317195A (enExample) 1974-08-01
GB1418949A (en) 1975-12-24
ES422705A1 (es) 1976-04-16
JPS49105161A (enExample) 1974-10-04
CH562512A5 (enExample) 1975-05-30
BR7309911D0 (pt) 1974-10-22
ZA74310B (en) 1974-11-27
CS170484B2 (enExample) 1976-08-27
LU68391A1 (enExample) 1973-11-22
FR2215780B1 (enExample) 1977-09-23
ATA869073A (de) 1975-04-15
AU6352073A (en) 1975-06-12
ES422706A1 (es) 1976-04-16

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