FR2215780A1 - - Google Patents

Info

Publication number
FR2215780A1
FR2215780A1 FR7402874A FR7402874A FR2215780A1 FR 2215780 A1 FR2215780 A1 FR 2215780A1 FR 7402874 A FR7402874 A FR 7402874A FR 7402874 A FR7402874 A FR 7402874A FR 2215780 A1 FR2215780 A1 FR 2215780A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7402874A
Other languages
French (fr)
Other versions
FR2215780B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of FR2215780A1 publication Critical patent/FR2215780A1/fr
Application granted granted Critical
Publication of FR2215780B1 publication Critical patent/FR2215780B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/01
    • H10W74/144
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10977Encapsulated connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1311Foil encapsulation, e.g. of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1322Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cable Accessories (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
FR7402874A 1973-01-30 1974-01-29 Expired FR2215780B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Publications (2)

Publication Number Publication Date
FR2215780A1 true FR2215780A1 (enExample) 1974-08-23
FR2215780B1 FR2215780B1 (enExample) 1977-09-23

Family

ID=5870335

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7402874A Expired FR2215780B1 (enExample) 1973-01-30 1974-01-29

Country Status (18)

Country Link
JP (1) JPS49105161A (enExample)
AT (1) AT327345B (enExample)
AU (1) AU6352073A (enExample)
BE (1) BE810374A (enExample)
BR (1) BR7309911D0 (enExample)
CH (1) CH562512A5 (enExample)
CS (1) CS170484B2 (enExample)
DD (1) DD109475A5 (enExample)
DE (1) DE2304412A1 (enExample)
ES (2) ES422706A1 (enExample)
FR (1) FR2215780B1 (enExample)
GB (1) GB1418949A (enExample)
IT (1) IT1006156B (enExample)
LU (1) LU68391A1 (enExample)
NL (1) NL7317195A (enExample)
SE (1) SE385757B (enExample)
SU (1) SU528892A3 (enExample)
ZA (1) ZA74310B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
DE2830472C3 (de) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren
DE3216192A1 (de) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896C2 (de) * 1983-12-23 1995-05-11 Siemens Ag Vorrichtung zum Schutz von Anzeigeelementen und mit diesen verbundenen Schaltungen vor Störungen durch elektrostatische Ladungen
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
DE20011590U1 (de) * 2000-07-03 2000-09-07 Infineon Technologies AG, 81541 München Halbleiterchip-Modul mit Schutzfolie
EP2293657A1 (en) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Electronic component and method of forming an electronic component
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number Publication date
DE2304412A1 (de) 1974-08-01
BE810374A (fr) 1974-05-16
SE385757B (sv) 1976-07-19
DD109475A5 (enExample) 1974-11-05
SU528892A3 (ru) 1976-09-15
AT327345B (de) 1976-01-26
IT1006156B (it) 1976-09-30
NL7317195A (enExample) 1974-08-01
GB1418949A (en) 1975-12-24
ES422705A1 (es) 1976-04-16
JPS49105161A (enExample) 1974-10-04
CH562512A5 (enExample) 1975-05-30
BR7309911D0 (pt) 1974-10-22
ZA74310B (en) 1974-11-27
CS170484B2 (enExample) 1976-08-27
LU68391A1 (enExample) 1973-11-22
FR2215780B1 (enExample) 1977-09-23
ATA869073A (de) 1975-04-15
AU6352073A (en) 1975-06-12
ES422706A1 (es) 1976-04-16

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse