SE369028B - - Google Patents
Info
- Publication number
- SE369028B SE369028B SE611671A SE611671A SE369028B SE 369028 B SE369028 B SE 369028B SE 611671 A SE611671 A SE 611671A SE 611671 A SE611671 A SE 611671A SE 369028 B SE369028 B SE 369028B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
- H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
- H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06579—TAB carriers; beam leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702022895 DE2022895B2 (de) | 1970-05-11 | 1970-05-11 | Stapelfoermige anordnung von halbleiterkoerpern und verfahren zu deren herstellung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE369028B true SE369028B (enrdf_load_stackoverflow) | 1974-07-29 |
Family
ID=5770762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE611671A SE369028B (enrdf_load_stackoverflow) | 1970-05-11 | 1971-05-11 |
Country Status (8)
| Country | Link |
|---|---|
| AT (1) | AT322059B (enrdf_load_stackoverflow) |
| CA (1) | CA922818A (enrdf_load_stackoverflow) |
| CH (1) | CH519247A (enrdf_load_stackoverflow) |
| DE (1) | DE2022895B2 (enrdf_load_stackoverflow) |
| FR (1) | FR2088490A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1300881A (enrdf_load_stackoverflow) |
| NL (1) | NL7106459A (enrdf_load_stackoverflow) |
| SE (1) | SE369028B (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2806685A1 (de) * | 1978-02-16 | 1979-08-23 | Siemens Ag | Stapelbauweise fuer halbleiter- speicherbausteine |
| JPS5837948A (ja) * | 1981-08-31 | 1983-03-05 | Toshiba Corp | 積層半導体記憶装置 |
| GB2150749B (en) * | 1983-12-03 | 1987-09-23 | Standard Telephones Cables Ltd | Integrated circuits |
| US4982264A (en) * | 1985-02-27 | 1991-01-01 | Texas Instruments Incorporated | High density integrated circuit package |
| DE3640072A1 (de) * | 1986-11-24 | 1988-06-01 | Rolf Tiedeken | Elektronisches datenspeicherorgan, welches eine anzahl von statischen ram-chips aufweist |
| FR2645681B1 (fr) * | 1989-04-07 | 1994-04-08 | Thomson Csf | Dispositif d'interconnexion verticale de pastilles de circuits integres et son procede de fabrication |
| US5059557A (en) * | 1989-08-08 | 1991-10-22 | Texas Instruments Incorporated | Method of electrically connecting integrated circuits by edge-insertion in grooved support members |
| US5696030A (en) * | 1994-09-30 | 1997-12-09 | International Business Machines Corporation | Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor |
-
1970
- 1970-05-11 DE DE19702022895 patent/DE2022895B2/de active Granted
-
1971
- 1971-04-07 CH CH510271A patent/CH519247A/de not_active IP Right Cessation
- 1971-04-27 AT AT361971A patent/AT322059B/de not_active IP Right Cessation
- 1971-05-10 GB GB1398871A patent/GB1300881A/en not_active Expired
- 1971-05-11 FR FR7116896A patent/FR2088490A1/fr not_active Withdrawn
- 1971-05-11 CA CA112685A patent/CA922818A/en not_active Expired
- 1971-05-11 SE SE611671A patent/SE369028B/xx unknown
- 1971-05-11 NL NL7106459A patent/NL7106459A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2088490A1 (enrdf_load_stackoverflow) | 1972-01-07 |
| DE2022895B2 (de) | 1976-12-02 |
| DE2022895A1 (de) | 1971-12-30 |
| NL7106459A (enrdf_load_stackoverflow) | 1971-11-15 |
| GB1300881A (en) | 1972-12-20 |
| CH519247A (de) | 1972-02-15 |
| AT322059B (de) | 1975-05-12 |
| CA922818A (en) | 1973-03-13 |