SE340738B - - Google Patents

Info

Publication number
SE340738B
SE340738B SE06361/67A SE636167A SE340738B SE 340738 B SE340738 B SE 340738B SE 06361/67 A SE06361/67 A SE 06361/67A SE 636167 A SE636167 A SE 636167A SE 340738 B SE340738 B SE 340738B
Authority
SE
Sweden
Prior art keywords
chloride
solution
substrate
metal
treatment
Prior art date
Application number
SE06361/67A
Inventor
R Zeblisky
J Mccormack
F Schneble
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of SE340738B publication Critical patent/SE340738B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Abstract

1,145,578. Printed circuits. PHOTOCIRCUITS CORP. 4 May, 1967 [6 May, 1966], No. 20684/67. Heading H1R. [Also in Division C7] Portions of an insulating substrate, such as a plastics material, of which many suitable examples are listed, are sensitized in the form of a desired printed circuit form, e.g. by treatment with an acidic aqueous solution of stannous chloride followed by a dilute acid aqueous solution of Pd chloride, or by treatment with a single acidic solution containing stannous chloride and a precious metal chloride such as Pd chloride. Cu or other metal is then deposited on one or more surfaces of the substrate, and on the walls of holes through it, by electroless deposition from a solution on to the sensitized parts of the substrate, said solution including a compound containing a cyanide radical complexed with a metal from Group VIII of the Periodic Table.
SE06361/67A 1966-05-06 1967-05-05 SE340738B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54807166A 1966-05-06 1966-05-06

Publications (1)

Publication Number Publication Date
SE340738B true SE340738B (en) 1971-11-29

Family

ID=24187280

Family Applications (1)

Application Number Title Priority Date Filing Date
SE06361/67A SE340738B (en) 1966-05-06 1967-05-05

Country Status (9)

Country Link
US (1) US3485643A (en)
JP (1) JPS5113734B1 (en)
AT (1) AT268811B (en)
CH (1) CH497541A (en)
DE (1) DE1621311C3 (en)
ES (1) ES340230A1 (en)
GB (1) GB1145578A (en)
NL (1) NL152299B (en)
SE (1) SE340738B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621235A1 (en) * 1967-10-13 1971-04-22 Dynamit Nobel Ag Process for the metallization of shaped structures made of thermoplastics
BE757573A (en) * 1969-10-16 1971-04-15 Philips Nv FLEXIBLE COPPER CURRENT FREE DEPOSIT
US3902907A (en) * 1973-08-17 1975-09-02 Kazutaka Kishita System for electroless plating of copper and composition
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4170461A (en) * 1976-12-29 1979-10-09 Ppg Industries, Inc. Heat treatment of electrolessly deposited cuprous oxide coating
US4242369A (en) * 1977-06-07 1980-12-30 Whittaker Corporation Plating of substrates by jet printing
US4192764A (en) * 1977-11-03 1980-03-11 Western Electric Company, Inc. Stabilizing composition for a metal deposition process
US4133908A (en) * 1977-11-03 1979-01-09 Western Electric Company, Inc. Method for depositing a metal on a surface
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4464231A (en) * 1980-10-22 1984-08-07 Dover Findings Inc. Process for fabricating miniature hollow gold spheres
IT1157006B (en) * 1982-03-09 1987-02-11 Alfachimici Spa STABILIZING MIXTURE FOR A CHEMICAL COPPER BATH
US4525390A (en) * 1984-03-09 1985-06-25 International Business Machines Corporation Deposition of copper from electroless plating compositions
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB8812329D0 (en) * 1988-05-25 1988-06-29 Engelhard Corp Electroless deposition
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
US5256441A (en) * 1992-08-04 1993-10-26 Amp-Akzo Corporation Ductile copper
US5258200A (en) * 1992-08-04 1993-11-02 Amp-Akzo Corporation Electroless copper deposition
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
CN101555612A (en) * 2008-04-11 2009-10-14 深圳富泰宏精密工业有限公司 Method for processing surface of shell
EP2672520B1 (en) 2012-06-06 2018-07-04 SEMIKRON Elektronik GmbH & Co. KG Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326700A (en) * 1963-06-12 1967-06-20 Rudolph J Zeblisky Electroless copper plating
US3259559A (en) * 1962-08-22 1966-07-05 Day Company Method for electroless copper plating
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating

Also Published As

Publication number Publication date
US3485643A (en) 1969-12-23
DE1621311A1 (en) 1970-07-23
DE1621311B2 (en) 1972-06-29
ES340230A1 (en) 1968-06-01
GB1145578A (en) 1969-03-19
DE1621311C3 (en) 1974-10-31
JPS5113734B1 (en) 1976-05-01
AT268811B (en) 1969-02-25
NL6706434A (en) 1967-11-07
NL152299B (en) 1977-02-15
CH497541A (en) 1970-10-15

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