SE303158B - - Google Patents

Info

Publication number
SE303158B
SE303158B SE9416/61A SE941661A SE303158B SE 303158 B SE303158 B SE 303158B SE 9416/61 A SE9416/61 A SE 9416/61A SE 941661 A SE941661 A SE 941661A SE 303158 B SE303158 B SE 303158B
Authority
SE
Sweden
Prior art keywords
casing
component
open end
angularly divergent
sept
Prior art date
Application number
SE9416/61A
Other languages
English (en)
Inventor
F Baron
Original Assignee
Vitramoa Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitramoa Inc filed Critical Vitramoa Inc
Publication of SE303158B publication Critical patent/SE303158B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
SE9416/61A 1960-09-27 1961-09-22 SE303158B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58803A US3086149A (en) 1960-09-27 1960-09-27 Encapsulated assemblies

Publications (1)

Publication Number Publication Date
SE303158B true SE303158B (xx) 1968-08-19

Family

ID=22019025

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9416/61A SE303158B (xx) 1960-09-27 1961-09-22

Country Status (5)

Country Link
US (1) US3086149A (xx)
BE (1) BE608332A (xx)
GB (1) GB961057A (xx)
NL (1) NL269613A (xx)
SE (1) SE303158B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112435818A (zh) * 2019-08-26 2021-03-02 和硕联合科技股份有限公司 双端口电子组件

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222450A (en) * 1963-06-20 1965-12-07 Vitramon Inc Encapsulating for electrical component and terminal means for use therewith
US3348568A (en) * 1966-04-22 1967-10-24 Mallory & Co Inc P R Coated ceramic capacitor
US3522493A (en) * 1968-07-10 1970-08-04 Aerovox Corp Tubular mica capacitor
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
US4198671A (en) * 1978-06-05 1980-04-15 Donigan Carolyn L Capacitor assembly
US4255779A (en) * 1978-12-28 1981-03-10 Western Electric Company, Inc. Package machine insertable rolled metallized film capacitor
JPS6311704Y2 (xx) * 1979-06-11 1988-04-05
FR2519509A1 (fr) * 1981-12-31 1983-07-08 Europ Composants Electron Procede et dispositif pour la mise en boitier de composants electroniques
FR2519472A1 (fr) * 1981-12-31 1983-07-08 Europ Composants Electron Procede de fabrication d'un composant electronique revetu d'un boitier, composant ainsi obtenu et appareil de mise en oeuvre du procede
US4563659A (en) * 1982-07-28 1986-01-07 Murata Manufacturing Co., Ltd. Noise filter
US4914547A (en) * 1988-05-06 1990-04-03 American Shizuki Corporation Process for making capacitors
JP4449999B2 (ja) * 2007-03-12 2010-04-14 Ｔｄｋ株式会社 電子部品及びその実装構造並びにインバータ装置
US9916932B1 (en) * 2011-08-24 2018-03-13 The Boeing Company Spacer for cast capacitors
KR20170111678A (ko) * 2016-03-29 2017-10-12 삼성전자주식회사 전자부품

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2899611A (en) * 1959-08-11 Capacitor
US2017842A (en) * 1934-11-16 1935-10-22 Harold B Conant Unidirectional current-carrying device and process of producing the same
US2698372A (en) * 1951-04-23 1954-12-28 Louis J Patla Electrical resistor and method of making same
US2935669A (en) * 1954-10-14 1960-05-03 Cornell Dubilier Electric Encapsulated mica capacitor
US2894316A (en) * 1955-01-21 1959-07-14 Chicago Condenser Corp Method of spacing capacitor leads
US2830698A (en) * 1955-04-25 1958-04-15 Erie Resistor Corp Condenser
DE1057693B (de) * 1956-10-05 1959-05-21 Josef Neuberger Flachkondensator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112435818A (zh) * 2019-08-26 2021-03-02 和硕联合科技股份有限公司 双端口电子组件

Also Published As

Publication number Publication date
US3086149A (en) 1963-04-16
BE608332A (fr) 1962-03-19
GB961057A (en) 1964-06-17
NL269613A (xx)

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