CH400367A - Elektrisches Halbleiterbauelement mit hermetisch gekapseltem Halbleiterelement und Verfahren zur Herstellung eines solchen Halbleiterbauelementes - Google Patents

Elektrisches Halbleiterbauelement mit hermetisch gekapseltem Halbleiterelement und Verfahren zur Herstellung eines solchen Halbleiterbauelementes

Info

Publication number
CH400367A
CH400367A CH966260A CH966260A CH400367A CH 400367 A CH400367 A CH 400367A CH 966260 A CH966260 A CH 966260A CH 966260 A CH966260 A CH 966260A CH 400367 A CH400367 A CH 400367A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
producing
semiconductor
electrical
hermetically encapsulated
Prior art date
Application number
CH966260A
Other languages
English (en)
Inventor
B Green William
R Fortier Jean
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH400367A publication Critical patent/CH400367A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
CH966260A 1959-10-30 1960-08-26 Elektrisches Halbleiterbauelement mit hermetisch gekapseltem Halbleiterelement und Verfahren zur Herstellung eines solchen Halbleiterbauelementes CH400367A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US849788A US3005867A (en) 1959-10-30 1959-10-30 Hermetically sealed semiconductor devices

Publications (1)

Publication Number Publication Date
CH400367A true CH400367A (de) 1965-10-15

Family

ID=25306525

Family Applications (1)

Application Number Title Priority Date Filing Date
CH966260A CH400367A (de) 1959-10-30 1960-08-26 Elektrisches Halbleiterbauelement mit hermetisch gekapseltem Halbleiterelement und Verfahren zur Herstellung eines solchen Halbleiterbauelementes

Country Status (4)

Country Link
US (1) US3005867A (de)
CH (1) CH400367A (de)
DE (1) DE1439909B2 (de)
GB (1) GB910016A (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3136050A (en) * 1959-11-17 1964-06-09 Texas Instruments Inc Container closure method
US3137808A (en) * 1960-06-08 1964-06-16 Erie Technological Prod Inc Hermetically sealed capacitor
DE1250005B (de) * 1961-02-06 1967-09-14
US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
US3170098A (en) * 1963-03-15 1965-02-16 Westinghouse Electric Corp Compression contacted semiconductor devices
US3408451A (en) * 1965-09-01 1968-10-29 Texas Instruments Inc Electrical device package
US3422320A (en) * 1965-12-23 1969-01-14 Gen Motors Corp Sealing technique for composite ferrous-copper base alloy capsules for semiconductor devices
US3534233A (en) * 1967-09-27 1970-10-13 Westinghouse Electric Corp Hermetically sealed electrical device
US3733691A (en) * 1968-10-07 1973-05-22 Kabel Metallwerke Ghh Process for making semiconductor devices
US4049185A (en) * 1977-03-11 1977-09-20 The Nippert Company Method of forming double extruded mount
US4384490A (en) * 1981-04-24 1983-05-24 Dresser Industries, Inc. Pressure gauge construction
JPS59126283A (ja) * 1983-01-07 1984-07-20 Citizen Watch Co Ltd 腕時計外装構造

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2134578A (en) * 1935-12-14 1938-10-25 Gen Electric Insulating and sealing means for evacuated devices
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
NL217849A (de) * 1956-06-12
US2880383A (en) * 1956-10-05 1959-03-31 Motorola Inc High frequency transistor package
US2864980A (en) * 1957-06-10 1958-12-16 Gen Electric Sealed current rectifier

Also Published As

Publication number Publication date
DE1439909B2 (de) 1971-09-23
DE1439909A1 (de) 1968-12-19
GB910016A (en) 1962-11-07
US3005867A (en) 1961-10-24

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