SE0003647D0 - Method, apparatus and use - Google Patents

Method, apparatus and use

Info

Publication number
SE0003647D0
SE0003647D0 SE0003647A SE0003647A SE0003647D0 SE 0003647 D0 SE0003647 D0 SE 0003647D0 SE 0003647 A SE0003647 A SE 0003647A SE 0003647 A SE0003647 A SE 0003647A SE 0003647 D0 SE0003647 D0 SE 0003647D0
Authority
SE
Sweden
Prior art keywords
nozzle
jetting
assembly
information
viscous medium
Prior art date
Application number
SE0003647A
Other languages
English (en)
Swedish (sv)
Inventor
William Holm
Mikael Kamfors
Magnus Fridsell
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE0003647A priority Critical patent/SE0003647D0/xx
Publication of SE0003647D0 publication Critical patent/SE0003647D0/xx
Priority to AU2001294480A priority patent/AU2001294480A1/en
Priority to JP2002535455A priority patent/JP4220234B2/ja
Priority to PCT/SE2001/002198 priority patent/WO2002032201A1/fr
Priority to EP01975123A priority patent/EP1334648A1/fr
Priority to US10/398,712 priority patent/US7011382B2/en
Priority to US11/373,327 priority patent/US7229145B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Ink Jet (AREA)
  • Coating Apparatus (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SE0003647A 2000-10-09 2000-10-09 Method, apparatus and use SE0003647D0 (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE0003647A SE0003647D0 (sv) 2000-10-09 2000-10-09 Method, apparatus and use
AU2001294480A AU2001294480A1 (en) 2000-10-09 2001-10-09 Method of jetting viscous medium
JP2002535455A JP4220234B2 (ja) 2000-10-09 2001-10-09 粘性媒質を噴射する方法
PCT/SE2001/002198 WO2002032201A1 (fr) 2000-10-09 2001-10-09 Procede permettant de pulveriser un milieu visqueux
EP01975123A EP1334648A1 (fr) 2000-10-09 2001-10-09 Procede permettant de pulveriser un milieu visqueux
US10/398,712 US7011382B2 (en) 2000-10-09 2001-10-09 Method of jetting viscous medium
US11/373,327 US7229145B2 (en) 2000-10-09 2006-03-13 Method of jetting viscous medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0003647A SE0003647D0 (sv) 2000-10-09 2000-10-09 Method, apparatus and use

Publications (1)

Publication Number Publication Date
SE0003647D0 true SE0003647D0 (sv) 2000-10-09

Family

ID=20281353

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0003647A SE0003647D0 (sv) 2000-10-09 2000-10-09 Method, apparatus and use

Country Status (6)

Country Link
US (2) US7011382B2 (fr)
EP (1) EP1334648A1 (fr)
JP (1) JP4220234B2 (fr)
AU (1) AU2001294480A1 (fr)
SE (1) SE0003647D0 (fr)
WO (1) WO2002032201A1 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE0202247D0 (sv) * 2002-07-18 2002-07-18 Mydata Automation Ab Jetting device and method at a jetting device
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
KR100540633B1 (ko) * 2003-06-20 2006-01-11 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
WO2005009627A2 (fr) * 2003-07-14 2005-02-03 Nordson Corporation Appareil et procede permettant la distribution de quantites discretes de matiere visqueuse
EP2045744A1 (fr) 2003-08-06 2009-04-08 Panasonic Corporation Procédé, serveur et client pour la réduction du temps de traitement des communications synchrones dans un système distribué client-serveur
CN1934919A (zh) * 2004-01-16 2007-03-21 特伦特有限责任公司 用于将电路组件粘合到电路板的方法
JP4504082B2 (ja) * 2004-04-28 2010-07-14 富士通株式会社 液体注入装置
EP1963042A1 (fr) 2005-11-14 2008-09-03 Mydata Automation AB Appareil de projection et procede permettant d'ameliorer les performances d'un appareil de projection par utilisation d'un debitmetre servant a mesurer le debit d'air
US20070145164A1 (en) * 2005-12-22 2007-06-28 Nordson Corporation Jetting dispenser with multiple jetting nozzle outlets
US7980197B2 (en) * 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US7923056B2 (en) * 2007-06-01 2011-04-12 Illinois Tool Works Inc. Method and apparatus for dispensing material on a substrate
EP2042829B2 (fr) * 2007-09-26 2017-08-09 Hexagon Metrology AB Étalonnage modulaire
JP4582225B2 (ja) * 2008-08-15 2010-11-17 ソニー株式会社 液体吐出装置及び液体吐出方法
US20100055299A1 (en) * 2008-09-02 2010-03-04 Nscrypt, Inc. Dispensing patterns including lines and dots at high speeds
CH707308B1 (de) * 2012-12-05 2017-02-15 Esec Ag Verfahren zum Bestimmen einer Referenzhöhe einer Dispensdüse.
US10082417B2 (en) * 2013-12-30 2018-09-25 Nordson Corporation Calibration methods for a viscous fluid dispensing system
US9815081B2 (en) 2015-02-24 2017-11-14 Illinois Tool Works Inc. Method of calibrating a dispenser
TWI755518B (zh) * 2017-04-14 2022-02-21 美商伊利諾工具工程公司 用於錫膏印刷機的自動加錫膏裝置及系統
KR102455167B1 (ko) * 2017-04-14 2022-10-14 일리노이즈 툴 워크스 인코포레이티드 솔더 페이스트 적하 방지 장치
WO2018189586A2 (fr) * 2017-04-14 2018-10-18 伊利诺斯工具制品有限公司 Composant et procédé d'alimentation de pâte à braser
JP7207152B2 (ja) * 2019-05-16 2023-01-18 株式会社デンソー スリーブはんだ付け装置および電子装置の製造方法
US11246249B2 (en) 2020-04-15 2022-02-08 Illinois Tool Works Inc. Tilt and rotate dispenser having strain wave gear system
US11805634B2 (en) * 2021-08-03 2023-10-31 Illinois Tool Works Inc. Tilt and rotate dispenser having motion control
US11904337B2 (en) 2021-08-03 2024-02-20 Illinois Tool Works Inc. Tilt and rotate dispenser having material flow rate control

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE461822B (sv) 1988-07-08 1990-03-26 Mydata Automation Ab Anordning foer att laegga ut pastor och lim i diskreta punkter, foeretraedesvis vid ytmontering av komponenter paa kretskort
US5243755A (en) 1990-11-02 1993-09-14 Canon Kabushiki Kaisha Ink-jet head assembling apparatus and method
DE4318506A1 (de) 1993-06-03 1994-12-08 Martin Umwelt & Energietech Verfahren und Einrichtung zur Abstandshaltung bei einem Dickstoff-Dispenser
US5984470A (en) 1995-04-20 1999-11-16 Canon Kabushiki Kaisha Apparatus for producing color filter with alignment error detection
JPH09323056A (ja) 1996-06-05 1997-12-16 Hitachi Techno Eng Co Ltd ペースト塗布機
US5889534A (en) * 1996-09-10 1999-03-30 Colorspan Corporation Calibration and registration method for manufacturing a drum-based printing system
US5855323A (en) 1996-11-13 1999-01-05 Sandia Corporation Method and apparatus for jetting, manufacturing and attaching uniform solder balls
KR19990081927A (ko) 1996-11-26 1999-11-15 요트.게.아. 롤페즈 캐리어상에 콤포넌트를 배치하기 위한 방법과 배치기및, 이러한방법과 배치기에 사용되는 보정 캐리어 검출 장치
US6224180B1 (en) 1997-02-21 2001-05-01 Gerald Pham-Van-Diep High speed jet soldering system
JP3980115B2 (ja) 1997-04-22 2007-09-26 松下電器産業株式会社 電子部品接着用ボンドの塗布装置
JPH10341074A (ja) 1997-06-09 1998-12-22 Matsushita Electric Ind Co Ltd 粘性材の塗布方法
SE513527C2 (sv) 1998-06-11 2000-09-25 Mydata Automation Ab Anordning och förfarande för utskjutning av små droppar
JP2000085116A (ja) * 1998-09-10 2000-03-28 Brother Ind Ltd インクジェット記録装置及びその駆動調整方法
ES2265673T3 (es) * 1999-02-18 2007-02-16 Hewlett-Packard Company A Delaware Corporation Un sistema de correccion de errores de posicionamiento de las gotitas en el eje de exploracion en impresoras de chorro de tinta.
US6499821B1 (en) * 1999-07-22 2002-12-31 Canon Kabushiki Kaisha Ink jet printing apparatus and printing head

Also Published As

Publication number Publication date
EP1334648A1 (fr) 2003-08-13
AU2001294480A1 (en) 2002-04-22
US20040118935A1 (en) 2004-06-24
JP2004511333A (ja) 2004-04-15
US7229145B2 (en) 2007-06-12
JP4220234B2 (ja) 2009-02-04
WO2002032201A1 (fr) 2002-04-18
US7011382B2 (en) 2006-03-14
US20060176327A1 (en) 2006-08-10

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