SE0000574L - Anordning för homogen värmning av ett objekt och användning av anordningen - Google Patents

Anordning för homogen värmning av ett objekt och användning av anordningen

Info

Publication number
SE0000574L
SE0000574L SE0000574A SE0000574A SE0000574L SE 0000574 L SE0000574 L SE 0000574L SE 0000574 A SE0000574 A SE 0000574A SE 0000574 A SE0000574 A SE 0000574A SE 0000574 L SE0000574 L SE 0000574L
Authority
SE
Sweden
Prior art keywords
layer
heating
supporting surface
energy
partly
Prior art date
Application number
SE0000574A
Other languages
English (en)
Other versions
SE515785C2 (sv
SE0000574D0 (sv
Inventor
Lars Montelius
Babak Heidari
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Priority to SE0000574A priority Critical patent/SE515785C2/sv
Publication of SE0000574D0 publication Critical patent/SE0000574D0/sv
Priority to EP01906497A priority patent/EP1275030A1/en
Priority to US10/204,631 priority patent/US20030141291A1/en
Priority to AU2001234319A priority patent/AU2001234319A1/en
Priority to CN01806997.5A priority patent/CN1215377C/zh
Priority to JP2001562261A priority patent/JP2003524304A/ja
Priority to PCT/SE2001/000381 priority patent/WO2001063361A1/en
Publication of SE0000574L publication Critical patent/SE0000574L/sv
Publication of SE515785C2 publication Critical patent/SE515785C2/sv
Priority to US10/958,588 priority patent/US20050077285A1/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/52Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0083Temperature control
    • B81B7/009Maintaining a constant temperature by heating or cooling
    • B81B7/0096Maintaining a constant temperature by heating or cooling by heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25Solid
    • B29K2105/253Preform
    • B29K2105/256Sheets, plates, blanks or films
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/38Treatment before imagewise removal, e.g. prebaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
  • Physical Vapour Deposition (AREA)
  • Surface Heating Bodies (AREA)
  • Control Of Resistance Heating (AREA)
SE0000574A 2000-02-23 2000-02-23 Anordning för homogen värmning av ett objekt och användning av anordningen SE515785C2 (sv)

Priority Applications (8)

Application Number Priority Date Filing Date Title
SE0000574A SE515785C2 (sv) 2000-02-23 2000-02-23 Anordning för homogen värmning av ett objekt och användning av anordningen
EP01906497A EP1275030A1 (en) 2000-02-23 2001-02-21 Device for homogeneous heating of an object
US10/204,631 US20030141291A1 (en) 2000-02-23 2001-02-21 Device for homogeneous heating of an object
AU2001234319A AU2001234319A1 (en) 2000-02-23 2001-02-21 Device for homogeneous heating of an object
CN01806997.5A CN1215377C (zh) 2000-02-23 2001-02-21 用于物体均匀加热的设备
JP2001562261A JP2003524304A (ja) 2000-02-23 2001-02-21 物体を均一加熱する装置
PCT/SE2001/000381 WO2001063361A1 (en) 2000-02-23 2001-02-21 Device for homogeneous heating of an object
US10/958,588 US20050077285A1 (en) 2000-02-23 2004-10-06 Device for homogeneous heating of an object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0000574A SE515785C2 (sv) 2000-02-23 2000-02-23 Anordning för homogen värmning av ett objekt och användning av anordningen

Publications (3)

Publication Number Publication Date
SE0000574D0 SE0000574D0 (sv) 2000-02-23
SE0000574L true SE0000574L (sv) 2001-08-24
SE515785C2 SE515785C2 (sv) 2001-10-08

Family

ID=20278542

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0000574A SE515785C2 (sv) 2000-02-23 2000-02-23 Anordning för homogen värmning av ett objekt och användning av anordningen

Country Status (7)

Country Link
US (2) US20030141291A1 (sv)
EP (1) EP1275030A1 (sv)
JP (1) JP2003524304A (sv)
CN (1) CN1215377C (sv)
AU (1) AU2001234319A1 (sv)
SE (1) SE515785C2 (sv)
WO (1) WO2001063361A1 (sv)

Families Citing this family (44)

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AU2001277907A1 (en) 2000-07-17 2002-01-30 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
EP1352295B1 (en) 2000-10-12 2015-12-23 Board of Regents, The University of Texas System Template for room temperature, low pressure micro- and nano-imprint lithography
DE20019210U1 (de) * 2000-11-11 2001-01-25 Schott Glas, 55122 Mainz Kochfeld
EP1513689A1 (en) * 2002-06-20 2005-03-16 Obducat AB Method and device for transferring a pattern
DE10343323A1 (de) * 2003-09-11 2005-04-07 Carl Zeiss Smt Ag Stempellithografieverfahren sowie Vorrichtung und Stempel für die Stempellithografie
JP4321213B2 (ja) * 2003-10-24 2009-08-26 ウシオ電機株式会社 加熱ユニット
US7730834B2 (en) * 2004-03-04 2010-06-08 Asml Netherlands B.V. Printing apparatus and device manufacturing method
TWI243796B (en) * 2004-06-08 2005-11-21 Ind Tech Res Inst Device of nano-structure imprint for pattern transfer and method of the same
CN1300635C (zh) * 2004-12-09 2007-02-14 上海交通大学 真空负压纳米压印方法
US7676088B2 (en) 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US20060144274A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) * 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US20060144814A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US7354698B2 (en) 2005-01-07 2008-04-08 Asml Netherlands B.V. Imprint lithography
US7922474B2 (en) * 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
US7523701B2 (en) 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
JP4619854B2 (ja) * 2005-04-18 2011-01-26 東京エレクトロン株式会社 ロードロック装置及び処理方法
US7762186B2 (en) 2005-04-19 2010-07-27 Asml Netherlands B.V. Imprint lithography
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
US7442029B2 (en) * 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
US20060267231A1 (en) * 2005-05-27 2006-11-30 Asml Netherlands B.V. Imprint lithography
US7692771B2 (en) * 2005-05-27 2010-04-06 Asml Netherlands B.V. Imprint lithography
US7708924B2 (en) * 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
US7418902B2 (en) * 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
US20070023976A1 (en) * 2005-07-26 2007-02-01 Asml Netherlands B.V. Imprint lithography
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
US7878791B2 (en) * 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) * 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
JP4657940B2 (ja) * 2006-02-10 2011-03-23 東京エレクトロン株式会社 基板の処理システム
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US8015939B2 (en) * 2006-06-30 2011-09-13 Asml Netherlands B.V. Imprintable medium dispenser
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
DE102008002579A1 (de) * 2008-06-23 2009-12-24 Robert Bosch Gmbh Mikro-elektromechanisches Sensorelement
KR20150056500A (ko) * 2012-09-18 2015-05-26 에베 그룹 에. 탈너 게엠베하 엠보싱 방법 및 장치
CN103837249B (zh) * 2012-11-20 2016-12-21 深南电路有限公司 热盘温度均匀性的测试方法及测试装置
WO2015030167A1 (ja) * 2013-08-29 2015-03-05 株式会社ブリヂストン サセプタ
CN110798923B (zh) * 2019-10-29 2021-11-23 珠海格力绿色再生资源有限公司 加热面板及无火灶
CN111430836A (zh) * 2020-02-18 2020-07-17 蜂巢能源科技有限公司 自适应温度调节结构单元及其应用

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Also Published As

Publication number Publication date
US20030141291A1 (en) 2003-07-31
CN1419661A (zh) 2003-05-21
CN1215377C (zh) 2005-08-17
EP1275030A1 (en) 2003-01-15
US20050077285A1 (en) 2005-04-14
AU2001234319A1 (en) 2001-09-03
SE515785C2 (sv) 2001-10-08
SE0000574D0 (sv) 2000-02-23
JP2003524304A (ja) 2003-08-12
WO2001063361A1 (en) 2001-08-30

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