RU2607720C2 - Устройство ультразвукового преобразователя и способ его изготовления - Google Patents

Устройство ультразвукового преобразователя и способ его изготовления Download PDF

Info

Publication number
RU2607720C2
RU2607720C2 RU2014129830A RU2014129830A RU2607720C2 RU 2607720 C2 RU2607720 C2 RU 2607720C2 RU 2014129830 A RU2014129830 A RU 2014129830A RU 2014129830 A RU2014129830 A RU 2014129830A RU 2607720 C2 RU2607720 C2 RU 2607720C2
Authority
RU
Russia
Prior art keywords
substrate
cavity
layer
cell
cmut
Prior art date
Application number
RU2014129830A
Other languages
English (en)
Russian (ru)
Other versions
RU2014129830A (ru
Inventor
Роналд ДЕККЕР
Боут МАРСЕЛИС
Марсель МЮЛДЕР
Рюдигер МАУКЗОК
Original Assignee
Конинклейке Филипс Н.В.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Конинклейке Филипс Н.В. filed Critical Конинклейке Филипс Н.В.
Publication of RU2014129830A publication Critical patent/RU2014129830A/ru
Application granted granted Critical
Publication of RU2607720C2 publication Critical patent/RU2607720C2/ru

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
RU2014129830A 2011-12-20 2012-12-13 Устройство ультразвукового преобразователя и способ его изготовления RU2607720C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161577704P 2011-12-20 2011-12-20
US61/577,704 2011-12-20
PCT/IB2012/057273 WO2013093728A1 (en) 2011-12-20 2012-12-13 Ultrasound transducer device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
RU2014129830A RU2014129830A (ru) 2016-02-10
RU2607720C2 true RU2607720C2 (ru) 2017-01-10

Family

ID=47631486

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2014129830A RU2607720C2 (ru) 2011-12-20 2012-12-13 Устройство ультразвукового преобразователя и способ его изготовления

Country Status (8)

Country Link
US (2) US9802224B2 (enExample)
EP (1) EP2750806B1 (enExample)
JP (1) JP6069798B2 (enExample)
CN (1) CN104023860B (enExample)
BR (1) BR112014014911A2 (enExample)
IN (1) IN2014CN04975A (enExample)
RU (1) RU2607720C2 (enExample)
WO (1) WO2013093728A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5409784B2 (ja) * 2009-05-25 2014-02-05 株式会社日立メディコ 超音波トランスデューサおよびそれを用いた超音波診断装置
WO2013061298A2 (en) * 2011-10-28 2013-05-02 Koninklijke Philips Electronics N.V. Pre-collapsed capacitive micro-machined transducer cell with stress layer
US9802224B2 (en) * 2011-12-20 2017-10-31 Koninklijke Philips N.V. Ultrasound transducer device and method of manufacturing the same
US9259206B2 (en) * 2013-02-20 2016-02-16 Georgia Tech Research Corporation CMUT-on-CMOS based guidewire intravascular imaging
US9351081B2 (en) * 2013-02-27 2016-05-24 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
RU2691926C2 (ru) * 2014-12-11 2019-06-18 Конинклейке Филипс Н.В. Катетер-преобразователь с расположенными в шахматном порядке рядами микромашинных ультразвуковых преобразователей
US11766237B2 (en) 2015-07-02 2023-09-26 Philips Image Guided Therapy Corporation Multi-mode capacitive micromachined ultrasound transducer and associated devices, systems, and methods for multiple different intravascular sensing capabilities
WO2017216139A1 (en) 2016-06-13 2017-12-21 Koninklijke Philips N.V. Broadband ultrasound transducer
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
EP3645176A1 (en) 2017-06-30 2020-05-06 Koninklijke Philips N.V. Intraluminal ultrasound imaging device comprising a substrate separated into a plurality of spaced-apart segments, intraluminal ultrasound imaging device comprising a trench, and method of manufacturing
JP7180129B2 (ja) * 2018-06-06 2022-11-30 セイコーエプソン株式会社 超音波装置および電子機器
CN109759306B (zh) * 2019-02-03 2020-11-13 中国科学院微电子研究所 超声换能器阵列结构及其制备方法
DE102019214261B3 (de) * 2019-09-19 2020-08-20 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches System und mikromechanisches System
EP3909692A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
EP3909691A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
DE102022122821A1 (de) 2022-09-08 2024-03-14 Infineon Technologies Ag Sensorvorrichtungen mit akustischem Koppelmedium und zugehörige Herstellungsverfahren

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2117415C1 (ru) * 1994-05-31 1998-08-10 Шанаурин Александр Михайлович Электростатический конденсаторный преобразователь
US7303530B2 (en) * 2003-05-22 2007-12-04 Siemens Medical Solutions Usa, Inc. Transducer arrays with an integrated sensor and methods of use
US20090122651A1 (en) * 2007-10-18 2009-05-14 Mario Kupnik Direct wafer bonded 2-D CUMT array
RU2404711C2 (ru) * 2005-04-25 2010-11-27 Конинклейке Филипс Электроникс Н.В. Способ и устройство для непрерывной визуализации посредством системы ультразвукового преобразователя
US20110018387A1 (en) * 2009-07-24 2011-01-27 Canon Kabushiki Kaisha Electromechanical transducer device and method of making the same
US20110057541A1 (en) * 2009-09-04 2011-03-10 Samsung Electronics Co., Ltd. High power ultrasonic transducer

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4723732B2 (ja) * 2000-07-12 2011-07-13 セイコーインスツル株式会社 脈検出装置及び超音波診断装置
US6669644B2 (en) * 2001-07-31 2003-12-30 Koninklijke Philips Electronics N.V. Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy
US6659954B2 (en) * 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
JP4123192B2 (ja) * 2004-06-03 2008-07-23 セイコーエプソン株式会社 超音波トランスデューサ、および超音波トランスデューサの製造方法
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
ITRM20050093A1 (it) * 2005-03-04 2006-09-05 Consiglio Nazionale Ricerche Procedimento micromeccanico superficiale di fabbricazione di trasduttori ultracustici capacitivi microlavorati e relativo trasduttore ultracustico capacitivo microlavorato.
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
JP4804961B2 (ja) * 2006-03-03 2011-11-02 オリンパスメディカルシステムズ株式会社 超音波振動子及びそれを搭載した体腔内超音波診断装置
US7741686B2 (en) * 2006-07-20 2010-06-22 The Board Of Trustees Of The Leland Stanford Junior University Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
JP4800170B2 (ja) * 2006-10-05 2011-10-26 株式会社日立製作所 超音波トランスデューサおよびその製造方法
JP4885779B2 (ja) * 2007-03-29 2012-02-29 オリンパスメディカルシステムズ株式会社 静電容量型トランスデューサ装置及び体腔内超音波診断システム
US8641628B2 (en) * 2007-09-26 2014-02-04 Siemens Medical Solutions Usa, Inc. Aperture synthesis using cMUTs
RU2511671C2 (ru) * 2008-09-16 2014-04-10 Конинклейке Филипс Электроникс Н.В. Емкостной микрообработанный ультразвуковой преобразователь
US20100173437A1 (en) * 2008-10-21 2010-07-08 Wygant Ira O Method of fabricating CMUTs that generate low-frequency and high-intensity ultrasound
EP2455133A1 (en) * 2010-11-18 2012-05-23 Koninklijke Philips Electronics N.V. Catheter comprising capacitive micromachined ultrasonic transducers with an adjustable focus
JP5961246B2 (ja) * 2011-03-22 2016-08-02 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 基板に対して抑制された音響結合を持つ超音波ｃｍｕｔ
EP2745315A1 (en) * 2011-10-17 2014-06-25 Koninklijke Philips N.V. Through-wafer via device and method of manufacturing the same
RU2595800C2 (ru) * 2011-10-28 2016-08-27 Конинклейке Филипс Н.В. Ячейка емкостного микрообработанного преобразователя предварительно прижатого типа с заглушкой
WO2013061298A2 (en) * 2011-10-28 2013-05-02 Koninklijke Philips Electronics N.V. Pre-collapsed capacitive micro-machined transducer cell with stress layer
US9802224B2 (en) * 2011-12-20 2017-10-31 Koninklijke Philips N.V. Ultrasound transducer device and method of manufacturing the same
JP6209537B2 (ja) * 2012-01-27 2017-10-04 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 容量性マイクロマシン・トランスデューサ及びこれを製造する方法
CN104812504B (zh) * 2012-11-20 2018-01-26 皇家飞利浦有限公司 电容性微加工换能器和制造所述电容性微加工换能器的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2117415C1 (ru) * 1994-05-31 1998-08-10 Шанаурин Александр Михайлович Электростатический конденсаторный преобразователь
US7303530B2 (en) * 2003-05-22 2007-12-04 Siemens Medical Solutions Usa, Inc. Transducer arrays with an integrated sensor and methods of use
RU2404711C2 (ru) * 2005-04-25 2010-11-27 Конинклейке Филипс Электроникс Н.В. Способ и устройство для непрерывной визуализации посредством системы ультразвукового преобразователя
US20090122651A1 (en) * 2007-10-18 2009-05-14 Mario Kupnik Direct wafer bonded 2-D CUMT array
US20110018387A1 (en) * 2009-07-24 2011-01-27 Canon Kabushiki Kaisha Electromechanical transducer device and method of making the same
US20110057541A1 (en) * 2009-09-04 2011-03-10 Samsung Electronics Co., Ltd. High power ultrasonic transducer

Also Published As

Publication number Publication date
CN104023860B (zh) 2016-06-15
IN2014CN04975A (enExample) 2015-09-18
CN104023860A (zh) 2014-09-03
EP2750806B1 (en) 2019-05-08
EP2750806A1 (en) 2014-07-09
US20180029077A1 (en) 2018-02-01
BR112014014911A2 (pt) 2017-06-13
WO2013093728A1 (en) 2013-06-27
JP2015509304A (ja) 2015-03-26
US9802224B2 (en) 2017-10-31
US10835922B2 (en) 2020-11-17
JP6069798B2 (ja) 2017-02-01
US20140307528A1 (en) 2014-10-16
RU2014129830A (ru) 2016-02-10

Similar Documents

Publication Publication Date Title
CN104023860B (zh) 超声换能器设备及制造所述超声换能器设备的方法
US8796901B2 (en) Micro-electro-mechanical transducer having an insulation extension
US8105941B2 (en) Through-wafer interconnection
US8324006B1 (en) Method of forming a capacitive micromachined ultrasonic transducer (CMUT)
US7880565B2 (en) Micro-electro-mechanical transducer having a surface plate
EP2969914B1 (en) Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
EP2411163B1 (en) Wafer bond cmut array with conductive vias
EP2403659B1 (en) Monolithic integrated cmuts fabricated by low-temperature wafer bonding
WO2007015219A2 (en) Micro-electro-mechanical transducer having a surface plate
EP2881182A2 (en) Capacitive micromachined ultrasonic transducer and method of fabricating the same
JP2012085239A (ja) 電気機械変換装置及びその作製方法
JP2011523544A (ja) 静電型変換器アレイのパッケージングおよび接続
RU2603435C2 (ru) Устройство с переходными отверстиями в подложке и способ его производства
WO2013089648A1 (en) Capacitive micromachined ultrasonic transducer arrangement and method of fabricating the same
CN110773408A (zh) 电容式微纳超声换能器及其制备方法
KR20110029809A (ko) 초음파 트랜스듀서 및 그 제조 방법
CN114242890A (zh) 超声换能器单元、超声换能器阵列及其制备方法
CN120790464A (zh) 一种基于tsv的电容式超声换能器的制备方法