RU2607720C2 - Устройство ультразвукового преобразователя и способ его изготовления - Google Patents
Устройство ультразвукового преобразователя и способ его изготовления Download PDFInfo
- Publication number
- RU2607720C2 RU2607720C2 RU2014129830A RU2014129830A RU2607720C2 RU 2607720 C2 RU2607720 C2 RU 2607720C2 RU 2014129830 A RU2014129830 A RU 2014129830A RU 2014129830 A RU2014129830 A RU 2014129830A RU 2607720 C2 RU2607720 C2 RU 2607720C2
- Authority
- RU
- Russia
- Prior art keywords
- substrate
- cavity
- layer
- cmut
- cell
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 238000002604 ultrasonography Methods 0.000 title description 6
- 239000000758 substrate Substances 0.000 claims abstract description 321
- 210000004027 cell Anatomy 0.000 claims abstract description 115
- 239000012528 membrane Substances 0.000 claims abstract description 63
- 210000000170 cell membrane Anatomy 0.000 claims abstract description 42
- 239000010410 layer Substances 0.000 claims description 205
- 238000005530 etching Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 10
- 229910052721 tungsten Inorganic materials 0.000 claims description 10
- 239000010937 tungsten Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 11
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 9
- 238000007667 floating Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000001419 dependent effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007918 intramuscular administration Methods 0.000 description 1
- 238000002608 intravascular ultrasound Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000002560 therapeutic procedure Methods 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161577704P | 2011-12-20 | 2011-12-20 | |
| US61/577,704 | 2011-12-20 | ||
| PCT/IB2012/057273 WO2013093728A1 (en) | 2011-12-20 | 2012-12-13 | Ultrasound transducer device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2014129830A RU2014129830A (ru) | 2016-02-10 |
| RU2607720C2 true RU2607720C2 (ru) | 2017-01-10 |
Family
ID=47631486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2014129830A RU2607720C2 (ru) | 2011-12-20 | 2012-12-13 | Устройство ультразвукового преобразователя и способ его изготовления |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9802224B2 (enExample) |
| EP (1) | EP2750806B1 (enExample) |
| JP (1) | JP6069798B2 (enExample) |
| CN (1) | CN104023860B (enExample) |
| BR (1) | BR112014014911A2 (enExample) |
| IN (1) | IN2014CN04975A (enExample) |
| RU (1) | RU2607720C2 (enExample) |
| WO (1) | WO2013093728A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9085012B2 (en) * | 2009-05-25 | 2015-07-21 | Hitachi Medical Corporation | Ultrasonic transducer and ultrasonic diagnostic apparatus provided with same |
| CN103917304B (zh) * | 2011-10-28 | 2016-08-17 | 皇家飞利浦有限公司 | 具有应力层的预塌陷电容式微加工换能器单元 |
| JP6069798B2 (ja) * | 2011-12-20 | 2017-02-01 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 超音波トランスデューサデバイス及びこれを製造する方法 |
| US9259206B2 (en) * | 2013-02-20 | 2016-02-16 | Georgia Tech Research Corporation | CMUT-on-CMOS based guidewire intravascular imaging |
| US9351081B2 (en) * | 2013-02-27 | 2016-05-24 | Texas Instruments Incorporated | Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug |
| WO2016091985A1 (en) * | 2014-12-11 | 2016-06-16 | Koninklijke Philips N.V. | Catheter transducer with staggered columns of micromachined ultrasonic transducers |
| JP6932085B2 (ja) | 2015-07-02 | 2021-09-08 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | マルチモード容量性マイクロマシン超音波トランスデューサ並びに関連するデバイス、システム及び方法 |
| US11400487B2 (en) | 2016-06-13 | 2022-08-02 | Koninklijke Philips N.V. | Broadband ultrasound transducer |
| US20180180724A1 (en) * | 2016-12-26 | 2018-06-28 | Nxp Usa, Inc. | Ultrasonic transducer integrated with supporting electronics |
| EP3645176A1 (en) | 2017-06-30 | 2020-05-06 | Koninklijke Philips N.V. | Intraluminal ultrasound imaging device comprising a substrate separated into a plurality of spaced-apart segments, intraluminal ultrasound imaging device comprising a trench, and method of manufacturing |
| JP7180129B2 (ja) * | 2018-06-06 | 2022-11-30 | セイコーエプソン株式会社 | 超音波装置および電子機器 |
| CN109759306B (zh) * | 2019-02-03 | 2020-11-13 | 中国科学院微电子研究所 | 超声换能器阵列结构及其制备方法 |
| DE102019214261B3 (de) * | 2019-09-19 | 2020-08-20 | Robert Bosch Gmbh | Herstellungsverfahren für ein mikromechanisches System und mikromechanisches System |
| EP3909691A1 (en) * | 2020-05-14 | 2021-11-17 | Koninklijke Philips N.V. | An ultrasound transducer and a tiled array of ultrasound transducers |
| EP3909692A1 (en) * | 2020-05-14 | 2021-11-17 | Koninklijke Philips N.V. | An ultrasound transducer and a tiled array of ultrasound transducers |
| DE102022122821A1 (de) | 2022-09-08 | 2024-03-14 | Infineon Technologies Ag | Sensorvorrichtungen mit akustischem Koppelmedium und zugehörige Herstellungsverfahren |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2117415C1 (ru) * | 1994-05-31 | 1998-08-10 | Шанаурин Александр Михайлович | Электростатический конденсаторный преобразователь |
| US7303530B2 (en) * | 2003-05-22 | 2007-12-04 | Siemens Medical Solutions Usa, Inc. | Transducer arrays with an integrated sensor and methods of use |
| US20090122651A1 (en) * | 2007-10-18 | 2009-05-14 | Mario Kupnik | Direct wafer bonded 2-D CUMT array |
| RU2404711C2 (ru) * | 2005-04-25 | 2010-11-27 | Конинклейке Филипс Электроникс Н.В. | Способ и устройство для непрерывной визуализации посредством системы ультразвукового преобразователя |
| US20110018387A1 (en) * | 2009-07-24 | 2011-01-27 | Canon Kabushiki Kaisha | Electromechanical transducer device and method of making the same |
| US20110057541A1 (en) * | 2009-09-04 | 2011-03-10 | Samsung Electronics Co., Ltd. | High power ultrasonic transducer |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4723732B2 (ja) * | 2000-07-12 | 2011-07-13 | セイコーインスツル株式会社 | 脈検出装置及び超音波診断装置 |
| US6669644B2 (en) * | 2001-07-31 | 2003-12-30 | Koninklijke Philips Electronics N.V. | Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy |
| US6659954B2 (en) * | 2001-12-19 | 2003-12-09 | Koninklijke Philips Electronics Nv | Micromachined ultrasound transducer and method for fabricating same |
| JP4123192B2 (ja) * | 2004-06-03 | 2008-07-23 | セイコーエプソン株式会社 | 超音波トランスデューサ、および超音波トランスデューサの製造方法 |
| US7037746B1 (en) * | 2004-12-27 | 2006-05-02 | General Electric Company | Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane |
| ITRM20050093A1 (it) * | 2005-03-04 | 2006-09-05 | Consiglio Nazionale Ricerche | Procedimento micromeccanico superficiale di fabbricazione di trasduttori ultracustici capacitivi microlavorati e relativo trasduttore ultracustico capacitivo microlavorato. |
| US7615834B2 (en) * | 2006-02-28 | 2009-11-10 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane |
| JP4804961B2 (ja) * | 2006-03-03 | 2011-11-02 | オリンパスメディカルシステムズ株式会社 | 超音波振動子及びそれを搭載した体腔内超音波診断装置 |
| US7741686B2 (en) * | 2006-07-20 | 2010-06-22 | The Board Of Trustees Of The Leland Stanford Junior University | Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame |
| JP4800170B2 (ja) * | 2006-10-05 | 2011-10-26 | 株式会社日立製作所 | 超音波トランスデューサおよびその製造方法 |
| JP4885779B2 (ja) * | 2007-03-29 | 2012-02-29 | オリンパスメディカルシステムズ株式会社 | 静電容量型トランスデューサ装置及び体腔内超音波診断システム |
| US8641628B2 (en) * | 2007-09-26 | 2014-02-04 | Siemens Medical Solutions Usa, Inc. | Aperture synthesis using cMUTs |
| US9132693B2 (en) * | 2008-09-16 | 2015-09-15 | Koninklijke Philps N.V. | Capacitive micromachine ultrasound transducer |
| US20100173437A1 (en) * | 2008-10-21 | 2010-07-08 | Wygant Ira O | Method of fabricating CMUTs that generate low-frequency and high-intensity ultrasound |
| EP2455133A1 (en) * | 2010-11-18 | 2012-05-23 | Koninklijke Philips Electronics N.V. | Catheter comprising capacitive micromachined ultrasonic transducers with an adjustable focus |
| WO2012127360A2 (en) * | 2011-03-22 | 2012-09-27 | Koninklijke Philips Electronics N.V. | Ultrasonic cmut with suppressed acoustic coupling to the substrate |
| CN103875068B (zh) * | 2011-10-17 | 2018-07-10 | 皇家飞利浦有限公司 | 穿晶片通路设备以及其制造方法 |
| CN103917304B (zh) * | 2011-10-28 | 2016-08-17 | 皇家飞利浦有限公司 | 具有应力层的预塌陷电容式微加工换能器单元 |
| EP2747904B1 (en) * | 2011-10-28 | 2020-04-08 | Koninklijke Philips N.V. | Pre-collapsed capacitive micro-machined transducer cell with plug |
| JP6069798B2 (ja) * | 2011-12-20 | 2017-02-01 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 超音波トランスデューサデバイス及びこれを製造する方法 |
| US9231496B2 (en) * | 2012-01-27 | 2016-01-05 | Koninklijke Philips N.V. | Capacitive micro-machined transducer and method of manufacturing the same |
| CN104812504B (zh) * | 2012-11-20 | 2018-01-26 | 皇家飞利浦有限公司 | 电容性微加工换能器和制造所述电容性微加工换能器的方法 |
-
2012
- 2012-12-13 JP JP2014548280A patent/JP6069798B2/ja active Active
- 2012-12-13 CN CN201280063552.6A patent/CN104023860B/zh active Active
- 2012-12-13 EP EP12821050.7A patent/EP2750806B1/en not_active Not-in-force
- 2012-12-13 IN IN4975CHN2014 patent/IN2014CN04975A/en unknown
- 2012-12-13 WO PCT/IB2012/057273 patent/WO2013093728A1/en not_active Ceased
- 2012-12-13 BR BR112014014911A patent/BR112014014911A2/pt not_active Application Discontinuation
- 2012-12-13 RU RU2014129830A patent/RU2607720C2/ru active
- 2012-12-13 US US14/365,647 patent/US9802224B2/en not_active Expired - Fee Related
-
2017
- 2017-10-11 US US15/729,699 patent/US10835922B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2117415C1 (ru) * | 1994-05-31 | 1998-08-10 | Шанаурин Александр Михайлович | Электростатический конденсаторный преобразователь |
| US7303530B2 (en) * | 2003-05-22 | 2007-12-04 | Siemens Medical Solutions Usa, Inc. | Transducer arrays with an integrated sensor and methods of use |
| RU2404711C2 (ru) * | 2005-04-25 | 2010-11-27 | Конинклейке Филипс Электроникс Н.В. | Способ и устройство для непрерывной визуализации посредством системы ультразвукового преобразователя |
| US20090122651A1 (en) * | 2007-10-18 | 2009-05-14 | Mario Kupnik | Direct wafer bonded 2-D CUMT array |
| US20110018387A1 (en) * | 2009-07-24 | 2011-01-27 | Canon Kabushiki Kaisha | Electromechanical transducer device and method of making the same |
| US20110057541A1 (en) * | 2009-09-04 | 2011-03-10 | Samsung Electronics Co., Ltd. | High power ultrasonic transducer |
Also Published As
| Publication number | Publication date |
|---|---|
| IN2014CN04975A (enExample) | 2015-09-18 |
| JP2015509304A (ja) | 2015-03-26 |
| US20140307528A1 (en) | 2014-10-16 |
| EP2750806A1 (en) | 2014-07-09 |
| US20180029077A1 (en) | 2018-02-01 |
| EP2750806B1 (en) | 2019-05-08 |
| US9802224B2 (en) | 2017-10-31 |
| RU2014129830A (ru) | 2016-02-10 |
| US10835922B2 (en) | 2020-11-17 |
| WO2013093728A1 (en) | 2013-06-27 |
| JP6069798B2 (ja) | 2017-02-01 |
| BR112014014911A2 (pt) | 2017-06-13 |
| CN104023860B (zh) | 2016-06-15 |
| CN104023860A (zh) | 2014-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2607720C2 (ru) | Устройство ультразвукового преобразователя и способ его изготовления | |
| US8796901B2 (en) | Micro-electro-mechanical transducer having an insulation extension | |
| US8105941B2 (en) | Through-wafer interconnection | |
| US8324006B1 (en) | Method of forming a capacitive micromachined ultrasonic transducer (CMUT) | |
| US7880565B2 (en) | Micro-electro-mechanical transducer having a surface plate | |
| EP2969914B1 (en) | Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same | |
| EP2411163B1 (en) | Wafer bond cmut array with conductive vias | |
| EP2403659B1 (en) | Monolithic integrated cmuts fabricated by low-temperature wafer bonding | |
| WO2007015219A2 (en) | Micro-electro-mechanical transducer having a surface plate | |
| EP2881182A2 (en) | Capacitive micromachined ultrasonic transducer and method of fabricating the same | |
| JP2012085239A (ja) | 電気機械変換装置及びその作製方法 | |
| RU2603435C2 (ru) | Устройство с переходными отверстиями в подложке и способ его производства | |
| CN110773408A (zh) | 电容式微纳超声换能器及其制备方法 | |
| WO2013089648A1 (en) | Capacitive micromachined ultrasonic transducer arrangement and method of fabricating the same | |
| KR20110029809A (ko) | 초음파 트랜스듀서 및 그 제조 방법 | |
| CN114242890A (zh) | 超声换能器单元、超声换能器阵列及其制备方法 | |
| CN120790464A (zh) | 一种基于tsv的电容式超声换能器的制备方法 |