JP6069798B2 - 超音波トランスデューサデバイス及びこれを製造する方法 - Google Patents

超音波トランスデューサデバイス及びこれを製造する方法 Download PDF

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Publication number
JP6069798B2
JP6069798B2 JP2014548280A JP2014548280A JP6069798B2 JP 6069798 B2 JP6069798 B2 JP 6069798B2 JP 2014548280 A JP2014548280 A JP 2014548280A JP 2014548280 A JP2014548280 A JP 2014548280A JP 6069798 B2 JP6069798 B2 JP 6069798B2
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substrate
cavity
layer
ultrasonic transducer
transducer device
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JP2015509304A (ja
JP2015509304A5 (enExample
Inventor
ロナルト デッケル
ロナルト デッケル
バウト マルセリス
バウト マルセリス
マルセル ミュルデル
マルセル ミュルデル
ルエディヘル マオクゾク
ルエディヘル マオクゾク
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Koninklijke Philips NV
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Koninklijke Philips NV
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
JP2014548280A 2011-12-20 2012-12-13 超音波トランスデューサデバイス及びこれを製造する方法 Active JP6069798B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161577704P 2011-12-20 2011-12-20
US61/577,704 2011-12-20
PCT/IB2012/057273 WO2013093728A1 (en) 2011-12-20 2012-12-13 Ultrasound transducer device and method of manufacturing the same

Publications (3)

Publication Number Publication Date
JP2015509304A JP2015509304A (ja) 2015-03-26
JP2015509304A5 JP2015509304A5 (enExample) 2016-01-28
JP6069798B2 true JP6069798B2 (ja) 2017-02-01

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JP2014548280A Active JP6069798B2 (ja) 2011-12-20 2012-12-13 超音波トランスデューサデバイス及びこれを製造する方法

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Country Link
US (2) US9802224B2 (enExample)
EP (1) EP2750806B1 (enExample)
JP (1) JP6069798B2 (enExample)
CN (1) CN104023860B (enExample)
BR (1) BR112014014911A2 (enExample)
IN (1) IN2014CN04975A (enExample)
RU (1) RU2607720C2 (enExample)
WO (1) WO2013093728A1 (enExample)

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US9085012B2 (en) * 2009-05-25 2015-07-21 Hitachi Medical Corporation Ultrasonic transducer and ultrasonic diagnostic apparatus provided with same
CN103917304B (zh) * 2011-10-28 2016-08-17 皇家飞利浦有限公司 具有应力层的预塌陷电容式微加工换能器单元
JP6069798B2 (ja) * 2011-12-20 2017-02-01 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスデューサデバイス及びこれを製造する方法
US9259206B2 (en) * 2013-02-20 2016-02-16 Georgia Tech Research Corporation CMUT-on-CMOS based guidewire intravascular imaging
US9351081B2 (en) * 2013-02-27 2016-05-24 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
WO2016091985A1 (en) * 2014-12-11 2016-06-16 Koninklijke Philips N.V. Catheter transducer with staggered columns of micromachined ultrasonic transducers
JP6932085B2 (ja) 2015-07-02 2021-09-08 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． マルチモード容量性マイクロマシン超音波トランスデューサ並びに関連するデバイス、システム及び方法
US11400487B2 (en) 2016-06-13 2022-08-02 Koninklijke Philips N.V. Broadband ultrasound transducer
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
EP3645176A1 (en) 2017-06-30 2020-05-06 Koninklijke Philips N.V. Intraluminal ultrasound imaging device comprising a substrate separated into a plurality of spaced-apart segments, intraluminal ultrasound imaging device comprising a trench, and method of manufacturing
JP7180129B2 (ja) * 2018-06-06 2022-11-30 セイコーエプソン株式会社 超音波装置および電子機器
CN109759306B (zh) * 2019-02-03 2020-11-13 中国科学院微电子研究所 超声换能器阵列结构及其制备方法
DE102019214261B3 (de) * 2019-09-19 2020-08-20 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches System und mikromechanisches System
EP3909691A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
EP3909692A1 (en) * 2020-05-14 2021-11-17 Koninklijke Philips N.V. An ultrasound transducer and a tiled array of ultrasound transducers
DE102022122821A1 (de) 2022-09-08 2024-03-14 Infineon Technologies Ag Sensorvorrichtungen mit akustischem Koppelmedium und zugehörige Herstellungsverfahren

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RU2117415C1 (ru) * 1994-05-31 1998-08-10 Шанаурин Александр Михайлович Электростатический конденсаторный преобразователь
JP4723732B2 (ja) * 2000-07-12 2011-07-13 セイコーインスツル株式会社 脈検出装置及び超音波診断装置
US6669644B2 (en) * 2001-07-31 2003-12-30 Koninklijke Philips Electronics N.V. Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy
US6659954B2 (en) * 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
US7303530B2 (en) * 2003-05-22 2007-12-04 Siemens Medical Solutions Usa, Inc. Transducer arrays with an integrated sensor and methods of use
JP4123192B2 (ja) * 2004-06-03 2008-07-23 セイコーエプソン株式会社 超音波トランスデューサ、および超音波トランスデューサの製造方法
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
ITRM20050093A1 (it) * 2005-03-04 2006-09-05 Consiglio Nazionale Ricerche Procedimento micromeccanico superficiale di fabbricazione di trasduttori ultracustici capacitivi microlavorati e relativo trasduttore ultracustico capacitivo microlavorato.
RU2404711C2 (ru) * 2005-04-25 2010-11-27 Конинклейке Филипс Электроникс Н.В. Способ и устройство для непрерывной визуализации посредством системы ультразвукового преобразователя
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
JP4804961B2 (ja) * 2006-03-03 2011-11-02 オリンパスメディカルシステムズ株式会社 超音波振動子及びそれを搭載した体腔内超音波診断装置
US7741686B2 (en) * 2006-07-20 2010-06-22 The Board Of Trustees Of The Leland Stanford Junior University Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
JP4800170B2 (ja) * 2006-10-05 2011-10-26 株式会社日立製作所 超音波トランスデューサおよびその製造方法
JP4885779B2 (ja) * 2007-03-29 2012-02-29 オリンパスメディカルシステムズ株式会社 静電容量型トランスデューサ装置及び体腔内超音波診断システム
US8641628B2 (en) * 2007-09-26 2014-02-04 Siemens Medical Solutions Usa, Inc. Aperture synthesis using cMUTs
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US9132693B2 (en) * 2008-09-16 2015-09-15 Koninklijke Philps N.V. Capacitive micromachine ultrasound transducer
US20100173437A1 (en) * 2008-10-21 2010-07-08 Wygant Ira O Method of fabricating CMUTs that generate low-frequency and high-intensity ultrasound
JP5495918B2 (ja) * 2009-07-24 2014-05-21 キヤノン株式会社 電気機械変換装置、及び電気機械変換装置の作製方法
KR101593994B1 (ko) * 2009-09-04 2016-02-16 삼성전자주식회사 고출력 초음파 트랜스듀서
EP2455133A1 (en) * 2010-11-18 2012-05-23 Koninklijke Philips Electronics N.V. Catheter comprising capacitive micromachined ultrasonic transducers with an adjustable focus
WO2012127360A2 (en) * 2011-03-22 2012-09-27 Koninklijke Philips Electronics N.V. Ultrasonic cmut with suppressed acoustic coupling to the substrate
CN103875068B (zh) * 2011-10-17 2018-07-10 皇家飞利浦有限公司 穿晶片通路设备以及其制造方法
CN103917304B (zh) * 2011-10-28 2016-08-17 皇家飞利浦有限公司 具有应力层的预塌陷电容式微加工换能器单元
EP2747904B1 (en) * 2011-10-28 2020-04-08 Koninklijke Philips N.V. Pre-collapsed capacitive micro-machined transducer cell with plug
JP6069798B2 (ja) * 2011-12-20 2017-02-01 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスデューサデバイス及びこれを製造する方法
US9231496B2 (en) * 2012-01-27 2016-01-05 Koninklijke Philips N.V. Capacitive micro-machined transducer and method of manufacturing the same
CN104812504B (zh) * 2012-11-20 2018-01-26 皇家飞利浦有限公司 电容性微加工换能器和制造所述电容性微加工换能器的方法

Also Published As

Publication number Publication date
IN2014CN04975A (enExample) 2015-09-18
JP2015509304A (ja) 2015-03-26
US20140307528A1 (en) 2014-10-16
EP2750806A1 (en) 2014-07-09
US20180029077A1 (en) 2018-02-01
EP2750806B1 (en) 2019-05-08
RU2607720C2 (ru) 2017-01-10
US9802224B2 (en) 2017-10-31
RU2014129830A (ru) 2016-02-10
US10835922B2 (en) 2020-11-17
WO2013093728A1 (en) 2013-06-27
BR112014014911A2 (pt) 2017-06-13
CN104023860B (zh) 2016-06-15
CN104023860A (zh) 2014-09-03

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