RU2020118093A - Способ изготовления метки радиочастотной идентификации и метка радиочастотной идентификации, содержащая интегральную схему и антенну - Google Patents

Способ изготовления метки радиочастотной идентификации и метка радиочастотной идентификации, содержащая интегральную схему и антенну Download PDF

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RU2020118093A
RU2020118093A RU2020118093A RU2020118093A RU2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A
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antenna
hot melt
radio frequency
frequency identification
identification tags
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RU2020118093A
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RU2020118093A3 (ru
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Лаури Хухтасало
Ээрик ХАЛОНЕН
Юха ИКОНЕН
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Стора Энсо Ойй
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Publication of RU2020118093A publication Critical patent/RU2020118093A/ru
Publication of RU2020118093A3 publication Critical patent/RU2020118093A3/ru

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    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • GPHYSICS
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    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
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    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Claims (14)

1. Способ изготовления метки радиочастотной идентификации (RFID-метки), содержащей интегральную схему (ИС) и антенну, отличающийся тем, что содержит этапы, на которых:
обеспечивают антенну, выполненную из паяльного материала, которая по меньшей мере частично покрыта термоклеем в твердом виде,
нагревают антенну до температуры выше её точки плавления, при этом нагретые части антенны и термоклей плавятся,
размещают ИС в заранее заданном положении, которое подходит для соединения ИС с антенной,
спрессовывают ИС и антенну, в результате чего устанавливается электрическое соединение между ИС и антенной, и
охлаждают RFID-метку, в результате чего термоклей и антенна затвердевают, при этом обеспечивается паяное соединение между ИС и антенной, и термоклей окружает паяное соединение между ИС и антенной.
2. Способ по п. 1, отличающийся тем, что этап нагрева выполняют перед этапом размещения ИС.
3. Способ по п. 1, отличающийся тем, что этап размещения ИС выполняют перед этапом нагрева.
4. Способ по п. 1, отличающийся тем, что этап размещения ИС выполняют одновременно с этапом нагрева.
5. Способ по пп. 1, 3 или 4, отличающийся тем, что вместо антенны термоклеем в твердом виде покрывают сторону ИС, которая обращена к антенне.
6. Способ по любому из пп. 1-5, отличающийся тем, что этап обеспечения антенны дополнительно содержит то, что антенна выполнена из олова-висмута.
7. Способ по любому из пп. 1-6, отличающийся тем, что термоклеем является термоклей на основе PO (полиолефина) или EVA (этиленвинилацетата).
8. Метка радиочастотной идентификации, содержащая ИС и антенну, отличающаяся тем, что антенна выполнена из паяльного материала, и тем, что ИС впаяна в антенну, и ИС и антенна соединены паяным соединением, которое окружено термоклеем в твердом виде.
9. Метка радиочастотной идентификации, полученная способом изготовления по любому из пп. 1-7.
RU2020118093A 2017-11-03 2018-10-31 Способ изготовления метки радиочастотной идентификации и метка радиочастотной идентификации, содержащая интегральную схему и антенну RU2020118093A (ru)

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SE1751364A SE541653C2 (en) 2017-11-03 2017-11-03 Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna
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PCT/IB2018/058522 WO2019087086A1 (en) 2017-11-03 2018-10-31 Method for manufacturing an rfid tag and an rfid tag comprising an ic and an antenna

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Publication number Priority date Publication date Assignee Title
SE542007C2 (en) * 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
KR100934429B1 (ko) * 2005-05-24 2009-12-29 후지쯔 가부시끼가이샤 Ic 태그의 실장 구조 및 실장용 ic 칩
TWI339358B (en) * 2005-07-04 2011-03-21 Hitachi Ltd Rfid tag and manufacturing method thereof
US20070163704A1 (en) * 2006-01-18 2007-07-19 Upm Rafsec Oy Method for manufacturing a label comprising a transponder
JP2007206800A (ja) * 2006-01-31 2007-08-16 Fujitsu Ltd Rfidタグシリーズの巻取方法およびrfidタグロール
US20070279230A1 (en) * 2006-06-01 2007-12-06 Wavezero, Inc. System and Method for Attaching Radiofrequency Identification Chips to Metalized Antenna
FI20060673A0 (fi) 2006-07-11 2006-07-11 Keskuslaboratorio Painomenetelmä ja -laitteet ja painettu tuote
JP4674710B2 (ja) * 2007-05-14 2011-04-20 立山科学工業株式会社 無線icタグの製造方法
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
CN201226155Y (zh) * 2008-04-22 2009-04-22 合隆科技(杭州)有限公司 一种双界面ic卡
US20120040128A1 (en) * 2010-08-12 2012-02-16 Feinics Amatech Nominee Limited Transferring antenna structures to rfid components
KR101941679B1 (ko) * 2010-10-14 2019-01-24 스토라 엔소 오와이제이 인쇄된 도전성 표면에 칩을 부착하기 위한 방법 및 구조
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
EP2795061A4 (en) * 2011-12-21 2015-12-16 Services Petroliers Schlumberger ISOLATION STRUCTURE FOR DRILLING MEASURING INSTRUMENT ANTENNAS
JP5939831B2 (ja) * 2012-02-21 2016-06-22 サトーホールディングス株式会社 Rfidタグ
CN202502521U (zh) * 2012-03-29 2012-10-24 上海优比科包装材料有限公司 一种易碎的rfid智能标签
CN103679243B (zh) * 2012-09-20 2016-12-21 一芯智能科技股份有限公司 智能双界面卡芯片触点点锡、粘热熔胶自动化设备
JP5956297B2 (ja) * 2012-09-24 2016-07-27 富士通フロンテック株式会社 Icチップの接合方法
US8988827B1 (en) * 2014-01-17 2015-03-24 HGST Netherlands B.V. Surface diffusion inhibitor for HAMR NFT
EP3159831B1 (en) * 2015-10-21 2018-10-03 Nxp B.V. Dual-interface ic card
CN105787553B (zh) * 2016-03-16 2020-05-05 湖北华威科智能技术有限公司 一种使用烫金方式置入包装基材的rfid标签的制备方法
CN105846056B (zh) * 2016-03-28 2019-04-02 歌尔股份有限公司 一种天线组件的制作方法和一种天线组件
CN106064754A (zh) * 2016-08-15 2016-11-02 武汉华威科智能技术有限公司 用于rfid标签热压固化的多道隔热带同步卷绕进给装置

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