RU2020118093A - Способ изготовления метки радиочастотной идентификации и метка радиочастотной идентификации, содержащая интегральную схему и антенну - Google Patents

Способ изготовления метки радиочастотной идентификации и метка радиочастотной идентификации, содержащая интегральную схему и антенну Download PDF

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RU2020118093A
RU2020118093A RU2020118093A RU2020118093A RU2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A RU 2020118093 A RU2020118093 A RU 2020118093A
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antenna
hot melt
radio frequency
frequency identification
identification tags
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RU2020118093A
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RU2020118093A3 (ru
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Лаури Хухтасало
Ээрик ХАЛОНЕН
Юха ИКОНЕН
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Стора Энсо Ойй
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Publication of RU2020118093A publication Critical patent/RU2020118093A/ru
Publication of RU2020118093A3 publication Critical patent/RU2020118093A3/ru

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
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    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07775Antenna details the antenna being on-chip
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • B32B2037/1215Hot-melt adhesive
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    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Claims (14)

1. Способ изготовления метки радиочастотной идентификации (RFID-метки), содержащей интегральную схему (ИС) и антенну, отличающийся тем, что содержит этапы, на которых:
обеспечивают антенну, выполненную из паяльного материала, которая по меньшей мере частично покрыта термоклеем в твердом виде,
нагревают антенну до температуры выше её точки плавления, при этом нагретые части антенны и термоклей плавятся,
размещают ИС в заранее заданном положении, которое подходит для соединения ИС с антенной,
спрессовывают ИС и антенну, в результате чего устанавливается электрическое соединение между ИС и антенной, и
охлаждают RFID-метку, в результате чего термоклей и антенна затвердевают, при этом обеспечивается паяное соединение между ИС и антенной, и термоклей окружает паяное соединение между ИС и антенной.
2. Способ по п. 1, отличающийся тем, что этап нагрева выполняют перед этапом размещения ИС.
3. Способ по п. 1, отличающийся тем, что этап размещения ИС выполняют перед этапом нагрева.
4. Способ по п. 1, отличающийся тем, что этап размещения ИС выполняют одновременно с этапом нагрева.
5. Способ по пп. 1, 3 или 4, отличающийся тем, что вместо антенны термоклеем в твердом виде покрывают сторону ИС, которая обращена к антенне.
6. Способ по любому из пп. 1-5, отличающийся тем, что этап обеспечения антенны дополнительно содержит то, что антенна выполнена из олова-висмута.
7. Способ по любому из пп. 1-6, отличающийся тем, что термоклеем является термоклей на основе PO (полиолефина) или EVA (этиленвинилацетата).
8. Метка радиочастотной идентификации, содержащая ИС и антенну, отличающаяся тем, что антенна выполнена из паяльного материала, и тем, что ИС впаяна в антенну, и ИС и антенна соединены паяным соединением, которое окружено термоклеем в твердом виде.
9. Метка радиочастотной идентификации, полученная способом изготовления по любому из пп. 1-7.
RU2020118093A 2017-11-03 2018-10-31 Способ изготовления метки радиочастотной идентификации и метка радиочастотной идентификации, содержащая интегральную схему и антенну RU2020118093A (ru)

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PCT/IB2018/058522 WO2019087086A1 (en) 2017-11-03 2018-10-31 Method for manufacturing an rfid tag and an rfid tag comprising an ic and an antenna

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