CN111602142A - 用于制造rfid标签的方法和包括ic和天线的rfid标签 - Google Patents

用于制造rfid标签的方法和包括ic和天线的rfid标签 Download PDF

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Publication number
CN111602142A
CN111602142A CN201880070875.5A CN201880070875A CN111602142A CN 111602142 A CN111602142 A CN 111602142A CN 201880070875 A CN201880070875 A CN 201880070875A CN 111602142 A CN111602142 A CN 111602142A
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CN
China
Prior art keywords
antenna
melt adhesive
rfid tag
hot melt
hma
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Pending
Application number
CN201880070875.5A
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English (en)
Inventor
L.胡塔萨洛
E.哈洛宁
J.伊科宁
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Finnish Digital Label Co
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Stora Enso Oyj
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Publication of CN111602142A publication Critical patent/CN111602142A/zh
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
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    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems

Abstract

用于制造包括IC和天线的RFID标签的方法。该方法包括以下步骤：提供由焊接材料制成的天线，该天线至少部分地用固体形式的热熔胶粘剂覆盖；将天线加热到高于其熔点的温度，其中天线被加热的部分和热熔胶粘剂熔化，将IC放置在预定位置，该位置适合于IC连接至天线；将IC和天线压在一起，使得建立IC和天线之间的电连接；以及冷却RFID标签，使得热熔胶粘剂和天线固体化，其中实现了IC和天线之间的焊接接头，并且热熔胶粘剂围绕IC和天线之间的接头。

Description

用于制造RFID标签的方法和包括IC和天线的RFID标签
技术领域
本发明涉及一种用于制造包括IC和天线的RFID标签的方法。其还涉及包括IC和天线的RFID标签。
在下文中会经常使用表述“热熔胶粘剂”(HMA)(或“热熔胶”)。在本上下文中，该表述意指具有特定熔点的热塑性材料。
此外，会使用表述RFID(射频识别)标签。RFID标签是用于附接到要在射频识别系统中识别的对象上的标签。RFID标签包括RFID芯片，其是IC(集成电路)。
此外，会使用表述IC(集成电路)。在本上下文中，其与作为RFID标签的一部分的RFID芯片相同。在RFID标签中，IC电连接至天线。
背景技术
RFID标签包括集成电路(IC)和天线。IC电连接至天线。利用当今的技术，用各向同性导电胶粘剂(ICA)或各向异性导电胶粘剂(ACA)将IC连接至天线。以这种方式生产的RFID标签需要使用昂贵的导电胶粘剂和包括压力、温度和时间在内的固化过程。固化过程对每个标签需要单独的压力元件。这些胶粘剂对运输敏感，并且通常需要冷链。其在天线上的分布是一个需要进行精确控制的过程，并且需要时间来固化，通常为6-10秒，并且用加热的元件进行固化。所使用的这些类型的胶粘剂通常还具有有限的使用寿命。而且，许多这些类型的胶粘剂还含有环境不友好或不许可食品接触的化学品(例如，含有双酚A的环氧物质)。
发明目的
本发明的一个目的是提供一种制造RFID标签的方法和RFID标签，其中IC以新的方式连接至天线。本发明的方法和RFID标签解决了上述问题。
发明内容
根据本发明，用于制造RFID标签的方法的特征在于，其包括以下步骤：
-提供由焊接材料制成的天线，该天线至少部分地用固体形式的热熔胶粘剂覆盖，
-将天线加热到高于其熔点的温度，其中天线被加热的部分和热熔胶粘剂熔化，
-将IC放置在预定位置，该位置适合于IC连接至天线，
-将IC和天线压在一起，使得建立IC和天线之间的电连接，以及
-冷却RFID标签，使得热熔胶粘剂和天线固体化(solidify，凝固)，其中实现了IC和天线之间的焊接接头(joint，接合处)，并且热熔胶粘剂围绕IC和天线之间的接头。
根据本发明，RFID标签的特征在于：
-天线由焊接材料制成，并且IC被焊接到天线中；以及
-IC和天线通过焊接接头连接，该焊接接头被固体形式的热熔胶粘剂围绕。
具体实施方式
在下文中，将更详细地描述本发明，其中以新的创造性方式将IC(RFID芯片)连接至RFID标签的天线。
根据本发明，凭借焊接和热熔胶粘剂(HMA)将IC附接到天线。焊接提供了电和一定的机械连接，而HMA提供了额外的机械连接和强度。因此，热熔胶粘剂不需要是导电的。
根据本发明的天线由焊接材料(即金属合金)制成，并且优选的天线材料是锡-铋，Sn63Bi37。在WO2008/006941中更详细地描述了这些天线的制造过程。将天线用固体形式的热熔胶粘剂(HMA)覆盖。通过首先加热HMA(其中HMA熔化)将HMA施加到天线上。随后，通过涂覆、挤压(挤出)、印刷、喷涂或任何其他会将HMA的层沉积到天线上的方法来施加HMA。在一个实施方案中，在IC附接步骤之前将HMA施加到天线上(参见下文)。在替代实施方案中，已经在天线制造过程中将HMA施加到天线上。天线上的HMA层的厚度取决于IC(即RFID芯片)的厚度。如果IC的厚度在75-120微米范围内，并且将IC向下压到HMA时。HMA至少应填充芯片和天线之间的间隙，而其至多不应爬到芯片的顶部上。所建议的平均厚度为约5-50微米。合适的热熔胶粘剂的实例是PO(基于聚烯烃的热熔胶粘剂)和EVA(乙烯-乙酸乙烯酯热熔胶粘剂)。但是，本领域技术人员意识到可使用其他类似的HMA。
将其上施加有HMA的天线传送到加热步骤，其中天线材料变软并部分熔化，而HMA熔化变得发粘且变为液体。优选的天线金属合金从138℃开始熔化，并且在183℃下完全为液体。对于该天线的优选的温度范围会为约140-170℃。但是，最佳温度还必须考虑HMA熔化温度，其也可根据热塑性材料的选择而有所不同。加热可以多种方式进行，例如烘箱、IR加热、激光、加热板等，使得(其)在旨在放置IC的位置处达到期望温度(天线和HMA均熔化)。
RFID芯片(即IC)具有凸起、连接垫或类似物，其旨在在预定位置处被放置到天线上。
然后将IC压到软的天线上，使得IC(凸起、垫或类似物)挤压通过熔化的HMA并进入到软的天线中。IC和天线之间的电连接在此处建立。液体形式的熔化的HMA会围绕IC和天线之间的接头。
在IC附接步骤之后，环境空气会使RFID标签冷却，使得HMA和焊料材料固体化。固体化的HMA将向IC和天线之间的焊接接头提供额外的机械强度。强制冷却是不必要的。
与常规RFID标签制造相比，本发明具有一些优点：
-每个标签的固化时间更短。
-胶粘剂施加方法和设备更便宜。HMA可以高速度涂覆或印刷，而ICP或ACP则用复杂、昂贵和缓慢的设备进行分配或喷射。
-能够使用低成本材料。
-降低RFID标签成本。
-更少的过程步骤。
-热熔胶粘剂比基于溶剂的胶粘剂具有若干优点。挥发性有机化合物得以减少或消除，并且消除了干燥或固化步骤。热熔胶粘剂具有长的保质期，并且通常可在没有特殊预防措施的情况下处置。HMA在固体化期间不会损失厚度；基于溶剂的胶粘剂在干燥期间可损失层厚度的最高达50-70％。
此外，HMA更环境友好，并且可被接受用于间接或(of)直接食品接触。
在上文中，已经基于一些特定实施方案描述了本发明。然而，技术人员会认识到，在所附权利要求的范围内，其他实施方案和变型是可能的。例如，天线可由具有其他熔点的不同金属合金组成，因此基于这一事实，理想的加热温度是期望的。
此外，并非天线的所有部分都需要用固相的HMA覆盖。如果与IC接触的部分天线施加有HMA，就是足够的。
此外，加热过程可在将IC放置在其在天线上的位置之前、之后或同时进行。
在替代实施方案中，将HMA施加到IC的底部上，即IC面向天线的一侧。在该实施方案中，加热过程在将IC放置在其在天线上的位置之前或之后进行。

Claims (9)

1.用于制造包括IC和天线的RFID标签的方法，其特征在于，该方法包括以下步骤：
-提供由焊接材料制成的天线，该天线至少部分地用固体形式的热熔胶粘剂覆盖，
-将天线加热到高于其熔点的温度，其中天线被加热的部分和热熔胶粘剂熔化，
-将IC放置在预定位置，该位置适合于IC连接至天线，
-将IC和天线压在一起，使得建立IC和天线之间的电连接，以及
-冷却RFID标签，使得热熔胶粘剂和天线固体化，其中实现了IC和天线之间的焊接接头，并且热熔胶粘剂围绕IC和天线之间的接头。
2.根据权利要求1所述的方法，其特征在于，
加热的步骤在放置IC的步骤之前进行。
3.根据权利要求1所述的方法，其特征在于，
放置IC的步骤在加热的步骤之前进行。
4.根据权利要求1所述的方法，其特征在于，
放置IC的步骤与加热的步骤同时进行。
5.根据权利要求1、3或4所述的方法，其特征在于，IC的面对天线的一侧用固体形式的热熔胶粘剂覆盖，而不是天线的一侧。
6.根据权利要求1-5中任意项所述的方法，其特征在于，提供天线的步骤还包括天线由锡-铋制成。
7.根据权利要求1-6中任意项所述的方法，其特征在于，热熔胶粘剂是PO或EVA热熔胶粘剂。
8.包括IC和天线的RFID标签，其特征在于：
-天线由焊接材料制成，并且IC被焊接到天线中，以及
-IC和天线通过焊接接头连接，该焊接接头被固体形式的热熔胶粘剂围绕。
9.通过根据权利要求1至7中任意项所述的制造方法获得的RFID标签。
CN201880070875.5A 2017-11-03 2018-10-31 用于制造rfid标签的方法和包括ic和天线的rfid标签 Pending CN111602142A (zh)

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