RU2014139707A - Устройство электронной схемы и способ его изготовления - Google Patents
Устройство электронной схемы и способ его изготовления Download PDFInfo
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- RU2014139707A RU2014139707A RU2014139707A RU2014139707A RU2014139707A RU 2014139707 A RU2014139707 A RU 2014139707A RU 2014139707 A RU2014139707 A RU 2014139707A RU 2014139707 A RU2014139707 A RU 2014139707A RU 2014139707 A RU2014139707 A RU 2014139707A
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- Prior art keywords
- diameter
- electronic circuit
- electric wire
- hole
- conductive core
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- 238000004519 manufacturing process Methods 0.000 title claims 2
- 238000000034 method Methods 0.000 title claims 2
- 239000000758 substrate Substances 0.000 claims abstract 11
- 238000009413 insulation Methods 0.000 claims abstract 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract 2
- 239000010703 silicon Substances 0.000 claims abstract 2
- 230000003287 optical effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
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- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
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- A61B1/0008—Insertion part of the endoscope body characterised by distal tip features
- A61B1/00097—Sensors
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- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
- A61B1/051—Details of CCD assembly
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- A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
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- A61N1/18—Applying electric currents by contact electrodes
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Abstract
1. Устройство (10) электронной схемы, содержащее:- подложку (12), содержащую проводящий или полупроводящий основной участок (26) и имеющую первую поверхность (12a) и вторую поверхность (12b),- электронную схему(14),- часть (16) электрического соединения для обеспечения электрического соединения с электронной схемой (12), и расположенную на первой поверхности (12a), и- по меньшей мере один электрический провод (18), причем электрический провод (18) содержит одиночную проводящую жилу (20) и изоляцию (22), окружающую проводящую жилу (20), в котором концевой участок (18a) электрического провода (18) является свободным от изоляции участком для предоставления доступа к проводящей жиле (20), и концевой участок (18a) электрического провода (18) соединен с частью (16) электрического соединения,причем в подложке (12) обеспечено по меньшей мере одно сквозное отверстие (24), проходящее от первой поверхности (12a) ко второй поверхности (12b), причем сквозное отверстие (24) содержит первый участок (24а), обращенный к первой поверхности (12а) и имеющий первый диаметр (D1), и второй участок ((24b), обращенный ко второй поверхности (12b) и имеющий второй диаметр (D2), больший первого диаметра (D1), причем первый диаметр (D1) равен или больше диаметра (D20) проводящей жилы (20) и меньше диаметра (D22) изоляции (22), и причем электрический провод (18) пропущен через сквозное отверстие (24),причем подложка (12) содержит слой (28) изоляции, покрывающий по меньшей мере боковые стенки первого участка (24а) сквозного отверстия (24).2. Устройство электронной схемы по п. 1, в котором в подложке (12) обеспечено множество сквозных отверстий (24), причем электрический провод или проводящая жила пропущены через каждое сквозное отверстие (24).3. Устройство электронной схемы по п. 1, в котором основной участок (26) выполнен из кремния.4. Устройств
Claims (11)
1. Устройство (10) электронной схемы, содержащее:
- подложку (12), содержащую проводящий или полупроводящий основной участок (26) и имеющую первую поверхность (12a) и вторую поверхность (12b),
- электронную схему(14),
- часть (16) электрического соединения для обеспечения электрического соединения с электронной схемой (12), и расположенную на первой поверхности (12a), и
- по меньшей мере один электрический провод (18), причем электрический провод (18) содержит одиночную проводящую жилу (20) и изоляцию (22), окружающую проводящую жилу (20), в котором концевой участок (18a) электрического провода (18) является свободным от изоляции участком для предоставления доступа к проводящей жиле (20), и концевой участок (18a) электрического провода (18) соединен с частью (16) электрического соединения,
причем в подложке (12) обеспечено по меньшей мере одно сквозное отверстие (24), проходящее от первой поверхности (12a) ко второй поверхности (12b), причем сквозное отверстие (24) содержит первый участок (24а), обращенный к первой поверхности (12а) и имеющий первый диаметр (D1), и второй участок ((24b), обращенный ко второй поверхности (12b) и имеющий второй диаметр (D2), больший первого диаметра (D1), причем первый диаметр (D1) равен или больше диаметра (D20) проводящей жилы (20) и меньше диаметра (D22) изоляции (22), и причем электрический провод (18) пропущен через сквозное отверстие (24),
причем подложка (12) содержит слой (28) изоляции, покрывающий по меньшей мере боковые стенки первого участка (24а) сквозного отверстия (24).
2. Устройство электронной схемы по п. 1, в котором в подложке (12) обеспечено множество сквозных отверстий (24), причем электрический провод или проводящая жила пропущены через каждое сквозное отверстие (24).
3. Устройство электронной схемы по п. 1, в котором основной участок (26) выполнен из кремния.
4. Устройство электронной схемы по п. 1, в котором концевой участок (18a) электрического провода (18) соединен с частью (16) электрического соединения (30), использующей термокомпрессионную сварку (30) клином, или соединение (32) пайкой.
5. Устройство электронной схемы по п. 1, в котором слой (28) изоляции покрывает первую поверхность (12a) и содержит толстый участок (29), окружающий сквозное отверстие (24), причем толстый участок (29) имеет толщину (T29), по меньшей мере равную длине (L24a) первого участка (24a) сквозного отверстия (24).
6. Устройство электронной схемы по п. 1, в котором часть (16) электрического соединения содержит по меньшей мере одну консольную пружину (16'), контактирующую с концевым участком (18a) электрического провода (18).
7. Устройство электронной схемы по п. 1, в котором подложка (12) содержит по меньшей мере один участок (34) консольной пружины, удерживающий электрический провод (18) на месте.
8. Устройство с датчиком и/или рабочим органом, содержащее устройство (10) электрической схемы по п. 1 и по меньшей мере один датчик и/или рабочий орган (40), в котором электрическая схема (14) выполнена с возможностью передачи электрических сигналов по меньшей мере к одному рабочему органу и/или приема электрических сигналов по меньшей мере от одного датчика (40).
9. Устройство с датчиком и/или рабочим органом по п. 8, в котором по меньшей мере один датчик и/или рабочий орган (40) является по меньшей мере одним устройством, выбранным из группы, содержащей оптическую камеру, ультразвуковой преобразователь и датчик температуры, давления и/или расхода.
10. Медицинский инструмент (100), в частности, минимально инвазивный медицинский инструмент, имеющий проксимальный конец (100a) и дистальный конец (100b) и содержащий устройство с датчиком и/или рабочим органом по п. 8, в котором устройство с датчиком и/или рабочим органом расположено на дистальном конце (100b) медицинского устройства (100).
11. Способ изготовления устройства (10) электронной схемы, содержащей электрическую схему (14), причем упомянутый способ содержит этапы, на которых:
- обеспечивают подложку (12), содержащую проводящий или полупроводящий основной участок (26) и имеющую первую поверхность (12a) и вторую поверхность (12b),
- обеспечивают часть (16) электрического соединения для обеспечения электрического соединения с электронной схемой (12) и расположенную на первой поверхности (12a),
- обеспечивают в подложке (12) по меньшей мере одно сквозное отверстие (24), проходящее от первой поверхности (12a) ко второй поверхности (12b), в котором сквозное отверстие (24) содержит первый участок (24а), обращенный к первой поверхности (12а) и имеющий первый диаметр (D1), и второй участок ((24b), обращенный ко второй поверхности (12b) и имеющий второй диаметр (D2), больший первого диаметра (D1),
- покрывают по меньшей мере боковые стенки первого участка (24а) сквозного отверстия (24) слоем (28) изоляции.
- пропускают по меньшей мере один электрический провод (18) через сквозное отверстие (24), причем электрический провод (18) содержит одиночную проводящую жилу (20) и изоляцию (22), окружающую проводящую жилу (20), и концевой участок (18a) электрического провода (18) является свободным от изоляции участком для предоставления доступа к проводящей жиле (20), и в котором первый диаметр (D1) первого участка (24а) сквозного отверстия (24) равен или больше диаметра (D20) проводящей жилы (20) и меньше диаметра (D22) изоляции (22), и
- присоединяют концевой участок (18a) электрического провода (18) к части (16) электрического соединения.
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PCT/IB2013/051370 WO2013128341A2 (en) | 2012-03-01 | 2013-02-20 | An electronic circuit arrangement and method of manufacturing the same |
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US10973491B2 (en) * | 2015-06-12 | 2021-04-13 | Koninklijke Philips N.V. | Interconnects for intravascular ultrasound (IVUS) devices |
EP3641062A1 (en) * | 2018-10-17 | 2020-04-22 | Koninklijke Philips N.V. | Electric component of an interventional medical device |
CN117062308A (zh) * | 2023-10-12 | 2023-11-14 | 北京脑科学与类脑研究所 | 一种神经界面焊盘及神经界面焊接方法 |
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US3899362A (en) | 1973-10-30 | 1975-08-12 | Gen Electric | Thermomigration of metal-rich liquid wires through semiconductor materials |
DE2827640A1 (de) | 1978-06-23 | 1980-01-10 | Chuo Meiban Mfg Co | Verfahren zur befestigung von leitungsdraehten von bauteilen an einer grundplatte fuer eine gedruckte schaltung und grundplatte zur durchfuehrung des verfahrens |
JPS5846472U (ja) * | 1981-09-24 | 1983-03-29 | 日本電気株式会社 | プリント配線基板 |
JPS6074595A (ja) * | 1983-09-30 | 1985-04-26 | パイオニア株式会社 | 電気回路プリント基板 |
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US5447871A (en) | 1993-03-05 | 1995-09-05 | Goldstein; Edward F. | Electrically conductive interconnection through a body of semiconductor material |
JP3487524B2 (ja) * | 1994-12-20 | 2004-01-19 | 株式会社ルネサステクノロジ | 半導体装置及びその製造方法 |
CN1192427C (zh) * | 1999-08-25 | 2005-03-09 | 因芬尼昂技术股份公司 | 制造具有至少一个金属化平面的集成电路的方法 |
US6343940B1 (en) * | 2000-06-19 | 2002-02-05 | Advantest Corp | Contact structure and assembly mechanism thereof |
FI119215B (fi) * | 2002-01-31 | 2008-08-29 | Imbera Electronics Oy | Menetelmä komponentin upottamiseksi alustaan ja elektroniikkamoduuli |
JPWO2006070652A1 (ja) * | 2004-12-27 | 2008-06-12 | 日本電気株式会社 | 半導体装置およびその製造方法と、配線基板およびその製造方法と、半導体パッケージ並びに電子機器 |
JP2006253330A (ja) * | 2005-03-09 | 2006-09-21 | Sharp Corp | 半導体装置およびその製造方法 |
US7176452B2 (en) | 2005-04-15 | 2007-02-13 | The Board Of Trustees Of The Leland Stanford Junior University | Microfabricated beam modulation device |
US7307348B2 (en) | 2005-12-07 | 2007-12-11 | Micron Technology, Inc. | Semiconductor components having through wire interconnects (TWI) |
US7659612B2 (en) * | 2006-04-24 | 2010-02-09 | Micron Technology, Inc. | Semiconductor components having encapsulated through wire interconnects (TWI) |
JP4760621B2 (ja) * | 2006-09-01 | 2011-08-31 | セイコーエプソン株式会社 | テープ回路基板の製造方法、及びテープ回路基板 |
JP2008099036A (ja) * | 2006-10-12 | 2008-04-24 | Olympus Medical Systems Corp | 超音波トランスデューサ、超音波探触子及び超音波診断装置 |
US7364461B1 (en) * | 2007-02-28 | 2008-04-29 | Sv Probe Pte. Ltd. | Direct attachment of coaxial cables |
JP4483896B2 (ja) * | 2007-05-16 | 2010-06-16 | ソニー株式会社 | 半導体装置及びその製造方法 |
TW200926376A (en) | 2007-05-21 | 2009-06-16 | Tae-Seok Park | Wafer level chip scale package of an image sensor by means of through hole interconnection and method for manufacturing the same |
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