PT95434A - Processo de producao de uma pelicula depositada metalica contendo aluminio como componente principal por meio de hidreto de alquilaluminio - Google Patents

Processo de producao de uma pelicula depositada metalica contendo aluminio como componente principal por meio de hidreto de alquilaluminio

Info

Publication number
PT95434A
PT95434A PT95434A PT9543490A PT95434A PT 95434 A PT95434 A PT 95434A PT 95434 A PT95434 A PT 95434A PT 9543490 A PT9543490 A PT 9543490A PT 95434 A PT95434 A PT 95434A
Authority
PT
Portugal
Prior art keywords
deposited film
alkylumuminum
hall
main component
production process
Prior art date
Application number
PT95434A
Other languages
English (en)
Other versions
PT95434B (pt
Inventor
Hitoshi Shindo
Takeshi Ichikawa
Osamu Ikeda
Kazuaki Ohmi
Shigeyuki Matsumoto
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25001189A external-priority patent/JP2670151B2/ja
Priority claimed from JP1250013A external-priority patent/JP2801285B2/ja
Priority claimed from JP1250012A external-priority patent/JP2721013B2/ja
Priority claimed from JP25001489A external-priority patent/JP2670152B2/ja
Application filed by Canon Kk filed Critical Canon Kk
Publication of PT95434A publication Critical patent/PT95434A/pt
Publication of PT95434B publication Critical patent/PT95434B/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H01L21/28562—Selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)
PT95434A 1989-09-26 1990-09-26 Processo de producao de uma pelicula depositada metalica contendo aluminio como componente principal por meio de hidreto de alquilaluminio PT95434B (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP25001189A JP2670151B2 (ja) 1989-09-26 1989-09-26 堆積膜形成法
JP1250013A JP2801285B2 (ja) 1989-09-26 1989-09-26 堆積膜形成法
JP1250012A JP2721013B2 (ja) 1989-09-26 1989-09-26 堆積膜形成法
JP25001489A JP2670152B2 (ja) 1989-09-26 1989-09-26 堆積膜形成法

Publications (2)

Publication Number Publication Date
PT95434A true PT95434A (pt) 1991-05-22
PT95434B PT95434B (pt) 1997-07-31

Family

ID=27478182

Family Applications (1)

Application Number Title Priority Date Filing Date
PT95434A PT95434B (pt) 1989-09-26 1990-09-26 Processo de producao de uma pelicula depositada metalica contendo aluminio como componente principal por meio de hidreto de alquilaluminio

Country Status (8)

Country Link
US (1) US5154949A (pt)
EP (1) EP0420594B1 (pt)
KR (1) KR940007075B1 (pt)
AT (1) ATE137063T1 (pt)
DE (1) DE69026566T2 (pt)
MY (1) MY107403A (pt)
PT (1) PT95434B (pt)
SG (1) SG43924A1 (pt)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2721023B2 (ja) * 1989-09-26 1998-03-04 キヤノン株式会社 堆積膜形成法
ATE139866T1 (de) * 1990-02-19 1996-07-15 Canon Kk Verfahren zum herstellen von abgeschiedener metallschicht, die aluminium als hauptkomponente enthält, mit anwendung von alkylaluminiumhydrid
DE69125210T2 (de) * 1990-05-31 1997-08-07 Canon Kk Verfahren zur Herstellung einer Halbleitervorrichtung mit einer Verdrahtungsstruktur hoher Dichte
JP2895166B2 (ja) * 1990-05-31 1999-05-24 キヤノン株式会社 半導体装置の製造方法
DE69123175T2 (de) * 1990-05-31 1997-04-03 Canon Kk Verfahren zur Verdrahtung einer Halbleiterschaltung
MY107475A (en) * 1990-05-31 1995-12-30 Canon Kk Semiconductor device and method for producing the same.
JP2974376B2 (ja) * 1990-06-01 1999-11-10 キヤノン株式会社 半導体装置の製造方法
EP0498580A1 (en) * 1991-02-04 1992-08-12 Canon Kabushiki Kaisha Method for depositing a metal film containing aluminium by use of alkylaluminium halide
JPH0521385A (ja) * 1991-07-10 1993-01-29 Nippon Steel Corp アルミニウム合金薄膜の製造方法
US5627345A (en) * 1991-10-24 1997-05-06 Kawasaki Steel Corporation Multilevel interconnect structure
US5447568A (en) * 1991-12-26 1995-09-05 Canon Kabushiki Kaisha Chemical vapor deposition method and apparatus making use of liquid starting material
US6004885A (en) * 1991-12-26 1999-12-21 Canon Kabushiki Kaisha Thin film formation on semiconductor wafer
US5580808A (en) * 1992-07-30 1996-12-03 Canon Kabushiki Kaisha Method of manufacturing a ROM device having contact holes treated with hydrogen atoms and energy beam
US5403620A (en) * 1992-10-13 1995-04-04 Regents Of The University Of California Catalysis in organometallic CVD of thin metal films
US5358901A (en) * 1993-03-01 1994-10-25 Motorola, Inc. Process for forming an intermetallic layer
US5654245A (en) * 1993-03-23 1997-08-05 Sharp Microelectronics Technology, Inc. Implantation of nucleating species for selective metallization and products thereof
JPH0710935U (ja) * 1993-07-24 1995-02-14 ヤマハ株式会社 縦型熱処理炉
JPH07159974A (ja) * 1993-12-09 1995-06-23 Ryoden Semiconductor Syst Eng Kk パターン転写マスクおよびその製造方法
US5650198A (en) * 1995-08-18 1997-07-22 The Regents Of The University Of California Defect reduction in the growth of group III nitrides
US6077571A (en) * 1995-12-19 2000-06-20 The Research Foundation Of State University Of New York Conformal pure and doped aluminum coatings and a methodology and apparatus for their preparation
US6040613A (en) * 1996-01-19 2000-03-21 Micron Technology, Inc. Antireflective coating and wiring line stack
JP3695606B2 (ja) * 1996-04-01 2005-09-14 忠弘 大見 半導体装置及びその製造方法
US8053274B2 (en) * 2008-09-30 2011-11-08 Stion Corporation Self cleaning large scale method and furnace system for selenization of thin film photovoltaic materials
US9145612B2 (en) 2012-07-06 2015-09-29 Applied Materials, Inc. Deposition of N-metal films comprising aluminum alloys

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2559030B2 (ja) * 1986-07-25 1996-11-27 日本電信電話株式会社 金属薄膜の製造方法
JPH01252776A (ja) * 1988-03-31 1989-10-09 Sony Corp 気相成長アルミニウム膜形成方法
JP2570839B2 (ja) * 1988-12-22 1997-01-16 日本電気株式会社 Ａ▲ｌ▼ーＣｕ合金薄膜形成方法
JPH02185026A (ja) * 1989-01-11 1990-07-19 Nec Corp Ａｌ薄膜の選択的形成方法

Also Published As

Publication number Publication date
PT95434B (pt) 1997-07-31
EP0420594A2 (en) 1991-04-03
EP0420594A3 (en) 1991-08-28
KR940007075B1 (ko) 1994-08-04
ATE137063T1 (de) 1996-05-15
DE69026566D1 (de) 1996-05-23
MY107403A (en) 1995-11-30
KR910007093A (ko) 1991-04-30
EP0420594B1 (en) 1996-04-17
SG43924A1 (en) 1997-11-14
DE69026566T2 (de) 1996-11-14
US5154949A (en) 1992-10-13

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Legal Events

Date Code Title Description
BB1A Laying open of patent application

Effective date: 19910128

FG3A Patent granted, date of granting

Effective date: 19970423

MM3A Annulment or lapse

Free format text: LAPSE DUE TO NON-PAYMENT OF FEES

Effective date: 20041025